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Standards Development
This part of IEC 62047 specifies a tensile test method to evaluate the tensile strength of microstructures fabricated by micromachining technology used in silicon-based micro-electromechanical systems (MEMS). In the manufacturing of MEMS devices, the small micro/nano scale magnifies the impact of non-ideal fabrication effects compared to larger-scale production, which can lead to the occurrence of surface defects, line width loss, and residual stress in the fabricated objects, causing significant fluctuations in the mechanical strength of MEMS devices.
This document specifies an in-situ on-wafer test method to measure the actual tensile strength values of the microstructures during MEMS devices fabrication. This method eliminates the requirement for intricate instruments like scanning probe microscopy and nanoindenter. both the tester and testing structure are co-fabricated by the same process. This document typically applies for microstructures testing with a thickness range of 30μm to 100 μm, a width range of 3μm to 10 μm and a length range of 65μm to 200 μm.
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