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PNW 47-2970 ED1: Semiconductor devices - Chip-scale testing for autonomous vehicles -Part 3: Thermal imagers

Source:
IEC
Committee:
EPL/47 - Semiconductors
Categories:
Information management | Standardization. General rules
Comment period start date:
Comment period end date:

Comment by:

Scope

This part of 63551-3 specifies testing methods and environments for evaluating the optical performance of thermal imaging sensor chips used in autonomous land vehicles. This document focuses on the chip-level characteristics of the thermal imaging device, including intrinsic sensor behavior, without covering module-level integration or external optics. Related standards such as ISO 26262: Road vehicles – Functional safety and IEEE 802.11p: V2X communication are outside the scope of this document.

Purpose

Thermal imagers available today provide accurate, essential data that enable autonomous vehicles to operate safely and reliably. Currently, there is no existing chip -level thermal imager standard for automotive. Automotive night-vision or thermal-imaging demand is rising with ADAS/AV adoption.

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