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BS EN IEC 61249-2-56 BS EN 61249-2-56 ED1 Materials for printed boards and other interconnecting structure. Part 2-56: Reinforced base materials clad and unclad

Source:
IEC
Committee:
EPL/501 - Electronic Assembly Technology
Categories:
Printed circuits and boards
Comment period start date:
Comment period end date:
Number of comments:
0

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Scope

This part of IEC 61249 gives requirements for properties of nonhalogenated epoxide modified bismaleimide/triazine with filler, woven E-glass reinforced laminated sheets of low thermal expansion (less than 50 % of that of typical FR-4) and defined flammability (vertical burning test), copper-clad in thicknesses of 0,02 mm up to 1.60 mm for IC substrate. The flammability rating is achieved with non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The low thermal expansion can be achieved using filler. The glass transition temperature is defined to be 170°C minimum.

Its flame resistance is defined in terms of the flammability requirements of 8.3.

Some property requirements may have several classes of performance. The class desired must be specified on the purchase order otherwise the default class of material will be supplied.

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