British Standards Institution

Source:: IEC
Committee:: EPL/501 - Electronic Assembly Technology
Categories:: Information management | Standardization. General rules

Scope

This part of IEC 61189 defines the measuring method to be followed for the determination of the etch factor for traces on circuit board. This method is composed of two main parts. The first part is to prepare microsection of specimen. The other part is to observe the microsection under microscope and measure the dimensions of the trace.

Purpose

Etching process is one of the most crucial steps of circuit board fabrication. A common measure for etching capability is etch factor, whose measurement has not been standardized and consequently causes miscommunication across circuit board fabricators as well as board assemblers. The standard can be used for evaluating etching capability.

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal

Proposal start date:

29/01/2024

Proposal end date:

15/03/2024

2. Draft

3. Public Comments

4. Comment Resolution

5. Approval

6. Publication

Learn more about the standards development process

Standards Development

PNW 91-1931 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-XXX: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

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