British Standards Institution

Source:: IEC
Committee:: EPL/47 - Semiconductors
Categories:: Lamps. Other | Semiconductor devices. General
Comment period start date:: 06/09/2024
Comment period end date:: 30/10/2024
Number of comments:: 0

Comment by:

30th Oct

Scope

This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.

This test method provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing.

This test is considered destructive unless otherwise detailed in the relevant specification.

NOTE 1 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.

Read draft and comment

Comment on proposal

Required form fields are indicated by an asterisk (*) character.

How important do you think standardization is in this area? *

Do you agree that a standard on this subject is feasible?: *

Please give reasons for your selections above: *

Would you or your organization use the standard? *

Would you or your organization be prepared to participate in the development of the standard or to comment on the draft when it is available? *

Are you aware of any regulation, existing standards and other good practice information in this area in the UK (e.g. Industry codes of practice; company specifications, international or European Standards)? *

Would the development of a standard(s) in this area have a particular impact/relevance to SME, consumer, environmental or societal interests? *

Are you aware of any other organizations to which this proposal may be relevant? If so please provide details below. *

Additional comments on the scope or proposal:

Although BSI will not usually enter into correspondence regarding individual comments or suggestions we may wish to contact you to seek further clarification. Please indicate whether this will be acceptable: *

Discard

Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal (Complete)

Proposal start date:

2. Draft (Complete)

Draft start date:

19/07/2024

3. Public Comments

Public Comments start date:

06/09/2024

Public Comments end date:

30/10/2024

Learn more about the standards development process

Standards Development

BS EN IEC 60749-21 ED.3 BS EN 60749-21 ED.3 Semiconductor devices - Mechanical and climatic test methods. Part 21: Solderability

Scope

Comment on proposal

Discard changes?

Submit comment

Submit comment

Follow standard

Unfollow standard

Error