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Integrated circuits & microelectronics

Standards in development (399)

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Standard TitleStatus
BS CEN/TR 16886 Guidance on the application of statistical methods for determining the properties of masonry productsApproval
BS EN 13914-2 Design, preparation and application of external rendering and internal plastering Part 2: Design considerations and essential principles for internal plasteringApproval
BS EN 140401-802:2007/A Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2Accepted
BS EN 140401-803:2007/A Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2Accepted
Opens a new windowBS EN 140402:2015 low power wirewound surface mount (SMD) resistorsApproval
BS EN 419111-1 Protection profiles for signature creation and verification application Part 1: Introduction to the European NormPublic Comment
BS EN 419111-2 Protection profiles for signature creation and verification application - Signature creation application Part 2: Core PPPublic Comment
BS EN 419111-3 Protection profiles for signature creation and verification application - Signature creation application Part 3: Possible extensionsPublic Comment
BS EN 419111-4 Protection profiles for signature creation and verification application - Signature verification application Part 4: Core PPPublic Comment
BS EN 419111-5 Protection profiles for signature creation and verification application - Signature verification application Part 5: Possible extensionsPublic Comment
BS EN 50117-10-1 Coaxial cables Part 10-1: Sectional specification for coaxial cables for analogue and digital signal transmission - Outdoor drop cables for systems operating at 5 MHz - 1 000 MHzPublic Comment
BS EN 50117-10-2 Coaxial cables Part 10-2: Sectional specification for coaxial cables for analogue and digital signal transmission - Outdoor drop cables for systems operating at 5 MHz - 3 000 MHzPublic Comment
BS EN 50117-11-1 Coaxial cables Part 11-1: Sectional specification for coaxial cables for analogue and digital signal transmission - distribution and trunk cables for systems operating at 5 MHz - 1 000 MHzPublic Comment
BS EN 50117-11-2 Coaxial cables Part 11-2: Sectional specification for coaxial cables for analogue and digital signal transmission - distribution and trunk cables for systems operating at 5 MHz - 2 000 MHzPublic Comment
BS EN 50117-9-1 Coaxial cables Part 9-1: Sectional specification for coaxial cables for analogue and digital signal transmission - Indoor drop cables for systems operating at 5 MHz - 1 000 MHzPublic Comment
BS EN 50117-9-2 Coaxial cables Part 9-2: Sectional specification for coaxial cables for analogue and digital signal transmission - Indoor drop cables for systems operating at 5 MHz - 3 000 MHzPublic Comment
BS EN 50117-9-3 Coaxial cables Part 9-3: Sectional specification for coaxial cables for analogue and digital signal transmission - Indoor drop cables for systems operating at 5 MHz - 6 000 MHzPublic Comment
BS EN 50153:2014/prA Railway applications - Rolling stock - Protective provisions relating toelectrical hazardsIdea
BS EN 50155 Railway applications - Electronic equipment used on rolling stockPublic Comment
BS EN 50288-12-1 Multi-element metallic cables used in analogue and digital communications and control - Part 12-1: Sectional specification for screened cables characterised from 1 MHz up to 2 000 MHz – Horizontal and building backbone cables.Accepted
BS EN 50289-1-1 Communication cables - Specifications for test methods Part 1-1: Electrical test methods - General requirementsAccepted
Opens a new windowBS EN 50289-1-11 Communication cables - Specifications for test methods Part 1-11: Electrical test methods - Characteristic impedance, input impedance, return lossPublic Comment
BS EN 50289-1-8 Communication cables - Specifications for test methods - Part 1-8: Electrical test methods - AttenuationAccepted
BS EN 50289-1-9 Communication cables - Specifications for test methods Part 1-9: Electrical test methods - Unbalance attenuation (transverse conversion loss TCL transverse conversion transfer loss TCTL)Accepted
BS EN 50289-4-16 Communication cables - Specifications for test methods - Part 4-16: Environmental test methods - Circuit integrity under fire conditionsPublic Comment
BS EN 50290-2-20 Communication cables - Part 2-20: Common design rules and construction - GeneralPublic Comment
BS EN 50290-2-29 Communication cables - Part 2-29: Common design rules and construction - Crosslinked polyethylene insulation compounds: instrumentation, control and field bus cablesPublic Comment
BS EN 50290-2-34 Communication cables - Part 2-34: Common design rules and construction - PE Sheathing compound for outdoor optical fibre cablesPublic Comment
BS EN 50290-2-35 Communication cables - Part 2-35: Common design rules and construction - Polyamide sheathing compoundPublic Comment
BS EN 50290-2-36 Communication cables - Part 2-36: Common design rules and construction - Silicon compounds for Fire Resistant CablesPublic Comment
BS EN 50343:2014/prA Railway applications - Rolling stock - Rules for installation of cablingIdea
BS EN 50380 Marking and documentation requirements for Photovoltaic ModulesPublic Comment
BS EN 50407-2 Multi-pair cables used in high bit rate digital access telecommunications networks - Part 2: Multi-pair cables with bandwidth up to 30 MHz - Indoor and Outdoor riser cables.Idea
BS EN 50449 Electromagnetic devices and components - General specificationApproval
BS EN 50591 Railway applications - Rolling stock applications - Specification andverification of energy consumption for railway rolling stockIdea
BS EN 50592 Railway applications - Testing of rolling stock for electromagneticcompatibility with axle countersPublication
BS EN 50657 Railway applications - Rolling stock applications - Software on board ofrolling stock, excluding railway control and protection applicationsPublic Comment
BS EN 50882-11 Multi-element metalic cables used in analogue and digital communication and control Part 11: Sectional specification for un-screened cables, characterised up to 500 MHz, for horizontal and building backbone wiringPublic Comment
BS EN 60062 Ed 6.0 Marking codes for resistors and capacitorsPublication
BS EN 60068-2 -69 Ed 3.0 Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) methodPublic Comment
BS EN 60068-3-13 Ed1.0 Environmental testing - Part 3-13: Supporting documentation and guidance on test T: SolderingPublication
BS EN 60077-1 Ed. 2.0 Railway applications - Electric equipment for rolling stock Part 1: General service conditions and general rulesPublic Comment
BS EN 60077-2 Ed. 2.0 Electric equipment for rolling stock Part 2: Electrotechnical components - General rulesPublic Comment
BS EN 60115-22014+A1 Fixed resistors for use in electronic equipment Part 2: Sectional specification: Leaded fixed low power film resistorsnull
BS EN 60115-8-1:2014+A1 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level Gnull
