If you have difficulty in submitting comments on draft standards you can use a commenting template and email it to admin.start@bsigroup.com. The commenting template can be found here.
Standards Development
This part of IEC 62047 specifies a test method for evaluating the change in electrical resistance of hybrid MEMS materials under combined tensile and torsional deformation. Hybrid MEMS materials are composed of rigid and soft components integrated into mechanically deformable electronic devices incorporating such materials. In practical use, such devices are exposed to simultaneous stretching and twisting, especially when mounted on curved or moving surfaces. These combined deformations are not sufficiently addressed by existing test methods based solely on uniaxial tension or torsion.
This document applies to hybrid MEMS materials used in flexible sensors, stretchable circuit assemblies, and conformal electronic devices. The test evaluates electrical resistance change under concurrent axial and angular strain, and provides a basis for determining electrical transition and failure points as indicators of material or interconnect durability. The method supports the optimization of interconnect geometries and substrate design under complex mechanical loading. It is recommended for use on test specimens with thicknesses in the range of micrometers to millimeters, reflecting the variation in dimensional scale encountered in practical applications
The purpose of this proposal is to establish an international standard test method for evaluating the electrical resistance behavior of hybrid mems materials under combined tensile and torsional deformation. Hybrid mems materials, which integrate rigid and soft components, are increasingly used in flexible sensors, stretchable circuit assemblies, and conformal electronic devices. In real-world applications, such devices are often subjected to comp lex deformations involving simultaneous stretching and twisting, especially when mounted on curved or moving surfaces.
Current international standards mainly address mechanical or electrical reliability under uniaxial tension or torsion only, which do not sufficiently capture the coupled effects of combined deformation. This gap in standardization hinders reproducibility o f test results, prevents consistent benchmarking, and poses challenges for industrial adoption and certification.
This standard will enable quantitative assessment of electrical performance (transition points, failure thresholds) under realistic deformation modes and support the optimization of interconnect design and substrate structures to enhance durability and performance.
You are now following this standard. Weekly digest emails will be sent to update you on the following activities:
You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.
You have successfully unsubscribed from weekly updates for this standard.
Comment on proposal
Required form fields are indicated by an asterisk (*) character.