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Find out what cookies we use and how to disable themThis International Standard specifies the correct S-parameter test method for the internal transmission circuit of a multilayer PCB for high frequency. The transmission loss test method that applies the VIPPO structure to the PCB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency PCB. And use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.
This standard provides a test method for high frequency multilayer circuit boards to be efficiently applied in high frequency testing environments such as telecommunication device.
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