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Standards Development
This document provides guidance and recommendations for the application of liquid cooling to data centres.
This document addresses the following:
1) Architectural considerations;
2) Mechanical considerations;
3) Electrical considerations;
4) Communication considerations.
This guidance aims to support the safe and reliable application of liquid cooling to data centres. This work item is proposed to address the following challenges:
• Heat generation from high-density IT equipment exceeding the capabilities of conventional air-cooling methods
• Increased thermal management requirements arising from the deployment of AI, cloud computing, and high-performance computing
• Diversity of liquid cooling technologies (e.g., direct-to-chip, rear-door heat exchangers, immersion cooling) requiring consistent design and operational practices
• Absence of standardized guidance leading to operational inconsistencies, risks, and safety concerns
• Industrial demands for unified recommendations on architectural, mechanical, electrical, and communication aspects to ensure reliable deployment
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