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BS EN IEC 61249-3-7 BS EN 61249-3-7 ED1 Materials for circuit boards and other interconnecting structures. WebSockets

Source:
IEC
Committee:
EPL/501 - Electronic Assembly Technology
Categories:
Printed circuits and boards
Comment period start date:
Comment period end date:
Number of comments:
0

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Scope

This part of IEC 61249 specifies the classification, composition and materials, property requirements, quality assurance, packaging, marking, transport, storage and ordering information of build-up film for rigid organic package substrate (hereinafter referred to as build-up film).

This part of IEC 61249 applicable to the design, manufacture, shipment monitoring, incoming inspection for downstream users of build-up film, etc.

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