British Standards Institution

Source:: IEC
Committee:: EPL/501 - Electronic Assembly Technology
Categories:: Printed circuits and boards

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

10/09/2021

3. Public Comments (Complete)

Public Comments start date:

22/12/2020

Public Comments end date:

22/12/2021

Learn more about the standards development process

Standards Development

BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Thermal resistance of an assembly by thermal transient method

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