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PNW 47F-537 ED1: Micro-electromechanical systems - Part 63: Tensile test of shape-memory MEMS materials under elevated temperature

Source:
IEC
Committee:
EPL/47 - Semiconductors
Categories:
Information management | Standardization. General rules
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Scope

This part of IEC 62047 specifies a test method for evaluating the shape -memory performance of MEMS materials under combined mechanical loading and temperature variation. The evaluated parameters include strain fixity ratio, strain recovery ratio, recovery time, and the strain recovery cycle. These parameters can be used to assess and compare the performance of various shape-memory MEMS devices depending on their intended applications. Typical shape-memory MEMS materials include metallic alloys and polymeric materials exhibiting phase transformation behavior at device operating temperatures. The test piece is dogbone - shaped with a thickness ranging from 10 μm to 1 mm, corresponding to that of actual devices. As the shape-memory effect of these materials is activated by elevated temperature, the test shall be performed under controlled

Purpose

In various consumer, semiconductor, and MEMS devices, shape -memory materials are often used as substrate or structural components to improve functional adaptability. The operational performance of such devices is significantly influenced by the shape -memory characteristics of the materials under varying temperature conditions. Therefore, it is necessary to evaluate the performance of shape-memory MEMS materials under combined mechanical and thermal loading. This part of IEC 62047 provides a standardized met hod for assessing the shape- memory performance of these materials under controlled temperature profiles.

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