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This part of IEC 62047 specifies a test method for evaluating localized deformation and stretchability in hybrid MEMS materials. These materials are defined as composite systems that integrate rigid MEMS components with soft, stretchable substrates such as elastomers.
The scope of this document is limited to rigid components with a width or diameter less than 10 mm. Typical examples include MEMS chips embedded in or mounted on elastomeric substrates, and island-bridge configurations comprising rigid and soft electronic components for wearable applications.
This test method enables precise assessment of non-uniform strain distributions, and is particularly suitable for characterizing the mechanical behavior of heterogeneous systems like hybrid MEMS materials.
The purpose of this proposal is to establish standardized evaluation methods for localized deformation and stretchability of hybrid mems materials, which integrate rigid mems components with soft and stretchable substrates such as elastomers. with the rapid growth of applications in wearable devices, biomedical sensors, flexible electronics, and advanced semiconductor packaging, there is a strong industrial need for reliable and reproducible test methods that can capture localized strain behavior in heterogeneous material systems. currently, conventional MEMS reliability and mechanical tests focus primarily on global properties such as tensile, bending, or thermal fatigue. however, localized deformation phenomena are increasingly critical to the performance, durability, and safety of hybrid MEMS.
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