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Standards Development
| Reference | Standards description | Committee | Status |
|---|---|---|---|
| BS EN IEC 63609-3 |
BS EN 63609-3 Ed.1.0 Measurement method used in thermal design for electronics assemblies. Part 3: Temperature measurement method for miniaturized SMDs on circuit boards Categories: Printed circuits and boards | Electronic component assemblies |
EPL/501 Electronic Assembly Technology | Public comment |
| BS EN 61189-5-501 Ed.2.0 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes Categories: Printed circuits and boards |
EPL/501 Electronic Assembly Technology | Public comment |
| BS EN IEC 61189-3-720 ED1 |
BS EN 61189-3-720 ED1 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3-720: Test methods for interconnection structures (circuit boards) Categories: Printed circuits and boards |
EPL/501 Electronic Assembly Technology | Public comment |
| BS IEC 62899-202-14 ED1 |
BS EN 62899-202-14 ED1 Printed electronics. Part 202-14: Materials - Test methods of conductive ink suitability for screen printing Categories: Insulating materials. General | Printed circuits and boards |
AMT/9 Printed Electronics | Public comment |
| BS EN 62899-202-12 Ed.1.0 |
Printed electronics : Materials - Rheological property measurement methods of inkjet ink for printed electronics Categories: Printed circuits and boards |
AMT/9 Printed Electronics | Public comment |
| BS EN IEC 63516 ED1 |
BS EN 63516 ED1 Fixed folding durability test method for flexible opto-electric circuit boards Categories: Printed circuits and boards |
EPL/501 Electronic Assembly Technology | Comment resolution |
| BS EN IEC 61249-2-54 ED1 |
BS EN 61249-2-54 ED1 Materials for printed boards and other interconnecting structures. Part 2-54: Reinforced base materials clad and unclad - Categories: Printed circuits and boards |
EPL/501 Electronic Assembly Technology | Public comment |
| BS IEC 62899-202-13 ED1 |
BS EN 62899-202-13 ED1 Printed electronics. Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould electronics Categories: Insulating materials. General | Printed circuits and boards |
AMT/9 Printed Electronics | Public comment |
| BS IEC 62899-402-2 |
BS EN 62899-402-2 Printed electronics. Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image Categories: Printed circuits and boards |
AMT/9 Printed Electronics | Public comment |
| BS ISO 13060 |
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test Categories: Metallic coatings | Printed circuits and boards |
STI/33 Electrodeposited and related coatings | Public comment |