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Standards Development is a service provided by BSI Group
Test methods for electrical materials, printed board and other interconnection structures and assemblies. Thermal resistance of an assembly by thermal transient method
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. X/Y CTE test for thin base materials by TMA
Wearable electronic devices and technologies. Test method of electrochromic films for wearable equipment
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies. Detection of defects in interconnection structures by measurement of capacitance
Printed electronics. Materials. Conductive ink. Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
Wearable electronic devices and technologies. Performance measurement of fitness wearables. Step counting
Device embedding assembly technology. Part 2-10: Design specification for cavity substrate
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Standards Development