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Standards Development
This part of IEC 63378 specifies three-dimensional (3D) thermal model of LQFP (Low -profile Quad Flat Package), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.The package whose center coordin ates of the die matches those of the package, viewing from the top, is within the scope.The package whose die pad sink amount is less than the thickness of the die pad is out of the scope.This model is intended to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
In order to make the thermal simulation of electric devices precisely, thermal simulation models of LQFP is required.
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