BS EN 60153-1 HOLLOW METALLIC WAVEGUIDES Part 1: General requirements and measuring methodsPublication
BS EN 60153-2 Ed 3.0 HOLLOW METALLIC WAVEGUIDES Part 2: Relevant specifications for ordinary rectangular waveguidesPublication
BS EN 60154-1 Ed 3.0 FLANGES FOR WAVEGUIDES Part 1: General requirementsPublication
BS EN 60154-2 Ed 3.0 FLANGES FOR WAVEGUIDES Part 2: Relevant specifications for flanges for ordinary rectangular waveguidesPublication
BS EN 60154-4 Flanges for waveguides Part 4: Relevant specifications for flanges for circular waveguidesPublic Comment
BS EN 60191-1 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devicesAccepted
BS EN 60191-2/F67 Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.Public Comment
BS EN 60191-2/F68 Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.Public Comment
BS EN 60191-2/F69 Proposed new package outline - flange mount package with flat leads, PSFM- F8 - To be published as outline 187E, if approved.Public Comment
BS EN 60191-2/F70 Proposed new package outline - P-ZMP-P165Public Comment
BS EN 60191-2/F71 Proposed new package outline - P-ZMP-P89Public Comment
BS EN 60191-2/F72 Proposed new package outline - P-UMP-AxAccepted
BS EN 60191-6-1 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductir device packages - Design guide for gull-wing lead terminalsPublic Comment
BS EN 60191-6-13 Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)Approval
BS EN 60191-6-16 Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAAccepted
BS EN 60195 Method of measurement of current noise generated in fixed resistorsPublication
BS EN 60297-3-110 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) Series Part 110: residential racks and cabinets for intelligent housesAccepted
BS EN 60317-0-10 Specifications for particular types of winding wires Part 0-10: General requirements - Polyester Glass fibre wound, resin or varnish impregnated, bare or enamelled round copper wireAccepted
BS EN 60317-0-11 Specifications for particular types of winding wires Part 0-11: General requirements - Basic, supplementary, or reinforced insulated single or multi-layer tape wrapped or extruded round winding wiresAccepted
BS EN 60317-0-7 Specifications for particular types of winding wires Part 0-7: General requirements - Fully insulated (FIW) zero-defect enamelled winding wiresPublic Comment
BS EN 60317-1 Specifications for particular types of winding wires – Part 1: Polyvinyl acetal enamelled round copper wire, class 105Idea
BS EN 60317-35:2012 Specifications for particular types of winding wires Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layerApproval
BS EN 60317-56 Specifications for particular types of winding wires Part 56: Solderable fully insulated (FIW) zero-defect polyurethane enamelled round winding wire, class 180Public Comment
BS EN 60317-63 Specifications for particular types of winding wires Part 63: Basic, supplementary, or reinforced insulated single or or multi-layer tape extruded round winding wireAccepted
BS EN 60317-64 Specifications for particular types of winding wires Part 64: Basic, supplementary, or reinforced insulated single or multi- layer tape wrapped round winding wireAccepted
BS EN 60317-65 Specifications for particular types of winding wires Part 65: Basic, supplementary, or reinforced insulated single or multi- layer extruded round winding wire with a bonding layerAccepted
BS EN 60317-66 Specifications for particular types of winding wires Part 66: Basic, supplementary, or reinforced insulated single or multi- layer tape wrapped round winding wire with a bonding layerAccepted
BS EN 60317-68 Specifications for particular types of winding wires Part 68: Polyvinyl acetal enamelled rectangular aluminium wire, class 120Public Comment
BS EN 60317-69 Specifications for particular types of winding wires - Part 69: Polyester or polyesterimide overcoated with polyamide-imide enamelled rectangular aluminium wire, class 220Public Comment
BS EN 60317-70 Specifications for particular types of winding wires Part 70: Polyester glass-fibre wound unvarnished and fused or resin/varnish impregnated, bare of enamelled round copper wire temperature index 155Public Comment
BS EN 60317-71 Specifications for particular types of winding wires Part 71: Polyester glass-fibre wound unvarnished and fused or resin/varnish impregnated, bare of enamelled round copper wire temperature index 180Public Comment
BS EN 60317-72 Specifications for particular types of winding wires Part 72: Polyester glass-fibre wound unvarnished and fused or resin/varnish impregnated, bare of enamelled round copper wire temperature index 200Public Comment
BS EN 60384-1 Fixed capacitors for use in electronic equipment - Part 1: Generic specificationPublication
BS EN 60384-14 Ed 4.0 /A1 Fixed capacitors for use in electronic equipment Part 14: Sectional specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mainsPublication
BS EN 60384-15 Fixed capacitors for use in electronic equipment. Part 15: Sectional specification: Fixed tantalum capacitors with non- solid or solid electrolytePublic Comment
BS EN 60384-18 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolytePublication
BS EN 60384-3 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification: Surface mount fixed tantalum electrolyt capacitors with manganese dioxide solid electrolytePublication
BS EN 60384-4 Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyteApproval
BS EN 60445 Basic and safety principles for man-machine interface, marking andidentification - Identification of equipment terminals, conductor terminations and conductorsAccepted
BS EN 60512-15-2 Connectors for electronic equipment .Tests and measurements. Part 15-2: Connector tests (mechanical). Test 15b: Insert retention in housing (axial)Public Comment
BS EN 60512-17-5 Connectors for electronic equipment - Tests and measurements - Part 17-5: Cable clamping tests - Test 17X: Cable clamp resistance to dynamic cablenull
BS EN 60512-28-100 Ed 2.0 Connectors for electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors - Tests 28a to 28gAccepted
BS EN 60512-8-3 Connectors for electronic equipment-tests and measurements Part 8-3: Static load tests (fixed connectors) test 8c: Robustness of actuating leverAccepted
BS EN 60512-99-002 Connectors for electronic equipment - Tests and measurements Part 99-002: Endurance test schedules - Test 99b: Test schedule for engaging and separating connectors under electrical load connectorsAccepted
BS EN 60539-1 Directly heated negative temperature coefficient thermistors Part 1: Generic specificationPublication
BS EN 60601-2-22 Ed 4.0 Medical electrical equipment Part 2-22: Particular requirements for basic safety and essential performance of surgical; cosmetic; therapeutic and diagnostic laser equipmentPublic Comment
BS EN 60603-7+A2 Connectors for electronic equipment Part 7: Detail specification for 8-way, unshielded, free and fixed connectorsAccepted
