British Standards Institution

Source:: IEC
Committee:: EPL/47 - Semiconductors
Categories:: Semiconductor devices. General
Comment period start date:: 01/04/2025
Comment period end date:: 23/04/2025
Number of comments:: 0

Comment by:

23rd Apr

Scope

This part of IEC 63378 specifies thermal evaluation board specifications for fine pitch semiconductor packages.

Fine pitch is defined as 0,8mm or less solder pitch for both BGA and LGA and 0,5mm or less solder pitch for QFP.

Semiconductor packages is mounted on this thermal evaluation board using solder and then thermal resistance and thermal parameter of the packages are measured.

The obtained thermal resistance and thermal parameter are listed in the datasheets of semiconductor packages.

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

30/05/2025

3. Public Comments

Public Comments start date:

01/04/2025

Public Comments end date:

23/04/2025

Learn more about the standards development process

Standards Development

BS EN 63378-4 Ed.1.0 Thermal standardization on semiconductor packages. Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

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