British Standards Institution

Source:: ISO
Committee:: EPL/501 - Electronic Assembly Technology
Categories:: Information management | Standardization. General rules | Engineering | Electronics | Printed circuits and boards | Electronic component assemblies

Scope

This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

Purpose

To provide a standard which can be used by anybody, to help them assess or evaluate cleanliness of the soldered printed circuit assemblies before and/or after cleaning. There has been no proper general test method for this purpose ever before.

Comment on proposal

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Are you aware of any regulation, existing standards and other good practice information in this area in the UK (e.g. Industry codes of practice; company specifications, international or European Standards)? *

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal

Proposal start date:

02/07/2021

Proposal end date:

08/08/2021

2. Draft

3. Public Comments

4. Comment Resolution

5. Approval

6. Publication

Learn more about the standards development process

Standards Development

ISO/TC 44/SC 12 N 758, ISO/NP 9455-18 Soft soldering fluxes -- Test methods -- Part 18: Part 18: Test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning

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