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EPL/47 - Semiconductors

Sector: Manufacturing

Categories: Electric furnaces | Character symbols | Electrical equipment. Special conditions. Other | Optical equipment | Multimedia systems and teleconferencing equipment | Motors | Electricity. Magnetism. Other | Electronic component assemblies | Protective equipment. Head | Components. Magnetic | Electroacoustics | Coaxial cables. Waveguides | Characteristics and design of machines, apparatus, equipment | Semiconductor devices. Other | Networking | Wind turbine energy systems | Optoelectronics. Laser equipment | Fuses. Overcurrent protection devices | Electronics | Television and radio broadcasting | Fuel cells | Drawings. Electrical and electronics engineering | Resistors. Other | Machine tools | Measurement. Electrical and magnetic | Application layer | Noise. Machines and equipment | Relays | Emission | Ceramics. Products | Lighting, signalling and warning devices | Fibre optic systems. General | Measurement. Optics and optical. Other | Graphical symbols. Specific equipment | IT terminal and other peripheral equipment | Piezoelectric devices | Medical equipment. Diagnostic | Electric road vehicles | Certification. Conformity assessment | Earth-moving machinery | Lamps. Other | Machine tool systems | Diodes | Magnetic materials | Cells and batteries. Other | Transformers. Reactors | Measurement. Optics and optical | Machine tools. Other | Printed circuits and boards | Volumetric equipment and measurements | Technical product documentation | Radiation protection | Fibres and cables | Mathematics | Ergonomics | Medical equipment. Radiographic | Optical storage devices | Fibre optic interconnecting devices | Audio, video and audiovisual equipment. Other | Electric tools | Semiconductor devices | Measurement. Electrical and magnetic quantities | Power transmission and distribution networks. Other equipment | Power transmission and distribution lines | Heaters. Electric | Electronic tubes | Ignitability and burning behaviour. Materials and products | Open systems interconnection. General | Audio systems | Nuclear power plants. Safety | Electricity supply | Multilayer applications | Industrial automation systems | Electric shock protection. Live working | Aids. Deaf and hearing impaired people | Power transmission and distribution networks | Electrical accessories. Other | Ventilators. Fans. Air-conditioners | Insulating materials. General | Electrical equipment. Special conditions. General | Switchgear and controlgear. General | Quality. General | Industrial automation systems. General | Electronic components. General | Substations. Surge arresters | Materials handling equipment | Shafts and couplings | Conduits | Switchgear and controlgear. Low voltage | Wires. Symmetrical cables | Information technology. Languages | Rectifiers. Converters. Stabilized power supply | Capacitors. Fixed | Lubrication systems | Semiconducting materials | Thyristors | Telecontrol. Telemetering | Semiconductor devices. General | Electronic display devices | Lamps. Incandescent | Integrated circuits. Microelectronics | Railway rolling stock | Power transmission and distribution networks. General | Mechanical structures for electronic equipment | Drawings. Mechanical engineering | Radiographic films | Hydraulic energy engineering | Testing. Environmental | Graphical symbols for use on electrical and electronics engineering drawings, diagrams, charts and in relevant technical product documentation | Aerospace electric equipment and systems | Quantities and units | IT applications. Industry | Solar energy engineering | Transport layer | Graphical symbols. Other | Petroleum products. General | Testing. Electrical and electronic | Document imaging applications | Navigation and control equipment | Industrial process measurement and control | Transistors | Lead, zinc and tin products | Immunity | Safety. Machinery | Railway rolling stock. General | Industrial automation systems. Other | Electrical engineering. General | Electrical equipment. Special conditions

Overview: Under the direction of the Standards Policy and Strategy Committee, EP/47 is responsible for the UK input to the work of IEC/TC 47 Semiconductor devices, IEC/TC47/SC 47A Integrated circuits, IEC/TC 47/SC 47E Discrete semiconductor devices, CLC/SR 47 Semiconductor devices, CLC/SR 47A Integrated circuits, CLC/SR 47D Mechanical standardization of semiconductor devices, CLC/SR 47E Discrete semiconductor devices, CLC/SR 47F Micro-electromechanical systems, and CLC/TC 47X Semiconductor devices and trusted chips. The UK, via EPL/47, has Observer status in IEC/TC47/SC47 D Semiconductor devices packaging. The UK does not participate in IEC/TC 47/SC 47F Micro-electromechanical systems.

Committee standards activity

In Progress (211)
Reference Standards description
Status ?

The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.

PNW TS 47D-962 ED1: Part model guideline for electronic-device packages - XML requirements

Categories: Information management | Standardization. General rules

Proposal begins : 2024-02-14
Proposal
PNW 47F-515 ED1: Micro-electromechanical systems-Part 60: Test methods for sensing performances of MEMS resonant electric-field-sensitive devices

Categories: Information management | Standardization. General rules

Proposal begins : 2025-06-23
Proposal
PNW 47F-514 ED1: Micro-electromechanical systems-Part 59: Test methods for performances of MEMS multi-orifice balanced differential pressure flowmeter

Categories: Information management | Standardization. General rules

Proposal begins : 2025-06-12
Proposal
PNW 47F-513 ED1: Micro-electromechanical systems-Part 58: Test methods for performances of MEMS thermopile devices

Categories: Information management | Standardization. General rules

Proposal begins : 2025-06-12
Proposal
PNW 47F-513 ED1: Micro-electromechanical systems-Part 58: Test methods for performances of MEMS thermopile devices