BS EN 60603-7-82 Connectors for electronic equipment Part 7-82: Detail specification for 8-way, shielded, individual pair shielded, free and fixed connectors, for data transmission with frequencies up to 2 000 mhzApproval
BS EN 60747-14-6 ED 1.0 Semiconductor devices Part 14-6: Semiconductor sensors - Humidity sensorAccepted
BS EN 60747-14-7 ED 1.0 Semiconductor devices Part 14-7: Semiconductor sensors - Flow meterAccepted
BS EN 60747-14-8 ED 1.0 Semiconductor devices Part 14-8: Semiconductor sensors - Capacitive degradation sensor of liquidAccepted
BS EN 60747-16-1 Ed1.0/A2 Semiconductor devices Part 16-1: Microwave integrated circuits - AmplifiersPublication
BS EN 60747-16-3 Ed 1.0 /A2 Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency convertersAccepted
BS EN 60747-16-4 Ed 1.0 /A2 Semiconductor devices Part 16-4: Microwave integrated circuits - SwitchesAccepted
BS EN 60747-17 Semiconductor devices - Discrete devices Part 17: Magnetic and capacitive coupler for basic and reinforced isolationAccepted
BS EN 60747-2 Semiconductor devices - Discrete devices - Part 2 : Rectifier diodesPublication
BS EN 60747-4 Ed2.0/A1 Semiconductor devices - Discrete devices Part 4: Microwave diodes and transistors Amendment 1Publication
BS EN 60747-9 Semiconductor devices Part 9: Discrete devices: Insulated-gate bipolar transistors (IGBTs)Accepted
BS EN 60749-28 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Charged Device Model (CDM)Public Comment
BS EN 60749-3 Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examinationPublic Comment
BS EN 60749-4 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)Public Comment
BS EN 60749-43 Semiconductor devices - mechanical and climatic test methods Part 43: Guidelines for LSI reliability qualification plansPublic Comment
BS EN 60749-44 Semiconductor devices - Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devicesApproval
BS EN 60749-6 Semiconductor devices - Mechanical and climatic test methods Part 6: Storage at high temperaturePublic Comment
BS EN 60749-9 Metallic Communication Cable test methods Part 4-9: Electromagnetic compatibility (EMC) - Coupling attenuation of screened balanced cables, triaxial methodnull
BS EN 60825-12 ED.2 Safety of laser products Part 12: Safety of free space optical communication systems used for transmission of informationPublic Comment
BS EN 60825-4 Ed 3.0 Safety of laser products Part 4: Laser guardsPublic Comment
BS EN 60851-4 Winding wires - Methods of test for winding wires - Part 4: Chemical propertiesPublication
BS EN 60904-1-1 Photovoltaic devices Part 1-1: Measurement of current-voltage characteristics of multi-junction photovoltaic devicesPublic Comment
BS EN 60904-3 Ed 3.0 Photovoltaic devices Part 3: Measurement principles for terrestrial photovoltaic (PV) solar devices with reference spectral irradiance dataPublication
BS EN 60904-8-1 Photovoltaic devices Part 8-1: Measurement of spectral response of multi-junction photovoltaic (PV) devicesPublic Comment
BS EN 60966-1 Ed.3 Cables, wires, waveguides, r.f. connectors, and accessories for communication and signallingPublic Comment
BS EN 60966-2-4 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-2 connectorsPublication
BS EN 60966-2-5 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-2 connectorsApproval
BS EN 60966-2-6 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-24 connectorsApproval
BS EN 61045-1 Fixed film resistor networks for use in electronic equipment - Part 1 : Generic specificationPublic Comment
BS EN 61076-1+A1 Connectors for electronic equipment - Product equirements Part 1: Generic specificationAccepted
BS EN 61076-2-111 Connectors for electronics equipment Part 2-111: Circular connectors - Detail specification for plug and jack for 2 mm barrel-type battery charging interfaceAccepted
BS EN 61076-2-112 Connectors for electronic equipment Part 2-112: Product requirements - Circular connectors, Detail specification for M12 power connectors up to12 Amps with screw-lockingAccepted
BS EN 61076-2-113 Connectors for electronic equipment - Product requirements Part 2-113: circular connectors - Detail specification for connectors with data and power contacts with M12 screw-lockingPublic Comment
BS EN 61076-2-114 Connectors for electronic equipment - Product requirements Part 2-114: Circular connectors - Detail specification for data and power connectors with M8 screw-lockingAccepted
BS EN 61076-3-104 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 2 000 MHzPublic Comment
BS EN 61076-3-110 Connectors for electronic equipment - product requirements Part 3-110: detail specification for free and fixed connectors for data transmission with frequencies up to 3 000 mhzApproval
BS EN 61076-3-119 Connectors for electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for unshielded free and fixed 10 way connectors with push-pull coupling for industrial environments with frequencies up to 100 MHzAccepted
BS EN 61076-3-120 Connectors for electronic equipment - Product requirements Part 3-120: rectangular connectors -Detail specification for rewirable power connector with snap locking for 250 v d.c. And rated current of 30aApproval
BS EN 61076-3-122 Connectors for electronic equipment - Product requirements Part 3-122: Detail specification for 8-way, shielded, free and fixed connectors for I/O and Gigabit applications in harsh environmentsPublic Comment
BS EN 61076-3-123 Connectors for electronic equipment - Product requirements - Part 3-123: Rectangular connectors - Detail specification for hybrid connectors for industrial environments, for power supply and fibre optic data transmission, with push-pull lockingIdea
BS EN 61076-3-123 Connectors for electronic equipment - Product requirements Part 3-123: Rectangular connectors - Detail specification for hybrid connectors for industrial environments, for power supply and fibre optic data transmission, with push-pull lockingAccepted
BS EN 61156-1-4 MULTICORE AND SYMMETRICAL PAIR/QUAD CABLES FOR DIGITAL COMMUNICATIONS Part 1-4: Assessment of the conductor heating in bundled cables due to the deployment of power transmission based on IEEE802.3 PoE-regimeAccepted
BS EN 61169-11 Radio-frequency connectors Part 11: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 9.5 mm with threaded coupling - characteristic impedance 50 ohm (Type 4.1-9.5)Publication
BS EN 61169-54 RADIO-FREQUENCY CONNECTORS Part 54: Sectional Specification for Coaxial Connectors with 10mm inner of outer Conductor,nominal Characteristic Impedance 50 Ohms, Series 4.3- 10Approval
BS EN 61169-58 Radio-frequency connectors Part 58: Sectional specification for RF coaxial connectors with blind-mate coupling - characteristic impedance 50 ohm (type SBMA)Approval
BS EN 61169-59 Radio-frequency connectors Part 59: Sectional specification for type L32-4 and L32-5 threaded multi-coaxial radio-frequency connectorsIdea
BS EN 61188-7 Printed boards and printed board assemblies - Design and use Part 7: Electronic component zero orientation for CAD library constructionAccepted
