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BS EN 61760-4 ED2 Surface mounting technology. Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Feedback closing date:
13/11/2024
BS EN 60444-11 ED2 Measurement of quartz crystal unit parameters -. Part 11: Standard method for the determination of the load resonance frequency fL and the effective load capacitance CLeff using automatic network analyzer techniques and error correction
06/11/2024
Guidelines for Representing Switching
27/11/2024
Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion (Fast track)
BS EN 60115-2-10:2024 Fixed resistors for use in electronic equipment. general electronic equipment, classification level G
EN 60115-4:2024 Fixed resistors for use in electronic equipment. Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Thermal standardization on semiconductor packages. 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Process management for avionics. Counterfeit prevention. Avoiding the use of counterfeit, fraudulent and recycled electronic components
Organic light emitting diode (OLED) display. Measuring methods of optical characteristics for display with under-screen feature
Semiconductor devices. Optoelectronic devices. Light emitting diodes. Test method of the surface temperature based on the thermoreflectance method
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed capacitors of ceramic dielectric, Class 2
Fixed capacitors for use in electronic equipment. Sectional specification. Fixed capacitors of ceramic dielectric, Class 1
Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures
Flexible displays. Overview of measurement and application scenarios of stretchable displays