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Mechanical standardization of semiconductor devices. Dimensions
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
GRAFCET specification language for sequential function charts
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
BSEN60191-6-2 : 2002 Mechanical standardization of semiconductor devices. Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages- Unit design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Standards Development