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This document describes a method for measuring adhesion strength between microcircuits and substrates by scratching with the wedged-shape diamond stylus. Using the traditional adhesion test, it is difficult to evaluate the adhesion strength of the microcircuits with a narrower scratching stylus.
During the test, applying stylus force is constant or progressive and normal to the surface. This yields adhesive and/or cohesive failures of the microcircuit coating-substrate system.
This test method is suitable for evaluating copper microcircuits up to a width of tens of micrometres. It is also applicable for evaluating fine patterns of other widths and materials. Forces in the range of 0,1 N to 30 N are used in this document. Although the proposed procedure may apply to other force ranges, an appropriate calibration is required to quantify the normal forces at which failures occur.
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