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Engineering > Electronics

Electronics

Electronics Sub-categories (14)

  1. Electronic components. General
  2. Resistors
  3. Capacitors
  4. Semiconductor devices
  5. Electronic tubes
  6. Electronic display devices
  7. Piezoelectric devices
  8. Electric filters
  9. Printed circuits and boards
  10. Electronic component assemblies
  11. Integrated circuits. Microelectronics
  12. Electromechanical components. Electronic and telecommunications equipment
  13. Mechanical structures for electronic equipment
  14. Optoelectronics. Laser equipment

Latest standards activities

Proposals
Drafts

BS EN 61076-1 Ed.3.0

Connectors for electronic equipment - Product requirements. Part 1: Generic specification

Feedback closing date:

30/04/2025

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BS EN 63378-6-1 Ed.1.0

Thermal standardization on semiconductor packages. Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

Feedback closing date:

30/04/2025

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BS EN 61076-3 Ed.3.0

Connectors for electronic equipment - Product requirements. Part 3: Rectangular connectors - Sectional specification

Feedback closing date:

30/04/2025

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BS EN 61582 Ed.2.0

Radiation protection instrumentation - Portable, transportable or installed equipment for in vivo measurement of photon emitting radionuclides

Feedback closing date:

30/04/2025

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BS EN ISO 11145

ISO 11145 Optics and photonics. Lasers and laser-related equipment. Vocabulary and symbols

Feedback closing date:

27/05/2025

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BS EN 63378-4 Ed.1.0

Thermal standardization on semiconductor packages. Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

Feedback closing date:

23/04/2025

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BS EN IEC 60747-5-13/AMD1 ED1

BS EN 60747-5-13/AMD1 ED1 Amendment 1 - Semiconductor devices. Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test forLED packages

Feedback closing date:

23/04/2025

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Feedback period expiring

BS EN IEC 60747-5-13/AMD1 ED1

BS EN 60747-5-13/AMD1 ED1 Amendment 1 - Semiconductor devices. Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test forLED packages

Feedback closing date:

23/04/2025

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BS EN 63378-4 Ed.1.0

Thermal standardization on semiconductor packages. Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

Feedback closing date:

23/04/2025

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Published

BS EN IEC 62878-2-603:2025

Device embedding assembly technology. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

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BS EN IEC 63203-204-2:2025

Wearable electronic devices and technologies. Electronic textile. Test method to characterize electrical resistance change in knee and elbow bending test of e-textiles

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BS EN IEC 62391-2:2025

Fixed electric double-layer capacitors for use in electronic equipment. Sectional specification. Electric double-layer capacitors for power application

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BS IEC 63211-2-23:2025

Durability test methods for electronic displays. Environmental tests. Outdoor weathering

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BS IEC 62047-45:2025

Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures

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BS IEC 62908-42-10:2025

Touch and interactive displays. Measurement methods of motion-tracking image-control response time for interactive projection display

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BS EN IEC 61558-2-4:2025

Safety of transformers, reactors, power supply units and combinations thereof. Particular requirements and tests for isolating transformers and power supply units incorporating isolating transformers for general applications

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PD IEC TR 62899-250:2025

Printed electronics. Material technologies required in printed electronics for wearable smart devices

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