Scope
This proposal addresses the need for electronic data and secure/trusted information exchange needed by the semiconductor design community. This document describes XML data exchange structure and hierarchy. The document details data exchange between companies/software for the design level, analysis and interconnection a well as enabling signing of e-data sheets. The objective is to specify data structure and hierarchy or schema for the data to be exchanged. The target audiences are designers of components, packages, system solutions manufacturers and analysts.
Purpose
This document, standard or technical report is intended to benefit part manufacturers and their customers by providing consistency and efficiency to the transfer of part data from part manufacturer to customers. It establishes standard electronic data exchange formats that will facilitate and improve data transfer along the entire global supply chain, at every stage in the product life cycle. A key aspect therefore is the structure of the content that is contained in this format, which the committee believes should be based on the following two principals:
1) Data that is required to be consumed by software tools
2) Data that is not required to be consumed by software tools, but is provided for informational purposes or for regulatory reporting.
Comment on proposal
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