BS EN 61188-8-1 ED 1.0 Componenet shape data specification for CAD library - Part 8-1: Generic descriptions of the 2D and 3D descriptionAccepted
BS EN 61189-2-719 Ed.1 Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)Publication
BS EN 61189-3-913 ED.1 Test methods for electronic circuit board for high-brightness LEDsPublication
BS EN 61189-5-1 Test methods for electrical materials, Interconnection structures and assemblies Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and HandbooksPublic Comment
BS EN 61190-1-3 Ed 3.0 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applicationsApproval
BS EN 61191-1 Printed board assemblies Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologiesAccepted
BS EN 61191-2 Printed board assemblies Part 2: Sectional specification - Requirements for surface mount soldered assembliesAccepted
BS EN 61191-3 Printed Board Assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assembliesAccepted
BS EN 61191-4 Printed board assemblies Part 4: Sectional specification - Requirements for terminal soldered assembliesAccepted
BS EN 61196-1-110 Ed. 1.0 Coaxial communication cables Part 1-110: Electrical test methods - Test for continuityApproval
BS EN 61196-1-113 Coaxial communication cables Part 1-113: Electrical test methods - Test for attenuation constantAccepted
BS EN 61196-11 Ed1.0 Coaxial communication cables Part 11: Sectional specification for semi-rigid cables with polyethylene (PE) dielectricApproval
BS EN 61196-11-1 Ed.1 Coaxial communication cables Part 11-1: Blank detail specification for semi-rigid cables with polyethylene (PE) dielectricApproval
BS EN 61196-6-2 Coaxial communication cables Part 6-2: Detail specification for 75-4 type CATV drop cablesAccepted
BS EN 61196-6-3 Coaxial communication cables Part 6-3: Detail specification for 75-5 type CATV drop cablesAccepted
BS EN 61196-6-4 Coaxial communication cables Part 6-4: Detail specification for 75-7 type CATV drop cablesAccepted
BS EN 61215 Crystalline silicon terrestrial photovoltaic (PV) modules - Design qualification and type approvalPublication
BS EN 61215-1-1 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 1-1: Special requirements for testing of crystalline silicon photovoltaic (PV) modulesPublication
BS EN 61215-1-2 Terrestrial photovoltaic (PV) modules - Design qualification and typ approval Part 1-2: Special requirements for testing of cadmium telluride (CdTe) photovoltaic (PV) modulesPublic Comment
BS EN 61215-1-3 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 1-3: Special requirements for testing of amorphous silicon (a-Si) and microcrystalline silicon (micro c-Si) photovoltaic (PV) modulesPublic Comment
BS EN 61215-1-4 Terrestrial photovoltaic (PV) modules Design qualification and type approval Part 1-4: Special requirements for testing of copper indium gallium selenide (CIGS) and copper indium selenide (CIS) photovoltaic (PV) modulesPublic Comment
BS EN 61215-2 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 2: Test proceduresPublication
BS EN 61249-2-43 Ed1.0 other interconnecting structures Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublication
BS EN 61249-2-44 Ed1.0 other interconnecting structures Part 2-44: Reinforced base materials clad and unclad - Non-halogened epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublication
BS EN 61360-1 Standard data elements types with associated classification scheme forelectric items - Part 1: Definitions - Principles and methodsPublic Comment
BS EN 61360-6 QIEC Common Data Dictionary (IEC CDD) Quality guideApproval
BS EN 61587-1 Ed. 4.0 Mechanical structures for electronic equipment - Tests for IEC 60917 andIEC 60297 series Part 1: Environmental requirements; test set-up and safety aspects for cabinets; racks; subracks and chassis under indoor conditionsPublic Comment
BS EN 61587-6 Mechanical structures for electronic equipment Part 6: Security and performance for door locking handles for indoor cabinetsAccepted
BS EN 61724-1 Photovoltaic system performance Part 1: MonitoringPublic Comment
BS EN 61730-1 Ed 2.0 Photovoltaic (PV) module safety qualification Part 1: Requirements for constructionApproval
BS EN 61730-1:2007/A12 Photovoltaic (PV) module safety qualification - Part 1: Requirements for constructionPublic Comment
BS EN 61730-2 ED 2.0 Photovoltaic (PV) module safety qualification Part 2: Requirements for testingApproval
BS EN 61747-5-4 ED.1 Liquid crystal display devices Part 5-4: Environmental, endurance and mechanicaltest methods - Mechanical testing guidelines for display cover glass for display cover glass for mobile devicesnull
BS EN 61853-2 ED 1.0 Photovoltaic (PV) module performance testing and energy rating Part 2: Spectral response, incidence angle and module operating temperature measurementsApproval
BS EN 61853-3 Photovoltaic (PV) module performance testing and energy rating Part 3: Energy Rating of PV ModulesAccepted
BS EN 61853-4 Photovoltaic (PV) module performance testing and energy rating Part 4: Standard reference climatic profilesAccepted
BS EN 61935-1 SPECIFICATION FOR THE TESTING OF BALANCED AND COAXIAL INFORMATION TECHNOLOGY CABLING Part 1: Installed balanced cabling as specified in ISO/IEC 11801-1 and related standards.Accepted
BS EN 61935-1-1 TESTING OF BALANCED COMMUNICATION CABLING IN ACCORDANCE WITH ISO/IEC 11801 Part 1-1: Installed Cabling - Additional requirements for measurement of transverse conversion loss with field test instrumentation.Accepted
BS EN 61935-1-2 TESTING OF BALANCED COMMUNICATION CABLING IN A ACCORDANCE WITH ISO/IEC 11801 Part 1-2: Additional requirements for measurement of resistance unbalance with field test instrumentation.Accepted
BS EN 61935-2-21 Ed1.0 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-21: Cord and work area cord category 6- Blank detail specificationPublic Comment
BS EN 61935-2-22 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-22: Cord and work area cord category 6A- Blank detail specificationPublic Comment
BS EN 62047-25 Semiconductor devices - Micro-electromechanical devices Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding areaApproval
BS EN 62047-27 Semiconductor devices - Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)Public Comment
BS EN 62047-28 Semiconductor devices - Micro-electromechanical devices Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devicesPublic Comment
BS EN 62047-29 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperatureAccepted
BS EN 62047-30 Semiconductor devices - Micro-electromechanical devices Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin filmAccepted
BS EN 62090 Product package labels for electronic components using bar code and two-dimensional symbologiesAccepted
BS EN 62108 Ed 2.0 Concentrator photovoltaic (CPV) modules and assemblies - Design qualification and type approvalApproval
BS EN 62109-3 Safety of power converters for use in photovoltaic power systems Part 3: Particular requirements for electronic devices in combination with photovoltaic elementsAccepted
