British Standards Institution

Source:: IEC
Committee:: EPL/501 - Electronic Assembly Technology
Categories:: Printed circuits and boards
Comment period start date:: 20/01/2025
Comment period end date:: 05/02/2025
Number of comments:: 0

Comment by:

5th Feb

Scope

This International Standard specifies the ~~correct~~ S-parameter test method for the internal transmission circuit of a multilayer PCB for high frequency up to 50 GHz. The transmission loss test method that applies the VIPPO structure to the PCB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency PCB. And use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

16/04/2025

3. Public Comments

Public Comments start date:

20/01/2025

Public Comments end date:

05/02/2025

Learn more about the standards development process

Standards Development

BS EN IEC 61189-3-720 ED1 BS EN 61189-3-720 ED1 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3-720: Test methods for interconnection structures (circuit boards)

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