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This part of IEC 63609 specifies the temperature measuring method using thermocouple for surface-mount device (hereafter, referred to as SMD) mounted on the circuit board. This document provides the information of magnitude of the temperature measurement error and the thermocouple resistance which causing the measurement error.
This document is applicable to the miniaturised SMD mounted on the circuit boards.
The temperature measurement methods in this document are not intended to guarantee the reliability of individual components or electronic equipment. The control items specified in this document are not intended to guarantee the quality of individual components.
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