BS EN 62132-6 Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) methodnull
BS EN 62153-4-16 METALLIC COMMUNICATION CABLE TEST METHODS Part 4-16: Extension of the frequency range to higher frequencies for transfer impedance and to lower frequencies for screening attenuation measurements using the triaxial set-upPublic Comment
BS EN 62153-4-17 Metallic Communication Cable test methods - Part 4-17: Electromagnetic compatibility (EMC) – Reduction factor test methodAccepted
BS EN 62153-4-6 Metallic Communication Cable test methods Part 4-6: Electromagnetic compatibility (EMC) - Surface transfer impedan impedance - line injection methodAccepted
BS EN 62153-4-9 Metallic Communication Cable test methods Part 4-9: Electromagnetic compatibility (EMC) - Coupling attenuation of screened balanced cables, triaxial methodAccepted
BS EN 62228-2 Integrated circuits - EMC evaluation of LIN transceiversPublic Comment
BS EN 62341-6-1 Organic light emitting diode (OLED) displays Part 6-1: Measuring methods of optical and electro-optical parametersPublic Comment
BS EN 62341-6-3 Organic light emitting diode (OLED) displays Part 6-3: Measuring methods of image qualityAccepted
BS EN 62341-6-4 Organic light emitting diode (OLED) displays Part 6-4: Measuring methods of transparent propertiesPublic Comment
BS EN 62433-2 EMC IC modelling Part 2: Models of Integrated Circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)Public Comment
BS EN 62433-3 EMC IC modelling Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)Public Comment
BS EN 62433-4 Ed1.0 EMC IC modelling Part 4: Models of Integrated Circuits for RF immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI)Publication
BS EN 62435-1 Electronic components - Long-term storage of electronic semiconductor devices Part 1: GeneralApproval
BS EN 62435-2 Electronic components - Long-term storage of electronic semiconductor devices Part 2 - Deterioration MechanismsPublic Comment
BS EN 62435-5 Electronic components - Long-term storage of electronic semiconductor devices Part 5 - Die & Wafer DevicesPublic Comment
BS EN 62449 Connectors for electronic equipment – Product requirements – Detail specification for SCA-2 (Single Connector Attach -2) unshielded connectorsPublic Comment
BS EN 62451 HSSDC-2 Shielded ConnectorsAccepted
BS EN 62548 Photovoltaic (PV) arrays - Design requirementsPublic Comment
BS EN 62569-1 Generic specification of information on products - Part 1: Principles and methodsAccepted
BS EN 62610-5 Mechanical structures for electrical and electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 5: Cooling performance evaluation for indoor cabinetsPublication
BS EN 62629-13-1 3D Display devices Part 13-1:Visual inspection methods for stereoscopic displays using glassesAccepted
BS EN 62629-22-1 3D display devices Part 22-1: Measuring methods for autostereoscopic displays - OpticalPublic Comment
BS EN 62656-5 Standardized product ontology register and register by spreadsheets - Part 5: Interface for activity descriptionPublic Comment
BS EN 62670-3 Photovoltaic concentrators (CPV) - Performance testing Part 3: Performance measurements and power rating NULLPublic Comment
BS EN 62679-3-3 Electronic Paper Displays - Part 3-3: Optical measuring methods with integrated lighting unitPublic Comment
BS EN 62679-4-2 Electronic paper displays Part 4-2: Environmental test methodPublic Comment
BS EN 62688 ED 1.0 Concentrator photovoltaic (CPV) module and assembly safety qualificationAccepted
BS EN 62715-5-1 Flexible display devices Part 5-1: Measuring methods of optical performancePublic Comment
BS EN 62715-5-3 Flexible display devices Part 5-3: Visual assessmentPublic Comment
BS EN 62715-6-2 Flexible display devices Part 6-2: Environmental testing methodsAccepted
BS EN 62739-2 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal materials with surface processingPublication
BS EN 62739-3 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 3: Selection guidance of erosion test methodAccepted
BS EN 62783-1Ed.1 TWINAX CABLES FOR DIGITAL COMMUNICATIONS - Part 1: GENERIC SPECIFICATIONPublic Comment
BS EN 62783-2 TWINAX CABLES FOR DIGITAL COMMUNICATIONS Part 2: CABLE FOR ETHERNET-OVER-TWINAX PHYSICAL INTERFACESAccepted
BS EN 62788-1-2 Measurement procedures for materials used in photovoltaic modules Part 1-2: Encapsulants – Measurement of volume resistivity of photovoltaic encapsulants and other polymeric materialsPublication
BS EN 62788-1-4 Measurement procedures for materials used in Photovoltaic Modules Part 1-4: Encapsulants - Measurement of optical transmittance and calculation of the solar-weighted photon transmittance; yellowness index; and UV cut-off frequencyPublic Comment
BS EN 62788-1-5 Measurement procedures for materials used in photovoltaic modules Part 1-5: Encapsulants - Measurement of change in linear dimensions of sheet encapsulation material under thermal conditionsPublication
BS EN 62788-1-6 Measurement procedures for materials used in photovoltaic modules Part 1-6: Encapsulants - Test methods for determining the degree of cure in Ethylene-Vinyl Acetate encapsulation for photovoltaic modulesPublic Comment
BS EN 62788-2 Measurement procedures for materials used in photovoltaic modules Part 2: Polymeric materials used for frontsheets and backsheetsAccepted
BS EN 62807-1 Hybrid telecommunication cablesAccepted
BS EN 62812 Method of measurement of low resistanceAccepted
BS EN 62817 Ed 1.0 /A1 Amendment 1 to IEC 62817 Ed.1: Photovoltaic systems - Design qualification of solar trackersPublic Comment
BS EN 62830-1 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 1: Vibration based piezoelectric energy harvestingPublic Comment
BS EN 62830-2 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 2: Thermo power based thermoelectric energy harvestingPublic Comment
BS EN 62830-3 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 3: Vibration based electromagnetic energy harvestingPublic Comment
BS EN 62880-1 Semiconductor devices - Wafer Level Reliability for Semiconductor Devices Part 1: Copper Stress Migration Test MethodPublic Comment
BS EN 62891 Overall efficiency of grid connected photovoltaic invertersPublic Comment
BS EN 62892-1 Comparative testing of PV modules to differentiate performance in multiple climates and applications Part 1: Requirements for testingAccepted
BS EN 62894 Ed 1.0 /A1 Amendment 1 to IEC 62894 Ed.1: Photovoltaic inverters - Data sheet and name platePublic Comment
BS EN 62906-5-1 Laser display devices Part 5-1: Measurement of optical performance for laser front projectionAccepted
BS EN 62906-5-3 Laser display devices Part 5-3: Measuring methods of visual quality for laser projector displaysAccepted
BS EN 62908-13-10 Touch and interactive displays Part 13-10: Reliability test methods of touch displays- Environmental durability test methodsPublic Comment
BS EN 62920 EMC requirements and test methods for power conversion equipment applying to photovoltaic power generating systemsPublic Comment
