If you have difficulty in submitting comments on draft standards you can use a commenting template and email it to admin.start@bsigroup.com. The commenting template can be found here.
The scope of this document covers SiC-based power electronic conversion semiconductor (PECS) devices as SiC MOSFETs and Diodes.
This document provides stress procedures, general failure criteria and documentation guidelines such that the dv/dt robustness can be demonstrated, evaluated and documented. This document gives examples for test setups which can be used and the corresponding test conditions.
Additionally, criteria are explained under which device manufacturers can select an appropriate test setup.
Furthermore, for the evaluation the test setups are usually used under normal laboratory conditions. The usage of the test setups is not limited to specific environmental conditions like high humidity for instance. But it would have been taken to into account that additional failure modes like corrosion might be initiated.
Required form fields are indicated by an asterisk (*) character.
You are now following this standard. Weekly digest emails will be sent to update you on the following activities:
You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.
You have successfully unsubscribed from weekly updates for this standard.
Comment by: