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New Work Item Proposal - 91-2149 ED1: Test methods for electrical materials, circuit board and other interconnection structures and assemblies - Part 5-507: General test methods for materials and assemblies - Controlled condensation testing

Source:
IEC
Committee:
EPL/501 - Electronic Assembly Technology
Categories:
Information management | Standardization. General rules
Comment period start date:
Comment period end date:

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Scope

This part of IEC 61189-5 establishes a test method for determining the ability of materials, components or assemblies to withstand conditions of condensation of water vapour.

The object of this test method is to investigate the effect of condensation on a test specimen over a prescribed period including cyclic condensation and drying, with or without applied voltage.

It is applicable to test boards, either with or without assembled components. For test boards with components assembled, the test method requires boards with a flat bottom side mounted to a temperature controlled metal platen and is not suitable for testin g double side assembled or uneven circuit boards

Purpose

Existing condensation test methods provide limited control over the amount of condensation, resulting in varying test conditions and challenges in repeatability and comparison of results.

This new test method is based on the principle to place a temperature -controlled platen inside of a climate chamber. Test boards are assembled to the platen and cooled down below dew point.

Surface insulation resistance is monitored during condensation cycling for assessing electronics performance in condensing environments.

The test method among others can be used for the purpose of

• Material and component qualification testing

• Resistance against electrochemical migration

• Effectiveness of protective coatings It provides a rapid evaluation method for moisture -related failure mechanisms

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