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Standards Development
This part of IEC 61189 defines the measuring method to be followed for the determination of the etch factor for traces on circuit board. This method is composed of two main parts. The first part is to prepare microsection of specimen. The other part is to observe the microsection under microscope and measure the dimensions of the trace.
Etching process is one of the most crucial steps of circuit board fabrication. A common measure for etching capability is etch factor, whose measurement has not been standardized and consequently causes miscommunication across circuit board fabricators as well as board assemblers. The standard can be used for evaluating etching capability.
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