Standards Development
This document is about requirements for properties of nonhalogenated epoxide modified bismaleimide/triazine with filler, woven E-glass reinforced laminated sheets of low thermal expansion (less than 50% of that of typical FR-4) and defined flammability (vertical burning test), copper-clad in thicknesses of 0,02 mm up to 1.60 mm for IC substrate.
The demand for advanced integrated circuit (IC) substrates is on the rise, as IC packaging is essential for high-performance semiconductors employed in data centres, mobile devices, automobiles, high-performance computing, and high-speed communication. The global advanced substrate market is anticipated to expand from $15.8 billion in 2021 to $29.6 billion by 2027 (YOLE, 2023).
Materials designated for advanced IC substrates must exhibit low coefficient of thermal expansion (CTE) properties and exceptional thermal reliability. Non -halogenated materials are preferred due to their environmentally sustainable characteristics. This s tandard pertains to non-halogenated low CTE materials utilized in IC substrates.
Required form fields are indicated by an asterisk (*) character.
You are now following this standard. Weekly digest emails will be sent to update you on the following activities:
You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.
You have successfully unsubscribed from weekly updates for this standard.
Comment by: