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New Work Item Proposal - 47F-577 ED1: Semiconductor devices - Micro-electromechanical devices - Part 69: MEMS packaging residual stress test methods based on stress amplification structure

Source:
IEC
Committee:
EPL/47 - Semiconductors
Categories:
Information management | Standardization. General rules
Comment period start date:
Comment period end date:

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Scope

This part of IEC 62047 defines the method for amplifying and testing the residual stresses generated during the processing and packaging of MEMS devices. This method applies to the test and evaluation of residual stresses in MEMS.

Purpose

Residual stress in MEMS devices can affect the long-term stability of the devices, and testing and analyzing the residual stress in MEMS devices is conducive to promoting the industrial application of MEMS products.

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