BS EN 62925 Thermal cycling test for CPV modules to differentiate increased thermal fatigue durabilityPublic Comment
BS EN 62938 Non-uniform snow load testing for photovoltaic (PV) modulesAccepted
BS EN 62946-01 Connectors for electronic equipment - Part 01: Rectangular connectors - Detail specification for 8-way, shielded, free and fixed high density connectors for data transfer and with current up to 1A.Accepted
BS EN 62946-02 Electrical connectors Part 3-121: Rectangular connectors- detail specification for 8-way, unshielded, free and fixed high density connectors for data transfer and with Power Over Ethernet capabilities.Public Comment
BS EN 62951-1 Semiconductor devices - Flexible and stretchable semiconductor devices Part 1: Bending test method for conductive thin films on flexible substratesPublic Comment
BS EN 62956 Hybrid electric double layer capacitors for use in electric and electronic equipment - Test methods for electrical characteristicsAccepted
BS EN 62966-1 Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets Part 1: Dimensions and mechanical requirementsAccepted
BS EN 62969-1 Semiconductor devices - Semiconductor interface for automotive vehicles Part 1: General requirements of power interface for automotive vehicle sensorsAccepted
BS EN 62969-2 Semiconductor devices - Semiconductor interface for automotive vehicles Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensorsAccepted
BS EN 62969-3 Semiconductor devices - Semiconductor interface for automotive vehicles Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensorsAccepted
BS EN 62969-4 Semiconductor devices - Semiconductor interface for automotive vehicles Part 4: Evaluation method of data interface for automotive vehicle sensorsAccepted
BS EN 62979 Photovoltaic module bypass diode thermal runaway testAccepted
BS EN 63064 Guidance how to design graphical symbols for diagrams forstandardization and Inclusion in IEC 60617Idea
BS EN 81346-2 and equipment and industrial products- Structuring principles and reference designations - Part 2: Classification of objects and codes for classesAccepted
BS EN 82079-1 Ed 2.0 Preparation of instructions for use - Structuring, content andpresentation - Part 1: General principles and detailed requirementsAccepted
BS EN IEC 60317-67 Specifications for particular types of winding wires Part 67: Polyvinyl acetal enamelled rectangular aluminium wire, class 105Public Comment
BS EN ISO 11553-1 Safety of machinery - Laser processing machines Part 1: General safety requirementsAccepted
BS EN ISO 11553-2 Safety of machinery - Laser processing machines Part 2: Safety requirements for hand-held processing devicesAccepted
BS EN WI 00230337 Water quality - General requirements and performance test procedures for water monitoring equipment - Automated measuring devicesIdea
BS EN WI 00230340 Water quality - Guidance on field and laboratory procedures for quantitative analysis and identification of macro-invertebrates from inland surface watersIdea
BS ENISO 11508 Soil quality - Determination of particle densityPublic Comment
Opens a new windowBS ENISO 11272 Soil quality - Determination of dry bulk densityPublic Comment
BS ENISO 11504 soil contaminated with petroleum hydrocarbonsPublic Comment
BS ENISO 17601 Soil quality - Estimation of abundance of selected microbial gene sequences by quantitative realtime PCR from DNA directly extracted from soilAccepted
BS ENISO 18187 Soil quality - Contact test for solid samples using the dehydrogenase activity of Arthrobacter globiformisAccepted
BS ENISO 18311 Soil quality — Method for testing effects of soil contaminants on the feeding activity of soil dwelling organisms — Bait-lamina testAccepted
BS ENISO 19258 determination of background valuesPublic Comment
BS ENISO 5667-6 Water quality - Sampling Part 6: Guidance on sampling of rivers and streamsPublication
BS IEC 60050-726 Ed2.0 IEC 60050-726. International electrotechnical vocabulary. Transmissionlines and waveguidesPublic Comment
BS IEC 60153-4 Ed3.0 HOLLOW METALLIC WAVEGUIDES Part 4: Relevant specifications for circular waveguidesPublic Comment
BS IEC 61156-5 Ed3.0 cables for digital communications Part 5: Symmetrical pair/quad cables with transmission characteristics up to 1 000 MHz - Horizontal floor wiring -Sectional specificationAccepted
BS IEC 61156-6 Ed4.0 cables for digital communications Part 6: Symmetrical pair/quad cables with transmission characteristics up to 1 000 MHz - Work area wiring - Sectional specificationAccepted
BS IEC 61636 Ed1.0 Maintenance Information Collection and Analysis (SIMICA) (IEEE 1636-2009)Publication
BS IEC 61636-1 Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)(IEEE 1636.1-2013)Publication
BS IEC 61636-99 for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements (IEEE 1636.99 - 2013)Publication
BS IEC 62805-1 Ed.1.0Public Comment
BS IEC 62805-2 Ed1.0Public Comment
BS IEC 62908-1-2 Touch and interactive displays Part 1-2: Terminology and letter symbolsAccepted
BS IEC 62908-12-10 Touch and interactive displays Part 12-10: Touch performance measuring methodsAccepted
BS IEC 63055 LSI-Package-Board Interoperable Design (IEEE 2401-2015)Publication
BS IEC/TS 61724-2 Ed1.0 Photovoltaic system performance Part 2: Capacity evaluation methodApproval
BS IEC/TS 61724-3 Ed1.0 Photovoltaic system performance Part 3: Energy evaluation methodPublication
BS ISO 11260 Soil quality - Determination of effective cation exchange capacity and base saturation level using barium chloride solutionIdea
BS ISO 11274 Soil quality - Determination of the water-retention characteristic - Laboratory methodsPublic Comment
BS ISO 11277 Soil quality - Determination of particle size distribution in mineral soil material - Method by sieving and sedimentationIdea
BS ISO 14239 Soil quality - Laboratory incubation systems for measuring the mineralization of organic chemicals in soil under aerobic conditionsPublic Comment
BS ISO 14254 Soil quality - Determination of exchangeable acidity in barium chloride extractsIdea
BS ISO 14869-3 Soil quality - Dissolution for the determination of total element content Part 3: Dissolution with hydrofluoric and nitric acids using pressurised microwave techniquePublic Comment
BS ISO 15175 Soil quality - Characterization of soil related to groundwater protectionAccepted
BS ISO 16751 availability of non-polar organic compounds Part 1: Determination of potential availability using a strong absorbent or complexing agentPublic Comment
Opens a new windowBS ISO 17924 Soil quality - Assessment of human exposure from ingestion of soil and soil material - Guidance on the application and selection of physiologically based extraction methods for the estimation of the human bioaccessibility/bioavailability of metals inPublic Comment
BS ISO 18400-100 Soil quality - Sampling Part 100: UmbrellaPublic Comment
BS ISO 18400-101 Soil quality - Sampling Part 101: Framework for the preparartion and application of a sampling planApproval