Categories: Information management | Standardization. General rules

Proposal begins : 2025-06-12
Proposal
PNW 47F-512 ED1: Micro-electromechanical systems-Part 57: RF MEMS Directional Coupler

Categories: Information management | Standardization. General rules

Proposal begins : 2025-05-23
Proposal
PNW 47F-510 ED1: Semiconductor devices - Micro-electromechanical devices - Part 57: RF MEMS Directional Coupler

Categories: Information management | Standardization. General rules

Proposal begins : 2025-04-21
Proposal
PNW 47F-488 ED1 Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor

Categories: Information management | Standardization. General rules

Proposal begins : 2024-11-14
Proposal
PNW 47F-469 ED1: PNW 47F-469 ED1: Micro-electromechanical devices - Part 55: Silicon based MEMS fabrication technology - Test method of microstructure pendulum impact

Categories: Information management | Standardization. General rules

Proposal begins : 2024-04-15
Proposal
PNW 47F-461 ED1: Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device

Categories: Information management | Standardization. General rules

Proposal begins : 2024-01-22
Proposal
Published (280)
Reference Standards description
Status ?

The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.

PD IEC/TS 62132-9:2014 Integrated circuits. Measurement of electromagnetic immunity. Measurement of radiated immunity. Surface scan method

Categories: Integrated circuits. Microelectronics

Published standard begins : 2014-09-10
Published standard
PD IEC/TS 61967-3:2014 Integrated circuits. Measurement of electromagnetic emissions. Measurement of radiated emissions. Surface scan method

Categories: Integrated circuits. Microelectronics

Published standard begins : 2014-09-11
Published standard
PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices

Categories: Semiconductor devices. General

Published standard begins : 2018-01-29
Published standard
PD IEC/TR 62433-2-1:2010 EMC IC modelling. Theory of black box modelling for conducted emission

Categories: Integrated circuits. Microelectronics

Published standard begins : 2011-02-17
Published standard
PD IEC/TR 62258-8:2008 Semiconductor die products. EXPRESS model schema for data exchange

Categories: Semiconductor devices. Other

Published standard begins : 2009-07-08
Published standard
PD IEC/TR 62258-7:2007 Semiconductor die products. XML schema for data exchange

Categories: Semiconductor devices. Other

Published standard begins : 2007-11-07
Published standard
PD IEC/TR 61967-4-1:2005 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz. Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4

Categories: Integrated circuits. Microelectronics

Published standard begins : 2006-01-31
Published standard
PD IEC/TR 61967-1-1:2015 Integrated circuits. Measurement of electromagnetic emissions. General conditions and definitions. Near-field scan data exchange format

Categories: Integrated circuits. Microelectronics

Published standard begins : 2015-09-14
Published standard
PD IEC TS 60747-19-2:2021 Semiconductor devices. Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation

Categories: Semiconductor devices. Other

Published standard begins : 2021-07-02
Published standard
PD IEC TR 63571:2025 Semiconductor devices. Estimation method for lifetime conversion from “PART” to “SYSTEM”

Categories: Semiconductor devices. Other

Published standard begins : 2025-05-16
Published standard
Withdrawn (112)
Reference Standards description
Status ?

The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.

PD IEC/TR 62258-3:2005 Semiconductor die products. Recommendations for good practice in handling, packing and storage

Categories: Semiconductor devices. Other

Withdrawn begins : 2008-05-07
Withdrawn
PD IEC/TR 61967-1-1:2010 Integrated circuits. Measurement of electromagnetic emissions. General conditions and definitions. Near-field scan data exchange format

Categories: Integrated circuits. Microelectronics

Withdrawn begins : 2015-09-14
Withdrawn
PD IEC TR 62977-1-31:2021 Electronic displays. Generic. Practical information on the use of light measuring devices

Categories: Electronic display devices | Optoelectronics. Laser equipment

Withdrawn begins : 2023-04-19
Withdrawn
PD IEC TR 62380:2004 Reliability data handbook. Universal model for reliability prediction of electronics components, PCBs and equipment

Categories: Characteristics and design of machines, apparatus, equipment | Semiconductor devices. General

Withdrawn begins : 2024-10-23
Withdrawn
IEC PAS 62050:2004 IEC/PAS62050 : 2004 Board level drop test method of components for handheld electronic products

Categories: Semiconductor devices. General

Withdrawn begins : 2008-02-04
Withdrawn
DD IEC/TS 62433-1:2011 EMC IC modelling. General modelling framework

Categories: Integrated circuits. Microelectronics

Withdrawn begins : 2019-05-03
Withdrawn
DD IEC/TS 62228:2007 Integrated circuits. EMC evaluation of CAN transceivers

Categories: Integrated circuits. Microelectronics

Withdrawn begins : 2019-05-08
Withdrawn
DD IEC/TS 61967-3:2005 Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz. Measurement of radiated emissions. Surface scan method

Categories: Integrated circuits. Microelectronics

Withdrawn begins : 2014-09-11
Withdrawn
DD IEC/PAS 62483:2006 Test method for measuring whisker growth on tin and tin alloy surface finishes

Categories: Semiconductor devices. General

Withdrawn begins : 2013-10-04
Withdrawn
DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation

Categories: Semiconductor devices. Other

Withdrawn begins : 2020-11-10
Withdrawn