British Standards Institution

Source:: IEC
Committee:: AMT/9 - Printed Electronics
Categories:: Information management | Standardization. General rules

Scope

This part of IEC 62899 specifies a test pattern as well as resistance and thickness measurement methods for the conductive layer in printed and in-mould electronics.

Purpose

Conductive layer resistance is an important characteristic when designing printed and in-mould electronics. Test pattern and resistance measurement method help conductive inks suppliers to develop new materials as well as users of the conductive inks to select the appropriate ones.

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Please email further comments to: debbie.stead@bsigroup.com

Standard timeline

1. Proposal

Proposal start date:

15/05/2024

Proposal end date:

23/06/2024

2. Draft

3. Public Comments

4. Comment Resolution

5. Approval

6. Publication

Learn more about the standards development process

Standards Development

IEC 62899-202-13 ED1 Printed electronics - Part 202-13 Materials - Resistance measurement method for conductive layer in printed and in-mould electronics

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