Please note, we are experiencing intermittent issues on the platform which we are investigating. You may experience issues with submitting comments. If you do encounter issues, please resubmit your comment. Please accept our apologies for any inconvenience caused

We use cookies to give you the best experience and to help improve our website

Find out what cookies we use and how to disable them

PNW 47F-469 ED1: PNW 47F-469 ED1: Micro-electromechanical devices - Part 55: Silicon based MEMS fabrication technology - Test method of microstructure pendulum impact

Scope

This part of IEC 62047 specifies a pendulum impact test method to evaluate the impact resistance of microstructures fabricated by micromachining technology used in silicon -based micro- electromechanical systems (MEMS). This document is applicable to the in -situ pendulum impact test of microstructures manufactured by microelectronic technology process and other micromachining technology.

Purpose

The application of this standard can cut process and chip development costs effectively, offer essential technical support for mass-producing MEMS chips, provide material property analysis methods for MEMS fabrication technology, and promote the industrialization and research of MEMS.

Comment on proposal

Required form fields are indicated by an asterisk (*) character.


Please email further comments to: debbie.stead@bsigroup.com

Follow standard

You are now following this standard. Weekly digest emails will be sent to update you on the following activities:

You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.

Unfollow standard

You have successfully unsubscribed from weekly updates for this standard.

Error