Standards Development
This part of IEC 62047 specifies a double cantilever beam test method for evaluating the interfacial fracture toughness of wafer-to-wafer hybrid bonding structures for MEMS applications.
The method uses cyclic unloading–reloading and compliance measurement to determine crack propagation without requiring direct optical measurement of the crack front. It covers specimen preparation, starter delamination, test environment, loading procedure, compliance evaluation, crack- length determination and test reporting.
Hybrid bonding is increasingly used for high-density integration in MEMS and advanced semiconductor devices. Reliable evaluation of the bonding interface is therefore important for process development and reliability assessment.
Existing wafer-bond strength methods can require direct observation of crack propagation, which may be difficult for hybrid bonding structures containing opaque metal regions or when testing is performed in an environmental chamber.
This proposal provides a compliance-based double cantilever beam method using cyclic unloading – reloading to enable more reproducible and comparable evaluation of hybrid bonding interfaces. It also specifies controlled low-moisture test conditions to reduce environmental effects on the measured results.
Required form fields are indicated by an asterisk (*) character.
You are now following this standard. Weekly digest emails will be sent to update you on the following activities:
You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.
You have successfully unsubscribed from weekly updates for this standard.
Comment by: