British Standards Institution

Source:: IEC
Committee:: EPL/47 - Semiconductors
Categories:: Semiconductor devices. General
Comment period start date:: 14/04/2025
Comment period end date:: 30/04/2025
Number of comments:: 0

Comment by:

30th Apr

Scope

This part of IEC 63378-6-1 specifies a type of DXRC standardized by IEC 63378-6. This model is named the DataSheet thermal Resistance and Capacitance (DSRC) model. The DSRC model is specifically characterized by datasheets which are provided by semiconductor manufacturers and based on actual performances. This model is designed to predict transient temperatures at a junction and other specified points mentioned in datasheets. This document applies to semiconductor packages supported by IEC 63378-6.

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Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

04/07/2025

3. Public Comments

Public Comments start date:

14/04/2025

Public Comments end date:

30/04/2025

Learn more about the standards development process

Standards Development

BS EN 63378-6-1 Ed.1.0 Thermal standardization on semiconductor packages. Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

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