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BS EN 61189-3-720 ED1 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3-720: Test methods for interconnection structures (circuit boards)
Feedback closing date:
05/02/2025
BS EN 62899-202-14 ED1 Printed electronics. Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
31/01/2025
BS EN 60749-22-1 ED1 Semiconductor devices - Mechanical and climatic test methods. Part 22-1: Bond strength - wire bond pull test methods
06/02/2025
BS EN 60749-22-2 ED1 Semiconductor devices - Mechanical and climatic test methods. Part 22-2: Bond strength - Wire bond shear test methods
Semiconductor devices - Mechanical and climatic test methods. Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
22/01/2025
Electronic displays for special applications. General introduction
Connectors for electrical and electronic equipment. Product requirements. Circular connectors. Detail specification for M12 connectors with screw-locking
Semiconductor devices. Optoelectronic devices. Semiconductor lasers
Low-voltage switchgear and controlgear. Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
Safety of laser products. Laser guards
Series capacitors for power systems. Protective equipment for series capacitor banks
Flexible displays devices. Mechanical test methods. Mechanical misaligned folding test method
Solderless connections. Crimped connections. General requirements, test methods and practical guidance