BS ISO 18400-102 Soil quality - Sampling Part 102: Selection and application of sampling techniquesApproval
BS ISO 18400-103 Soil quality - Sampling Part 103: SafetyApproval
BS ISO 18400-104 Soil quality - Sampling Part 104: Strategies and statistical evaluationsAccepted
BS ISO 18400-105 Soil quality - Sampling Part 105: Package, transport, storage, preservationApproval
BS ISO 18400-106 Soil quality - Sampling Part 106: Quality control and quality assuranceApproval
BS ISO 18400-107 Soil quality - Sampling Part 107: Recording and reportingApproval
BS ISO 18400-201 Soil quality - Sampling Part 201: Pretreatment in the fieldApproval
BS ISO 18400-202 Soil quality - Sampling Part 202: Preliminary investigationsPublic Comment
BS ISO 18400-203 Soil quality - Sampling Part 203: Investigation of potentially contaminated sitesPublic Comment
BS ISO 18400-204 Soil quality - Sampling Part 204: Guidance on sampling of soil gasPublic Comment
BS ISO 18400-205 Soil quality - Sampling Part 205: Guidance on investigation of natural, near-natural and cultivates sitesAccepted
BS ISO 18400-206 Soil quality - Sampling Part 206: Guidance on the collection, handling and storage of soil under aerobic conditions for the assessment of microbiological processes, biomass and diversity in the laboratoryAccepted
BS ISO 18504 Soil quality - Guidance on sustainable remediationPublic Comment
BS ISO 18763 Determination of the toxic effects of pollutants on germination and early growth of higher plantsPublication
BS ISO 19204 Soil quality - Procedure for site-specific ecological risk assessment of soil contamination (TRIAD approach)Public Comment
BS ISO 20130 Soil quality - Measurement of enzyme activity patterns in soil samples using colorimetric substrates in micro-well platesAccepted
BS ISO 20131-1 Soil quality - Simple laboratory assessments for characterizing the denitrification in soil Part 1: Soil denitrifying enzymes activitiesAccepted
BS ISO 20131-2 Soil quality - Simple laboratory assessments for characterizing the denitrification in soil Part 2: Assessment of the capacity of soils to reduce N2OAccepted
BS ISO 20244 Soil quality --- On-site test method to quickly determine gravimetric water contents in soil by refractometryAccepted
BS ISO 20295 Soil quality - Determination of perchlorate in soil using ion chromatographyAccepted
BS ISO 23161 Soil quality - Determination of selected organotin compounds - Gas-chromatographic methodPublic Comment
BS ISO 23470 Soil quality - DeterminationAccepted
BS ISO 25177 Soil quality - Field soilAccepted
BS ISO 81346-12 Ed1.0 equipment and industrial products- Structuring principles and reference designations - Part 12: Construction worksAccepted
BS ISO/IEC 10373-1 Identification cards - Test methods Part 1: General characteristicsAccepted
BS ISO/IEC 10373-6 Identification cards - Test methods Part 6: Proximity cardsPublication
Opens a new windowBS ISO/IEC 10373-6 Identification cards - Test methods Part 6: Proximity cards - Amendment 3: Active and passive PICC transmissionsPublic Comment
Opens a new windowBS ISO/IEC 10373-6 Identification cards - Test methods Part 6: Proximity cards - Amendment 4: Conformance test planPublic Comment
Opens a new windowBS ISO/IEC 10373-6 Identification cards - Test methods Part 6: Proximity cards - Amendment 5: Test conditions for PICC wave shape reception testingPublic Comment
BS ISO/IEC 10373-6/Amd 1 Identification cards - Test methods Part 6: Proximity cards - Amendment 1: Frame with error correctionPublic Comment
BS ISO/IEC 10373-6/Amd 2 Identification cards - Test methods Part 6: Proximity cards - Amendment 2: Extension of PICC and PCD test methodsPublic Comment
BS ISO/IEC 10373-7:2008/Amd 1 Identification cards - Test methods Part 7: Vicinity cards - Amendment 1: Additional test methods for VICC cardsAccepted
BS ISO/IEC 10373-9 Identification cards - Test methods Part 9: Optical memory cards - Holographic recording methodAccepted
BS ISO/IEC 11695-3 Identification cards - Optical memory cards - Holographic recording method Part 3: Optical properties and characteristicsPublic Comment
Opens a new windowBS ISO/IEC 14443-1:2016 Contactless integrated circuit cards - Proximity cards Part 1: Physical characteristics - Amendment 1: Clarification of PICC classes definitionPublic Comment
Opens a new windowBS ISO/IEC 14443-2 Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 1: PICC's with external power supplyPublic Comment
BS ISO/IEC 14443-2 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interfacePublication
Opens a new windowBS ISO/IEC 14443-2/Amd 2 Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 2: Limits of electromagnetic disturbance levels for all PICC classesPublic Comment
BS ISO/IEC 14443-2/Amd 3 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 3: Dynamic power level managementAccepted
BS ISO/IEC 14443-3/Amd 2 Identification cards - Contactless integrated circuit cards - Proximity cards Part 3: Initialization and anticollision - Amendment 2: Dynamic power level managementAccepted
BS ISO/IEC 14443-3/Amdd 1 Identification cards - Contactless integrated circuit cards - Proximity cards Part 3: Initialization and anticollision - Amendmentd 1: Handling rules of RFU bitsPublic Comment
BS ISO/IEC 14443-4/Amd 3 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendment 3: Dynamic power level managementAccepted
BS ISO/IEC 14443-4/Amdd 1 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendmentd 1: Handling rules of RFU bitsPublic Comment
BS ISO/IEC 14443-4/Amdd 2 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendmentd 2: S(PARAMETERS) clarificationPublic Comment
BS ISO/IEC 15693-1 Identification cards - Contactless integrated circuit cards - Vicinity cards Part 1: Physical characteristicsAccepted
BS ISO/IEC 15693-3:2009 Contactless integrated circuit cards - Vicinity cards Part 3: Anticollision and transmission protocol - Amendment 4: Adding security frameworkPublic Comment
BS ISO/IEC 17826 Information technology - Cloud Data Management Interface (CDMI)Publication
BS ISO/IEC 17839-3 Information technology - Identification cards - Biometric system on card Part 3: Logical information interchange mechanismApproval
BS ISO/IEC 18013-1 Information technology - Personal identification - ISO-compliant driving licence Part 1: Physical characteristics and basic data setAccepted
BS ISO/IEC 18013-2 Information technology - Personal identification - ISO-compliant driving licence Part 2: Machine-readable technologiesAccepted
BS ISO/IEC 18013-3:2009 Amd 3 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 3: PACEApproval
BS ISO/IEC 18013-4:2011 Personal identification - ISO-compliant driving licence Part 4: Test methods - Amendment 1Public Comment
BS ISO/IEC 18013-5 Personal Identification - ISO Compliant Driving Licence Part 5: Mobile Driving Licence ApplicationAccepted
BS ISO/IEC 18328-3 Devices on cards Part 3: Organization, security and commands for interchangeApproval
