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PNW 91-2068 ED1: Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

Source:
IEC
Committee:
EPL/501 - Electronic Assembly Technology
Categories:
Information management | Standardization. General rules
Comment period start date:
Comment period end date:

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Scope

This part specifies the test method of the relative permeability and the magnetic loss tangent of magnetic dielectric materials used in circuit boards, including the requirements of instruments, samples, test procedures, test data processing, etc.

Purpose

This proposal is a method standard. The test objects are the relative permeability and the magnetic loss tangent of magnetic dielectric materials used in circuit boards. Magnetic dielectric materials for circuit boards such as magnetic copper clad laminate , magnetic paste and magnetic film are favored by the high-end electronic product market because of their miniaturization characteristics. This proposal is to meet the requirements for testing the magnetic properties of magnetic dielectric copper clad plate, magnetic film and magnetic paste used in circuit boards. Based on the magnetic properties testing of commercially available impedance analyzers with reference to relevant standards and methods at home and abroad, and combined with a large number of verification data, a simple, accurate and reliable standard test method suitable for the industry is developed.

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