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ED2 Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications. Part 4: Sectional specification - Printed board connectors
Feedback closing date:
14/10/2026
ED3 Capacitors for power electronics
11/11/2026
Test method for electrical materials, circuit board and other interconnection structures and assemblies. Part 2-722: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
07/10/2026
ISO 10110-9 Optics and photonics. Preparation of drawings for optical elements and systems. Part 9: Surface treatment and coating
17/10/2026
Wearable electronic devices and technologies. Test method of surface electromyography sensors on forearm and hand for wearable applications
Semiconductor devices. Generic semiconductor qualification guidelines. Guidelines for reliability qualification plans for power semiconductor module
Design for recycling guidelines for styrenics and polyolefins products and parts in electrical and electronic equipment, with focus on ABS, PP and PS
Electromagnetic compatibility (EMC). Part 4-29: Testing and measurement techniques - Voltage dips, short interruptions and voltage variations on d.c. input power port immunity tests
Integrated circuits. EMC evaluation of transceivers. CXPI transceivers
Connectors for electrical and electronic equipment. Product requirements. Power connectors. Detail specification for 2P 300 A 1 000 V plus 2P 5 A 50 V DC shielded rectangular connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated
Optics and photonics. Lasers and laser-related equipment. Test method for absorptance of optical laser components
Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)
Standards Development