British Standards Institution - Committee

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EPL/501 - Electronic Assembly Technology

Sector: Manufacturing

Categories: Electrical equipment. Special conditions. Other | Information technology applications. General | Non-ferrous metals. General | Wires | Data communication networks | Electricity. Magnetism. Other | Electronic component assemblies | Cells and batteries. Alkaline secondary | Chemical laboratories. Equipment | Switchgear and controlgear. High voltage | Networking | Wind turbine energy systems | Optoelectronics. Laser equipment | Cables | Fuses. Overcurrent protection devices | Electronics | Domestic and commercial equipment. Miscellaneous | IT applications. Information, documentation and publishing | Noise. Machines and equipment | | Sacks. Bags | Fibre optic systems. General | Information technology applications | | Electrical apparatus. Explosive atmospheres | Electrical and electronic equipment | Production. Production management | Insulating materials. Paper and board | Insulating oils | Steels. Flat | Resistors. Fixed | Switches | Printed circuits and boards | Insulation | Inks | Information coding. Character sets | Fibres and cables | Optical storage devices | Doors. Windows | Railway engineering. General | Audio, video and audiovisual equipment. Other | Office machines | | Welding. Consumables | Power transmission and distribution lines | Ignitability and burning behaviour. Materials and products | Open systems interconnection. General | Brazing and soldering | Audio, video and audiovisual systems. General | Multilayer applications | Industrial automation systems | Pressure regulators | Electric shock protection. Live working | Measurement. Radiation | Environmental protection | Insulating materials. General | Quality. Other | Cooking ranges, working tables, ovens and similar appliances | Industrial automation systems. General | Optic amplifiers | Electronic components. General | Nuclear energy. General | Switchgear and controlgear. Low voltage | Electromechanical components. Electronic and telecommunications equipment | Wires. Symmetrical cables | Information technology. Languages | Semiconducting materials | Information technology. General | Telecontrol. Telemetering | Semiconductor devices. General | Electronic display devices | Integrated circuits. Microelectronics | Fibre optic equipment. Other | Mechanical structures for electronic equipment | Testing. Environmental | Electromechanical components. General | Microprocessor systems | Aerospace electric equipment and systems | IT applications. Industry | Medical equipment. General | Lamps. Fluorescent and discharge | Plug-and-socket devices. Connectors | Insulators | Safety. Domestic | Solar energy engineering | Transport layer | Rotating machinery. General | Lead, zinc, tin and their alloys | Testing. Electrical and electronic | Software | Metal testing. Chemical analysis | Non-ferrous metals | Industrial process measurement and control | Transistors | Small kitchen appliances | Lead, zinc and tin products | Electrical engineering | Immunity | Spools. Bobbins | Railway rolling stock. General | Industrial automation systems. Other | Electrical engineering. General

Overview: Under the direction of the Standards Policy and Strategy Committee, is responsible for the UK input to the work of IEC/TC 91 and ISO/TC 44/SC 12.

Committee standards activity

In Progress (47)

Show entries

Reference	Standards description	Status ? The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.
PNW 91-1972 ED1	Transmission loss test method for high frequency multilayer circuit boards Categories: Information management \| Standardization. General rules Proposal begins : 2024-08-19	Proposal
PNW 91-1940 ED1	Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards Categories: Information management \| Standardization. General rules Proposal begins : 2024-03-06	Proposal
PNW 91-1939 ED1	Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant Categories: Information management \| Standardization. General rules Proposal begins : 2024-03-06	Proposal
PNW 91-1938 ED1	Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites Categories: Information management \| Standardization. General rules Proposal begins : 2024-03-05	Proposal
PNW 91-1931 ED1:	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-XXX: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards Categories: Information management \| Standardization. General rules Proposal begins : 2024-01-29	Proposal
PNW 91-1918 ED1:	High-Level Test Description Table for Development of Production Test Programs Categories: Information management \| Standardization. General rules \| Testing \| Testing. Electrical and electronic \| Engineering \| Electronics \| Electronic component assemblies Proposal begins : 2023-12-11	Proposal
PNW 91-1848 ED1:	Fixed folding Durability test method for flexible opto-electric circuit boards Categories: Information management \| Standardization. General rules \| Engineering \| Electronics \| Printed circuits and boards Proposal begins : 2023-03-24	Proposal
PNW 91-1848 ED1 PNW 91-1848 ED1:	Fixed folding Durability test method for flexible opto-electric circuit boards Categories: Information management \| Standardization. General rules \| Engineering \| Electronics \| Printed circuits and boards \| Optoelectronics. Laser equipment Proposal begins : 2023-03-13	Proposal
PNW 91-1797 ED1:	Environmental testing - Part 2-xx: Tests Test XD: Resistance of components and assemblies to cleaning solvents Categories: Information management \| Standardization. General rules \| Measurement and Science \| Testing \| Testing. Environmental Proposal begins : 2022-06-30	Proposal
ISO/TC 44/SC 12 N 758, ISO/NP 9455-18	Soft soldering fluxes -- Test methods -- Part 18: Part 18: Test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning Categories: Information management \| Standardization. General rules \| Engineering \| Electronics \| Printed circuits and boards \| Electronic component assemblies Proposal begins : 2021-07-02	Proposal

