If you have difficulty in submitting comments on draft standards you can use a commenting template and email it to admin.start@bsigroup.com. The commenting template can be found here.
Standards Development
This part of IEC 6XXXX specifies the temperature measuring method using thermocouple for SMDs mounted on the circuit board. This document provides the information of magnitude of the temperature measurement error and the thermocouple resistance which causing the measurement error.
This document is applicable to the miniaturized SMDs mounted on the circuit boards.
The temperature measurement methods in this document are not intended to guarantee the reliability of individual components or electronic devices. The control items specified in this document are not intended to guarantee the quality of individual components.
About temperature measurement through thermal design processes, contact type temperature measurement method are widely used. Among them, thermocouples are widely used because of both low cost and high reliability. However, when temperature of surface-mounted electrical devices is measured by thermocouples, temperature on the surface of the electrical device decreases. In order to improve the measurement reliability of the surface-mounted SMDs, a novel evaluation platform of the measurement error of thermocouples for the miniaturized SMDs on circuit boards is strongly needed
You are now following this standard. Weekly digest emails will be sent to update you on the following activities:
You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.
You have successfully unsubscribed from weekly updates for this standard.
Comment on proposal
Required form fields are indicated by an asterisk (*) character.