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This part of 63551-3 specifies testing methods and environments for evaluating the optical performance of thermal imaging sensor chips used in autonomous land vehicles. This document focuses on the chip-level characteristics of the thermal imaging device, including intrinsic sensor behavior, without covering module-level integration or external optics. Related standards such as ISO 26262: Road vehicles – Functional safety and IEEE 802.11p: V2X communication are outside the scope of this document.
Thermal imagers available today provide accurate, essential data that enable autonomous vehicles to operate safely and reliably. Currently, there is no existing chip -level thermal imager standard for automotive. Automotive night-vision or thermal-imaging demand is rising with ADAS/AV adoption.
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