Published (241)

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Reference	Standards description	Status ? The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.
PD R217-016:2000, CENELEC Report R217-016:1999	Pinnacles component information standard 1.2. PCIS sample documents Categories: IT applications. Industry Published standard begins : 2000-04-11	Published standard
PD IEC/TS 62878-2-4:2015	Device embedded substrate. Guidelines. Test element groups (TEG) Categories: Printed circuits and boards \| Electronic component assemblies Published standard begins : 2015-04-13	Published standard
PD IEC/TS 62878-2-3:2015	Device embedded substrate. Guidelines. Design guide Categories: Printed circuits and boards \| Electronic component assemblies Published standard begins : 2015-04-10	Published standard
PD IEC/TS 62878-2-1:2015	Device embedded substrate. Guidelines. General description of technology Categories: Printed circuits and boards \| Electronic component assemblies Published standard begins : 2015-04-13	Published standard
PD IEC/TS 61189-3-301:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB Categories: Printed circuits and boards Published standard begins : 2016-08-11	Published standard
PD IEC/TR 63051:2017	Documentation on design automation subjects. Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath) Categories: Industrial automation systems. General \| IT applications. Industry Published standard begins : 2017-01-19	Published standard
PD IEC/TR 63018:2015	Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials Categories: Printed circuits and boards Published standard begins : 2016-01-15	Published standard
PD IEC/TR 63017:2015	Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations Categories: Printed circuits and boards Published standard begins : 2016-01-15	Published standard
PD IEC/TR 62878-2-2:2015	Device embedded substrate. Guidelines. Electrical testing Categories: Printed circuits and boards \| Electronic component assemblies Published standard begins : 2015-12-18	Published standard
PD IEC/TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing Categories: Printed circuits and boards Published standard begins : 2014-05-19	Published standard

Show entries

Reference	Standards description	Status ? The standards development process is divided into chronological stages: Proposal; Drafting; Public comment; Comment resolution; Approval; Published standard.
PD IEC/TR 60068-3-12:2014	Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Categories: Testing. Environmental Withdrawn begins : 2022-11-30	Withdrawn
PD IEC/TR 60068-3-12:2007	Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Categories: Testing. Environmental Withdrawn begins : 2014-10-28	Withdrawn
PD IEC/PAS 62878-2-5:2015	Device embedded substrate. Guidelines. Data format Categories: Printed circuits and boards \| Electronic component assemblies Withdrawn begins : 2019-11-18	Withdrawn
PD IEC TR 62248:2002	Approaches to conformance and certification testing for design automation standards Categories: Industrial automation systems. General Withdrawn begins : 2012-06-18	Withdrawn
DD IEC/PAS 62137-3:2008	Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Categories: Electronic component assemblies Withdrawn begins : 2012-02-17	Withdrawn
DD IEC/PAS 61249-6-3:2011	Specification for finished fabric woven from “E” glass for printed boards Categories: Printed circuits and boards Withdrawn begins : 2023-08-08	Withdrawn
DD ENV 50247-2:2000	Pinnacles Component Information Standard 1.2. The SGML declaration and SGML document type definitions (DTDs) Categories: IT applications. Information, documentation and publishing Withdrawn begins : 2014-08-21	Withdrawn
DD ENV 50247-1:1999	Pinnacles Component Information Standard 1.2. The PCIS tag library Categories: IT applications. Information, documentation and publishing Withdrawn begins : 2014-08-21	Withdrawn
BS IEC 63055:2016	Format for LSI-Package-Board interoperable design Categories: Printed circuits and boards \| Integrated circuits. Microelectronics \| Information technology. Languages Withdrawn begins : 2023-11-08	Withdrawn
BS IEC 62531:2007	Standard for Property Specification Language (PSL) Categories: Industrial automation systems. General \| Information technology. General \| Information technology. Languages \| Office machines Withdrawn begins : 2012-08-21	Withdrawn