British Standards Institution

Source:: IEC
Committee:: EPL/501 - Electronic Assembly Technology
Categories:: Electronic component assemblies
Comment period start date:: 05/08/2025
Comment period end date:: 27/08/2025
Number of comments:: 0

Comment by:

27th Aug

Scope

This standard specifies a process profile design method used for setting power profile in laser assisted bonding (LAB). This method is applicable to many areas such as LED bonding, solar cell bonding, flip chip bonding, and hermetic sealing of MEMS components.

The process is based on the principle that when a laser is irradiated to a device, some of it is absorbed in the form of heat energy, and the temperature of the joint increases to the melting point due to heat conduction.

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

03/11/2025

3. Public Comments

Public Comments start date:

05/08/2025

Public Comments end date:

27/08/2025

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Standards Development

BS EN 61191-10-2 ED1 Circuit board assemblies. Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding

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