We use cookies to give you the best experience and to help improve our website

Find out what cookies we use and how to disable them

BS EN 63608-1 Semiconductor devices - Reliability evaluation methods for vibration energy harvesters. Part 1: Mechanical reliability under shock

Source:
IEC
Committee:
EPL/47 - Semiconductors
Categories:
Semiconductor devices. General
Comment period start date:
Comment period end date:
Number of comments:
0

Comment by:

Scope

This document specifies evaluation methods for the mechanical reliability of vibration energy harvesting devices. This standard applies to all vibration energy harvesting devices, regardless of size and power generation principle. The method includes shock, vibration, frequency sweep, and drop tests. Shock vibration covers a wide range of definitions, including its peak acceleration, duration/frequency, and the shape of the shock pulse (e.g., half-sine, square, sawtooth, etc.). According to typical usage conditions, the change in power is measured before and after the tests under conditions that include actual power management circuits or load resistances.

Read draft and comment

Comment on proposal

Required form fields are indicated by an asterisk (*) character.


Please email further comments to: debbie.stead@bsigroup.com

Follow standard

You are now following this standard. Weekly digest emails will be sent to update you on the following activities:

You can manage your follow preferences from your Account. Please check your mailbox junk folder if you don't receive the weekly email.

Unfollow standard

You have successfully unsubscribed from weekly updates for this standard.

Error