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Standards Development
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. In this method, the printed layer such as conductive, insulation, di-electric, semi-conductive etc. is attached firmly to a rigid supporting substrate with adhesives and subsequently the flexible substrate is peeled off. It can be used when the adhesion between the printed layer and the flexible substrate is lower than any other interface between the printed layer and the adhesive or the adhesive and the support.
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