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Standards Development
This reliability test method provides a standardized method to evaluate the resistance change of metal based conductive layer on flexible substrate under temperature and humidity conditions. The method described in this document offers a measurement and assessment conditions of resistance change for metal based transparent conductive films formed by printing methods.
The printed metal based transparent conductive film on flexible substrate may be a new good alternative for transparent conductive films such as indium tin oxide (ITO) which have been used widely from flat panel display to thin film type solar cell. The printed metal based conductive film needs new standard reliability test methods.
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