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Standards Development
This part specifies the classification, composition and material, performance requirements, quality assurance, packaging, marking, transportation, storage and order information of laminated film for rigid organic packaging substrates.
The proposed product is build-up film for rigid organic package substrate, which is the core guarantee and key constraint point for the realization of FCBGA substrate and high -end chip microfabrication, high density and high reliability. It is widely use d in CPU, GPU, high-end servers, network routers/converters, high-performance game consoles, supercomputers, autonomous driving, 5G network, artificial intelligence and other demand fields. At present, IEC does not have such a standard, the establishment of this standard will be conducive to the unification of this kind of substrate, ensure the quality and stability of the material, and provide an important guarantee for the advanced packaging technology.
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