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BS EN IEC 61189-2-722 Test method for electrical materials, circuit board and other interconnection structures and assemblies. Part 2-722: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

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IEC
Committee:
EPL/501 - Electronic Assembly Technology
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Unclassified documents
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This document describes the method for measuring the relative permeability () and the magnetic loss tangent (tanδμ) in the range of 1 MHz to 1 GHz with Impedance Analyzer at temperatures ranging from −50 °C to 150 °C.

This document is applicable to the testing of magnetic dielectric copper clad laminate, magnetic film and magnetic paste for circuit boards.

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