BS ISO/IEC 18384-2 Information Technology - Reference Architecture for Service Oriented Architecture Part 2: Reference Architecture for SOA SolutionsPublication
BS ISO/IEC 18384-3 Information Technology - Reference Architecture for Service Oriented Architecture Part 3: SOA OntologyPublication
BS ISO/IEC 18745-1 Information technology - Test methods for machine readable travel documents (MRTD) and associated devices Part 1: Physical test methods for passport books (durability)Accepted
BS ISO/IEC 18745-2 travel documents (MRTD) Part 2: Test methods for the contactless interfaceApproval
BS ISO/IEC 18745-3 Test methods for machine readable travel documents (MRTD) Part 3: LDS and security protocolsAccepted
BS ISO/IEC 19086-1 Information technology - Cloud computing - Service level agreement (SLA) framework and Technology Part 1: Overview and conceptsApproval
BS ISO/IEC 19086-3 Information technology - Cloud computing - Service Level Agreement (SLA) Framework Part 3: Core conformance requirementsPublic Comment
BS ISO/IEC 19286 Identification cards - Integrated circuit cards - ICC protocols and services ensuring privacyAccepted
BS ISO/IEC 19944 Information Technology - Cloud computing - Cloud servic es and devices: data flow, data categories and data useAccepted
BS ISO/IEC 24787 Information technology - Identification cards - On-card biometric comparisonAccepted
BS ISO/IEC 7810 Identification cards - Physical characteristicsAccepted
Opens a new windowBS ISO/IEC 7812-1 Identification cards - Identification of issuers Part 1: Numbering systemPublic Comment
Opens a new windowBS ISO/IEC 7812-2 Identification cards - Identification of issuers Part 2: Application and registration proceduresPublic Comment
BS ISO/IEC 7816-11 Identification cards - Integrated circuit cards Part 11: Personal verification through biometric methodsPublic Comment
BS ISO/IEC 7816-8 Identification cards - Integrated circuit cards Part 8: Commands for security operationsApproval
BS ISO/IEC 7816-9 Identification cards - Integrated circuit cards Part 9: Commands for card managementAccepted
BS ISO/IEC I 19941 Information Technology - Cloud Computing - Interoperability and PortabilityAccepted
PD CEN/TS 419221-1 Security requirements for trustworthy systems managing certificates for electronic signatures Part 1: Overview of the cryptographic modulesPublication
PD CEN/TS 419221-2 Security Requirements for Trustworthy Systems Managing Certificates for Electronic Signatures Part 2: Cryptographic Module for CSP signing operations with backup - Protection profile (CMCSOB-PP)Publication
PD CEN/TS 419221-3 Security Requirements for Trustworthy Systems Managing Certificates for Electronic Signatures Part 3: Cryptographic module for CSP key generation services - Protection profile (CMCKG-PP)Publication
PD CEN/TS 419221-4 Security Requirements for Trustworthy Systems Managing Certificates for Electronic Signatures Part 4: Cryptographic module for CSP signing operations - Protection profile - CMCSO PPPublication
PD CLC/TR 50670 External fire exposure to roofs in combination with photovoltaic (PV) arrays – Test method(s)Approval
PD IEC/TR 60825-5 Ed 3.0 Safety of laser products Part 5: Manufacturer's checklist for IEC 60825-1Accepted
PD IEC/TR 61156-1-6 Ed1.0 pair/quad cables for digital communications Part 1-6: Exploratory DC-resistance values of floor-wiring and work-area cables for digital communicationsApproval
PD IEC/TR 61189-3-914 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - GuidelinesAccepted
PD IEC/TR 62153-4-16 Ed1.0 METALLIC COMMUNICATION CABLE TEST METHODS Part 4-16: Extension of the frequency range to higher frequencies for transfer impedance and to lower frequencies for screening attenuation measurements using the triaxial set-upApproval
PD IEC/TR 62471-4 Ed1.0 Photobiological Safety of Lamps and Lamp systems: Part 4: Measuring MethodsAccepted
PD IEC/TR 62679-5-1 Electronic paper displays Part 5-1: Legibility of EPD in spatial frequencyAccepted
PD IEC/TR 62839-2 Environmental declaration Part 2: Optical/copper telecom accessories products specific rulesAccepted
PD IEC/TR 62977-2-3 Ed 1.0 Electronic display devices Part 2-3: Measurements of optical properties - Multi-colour test patternsAccepted
PD IEC/TR 63051 Ed 1.0 Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)Approval
PD IEC/TS 60904-12 Ed 1.0 Photovoltaic devices Part 12: Infrared thermography of photovoltaic modulesAccepted
PD IEC/TS 60904-13 Ed 1.0 Photovoltaic devices Part 13: Electroluminescence of photovoltaic modulesAccepted
PD IEC/TS 61189-3-301 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWBPublication
PD IEC/TS 61586 Estimation of the reliability of electrical connectorsPublication
PD IEC/TS 61836 Ed 3.0 Solar photovoltaic energy systems - Terms; definitions and symbolsApproval
PD IEC/TS 62257-9-1 Ed 2.0 Recommendations for renewable energy and hybrid systems for rural electrification Part 9-1: Micropower systemsPublication
PD IEC/TS 62257-9-2 Ed 2.0 Recommendations for renewable energy and hybrid systems for rural electrification Part 9-2: MicrogridsPublication
PD IEC/TS 62257-9-3 Ed 2.0 Recommendations for renewable energy and hybrid systems for rural electrification Part 9-3: Integrated system - User interfacePublication
PD IEC/TS 62257-9-4 Ed 2.0 Recommendations for renewable energy and hybrid systems for rural electrification Part 9-4: Integrated system - User installationPublication
PD IEC/TS 62257-9-5 Ed 3.0 Recommendations for renewable energy and hybrid systems for rural electrification Part 9-5: Integrated systems - Selection of stand-alone lighting kits for rural electrificationPublication
PD IEC/TS 62446-3 Ed 1.0 Photovoltaic (PV) systems - Requirements for testing; documentation and maintenance Part 3: Outdoor infrared thermography of photovoltaic modules and plantsAccepted
PD IEC/TS 62450 Technical Specification for 40 pin SCA 2 connector with parallel selectionPublic Comment
PD IEC/TS 62452 Testing and performance requirements for high speed serial and parallel- serial copper linksAccepted
PD IEC/TS 62666 Guidelines for the inclusion of documentation aspects in productstandardsPublication
PD IEC/TS 62738 Ed 1.0 Design guidelines and recommendations for photovoltaic power plantsAccepted
PD IEC/TS 62788-7-2 Ed 1.0 Measurement procedures for materials used in photovoltaic modules Part 7-2: Environmental exposures - Accelerated weathering tests of polymeric materialsAccepted
PD IEC/TS 62915 Ed 1.0 Photovoltaic (PV) Modules - Retesting for type approval; design and safety qualificationPublication
PD IEC/TS 62916 Ed 1.0 Bypass diode electrostatic discharge susceptibility testing for photovoltaic modulesPublication
PD ISO/IEC/TR 20439 Identification Cards - Guidelines - Reserved for ISO Future USEAccepted
PD ISO/TR 19588 Background information and guidance on environmental cyanide analysisPublication

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Published standards (135)

Sort by: Reference | Title | Status

Standard referenceNameStatus
BS EN 61523-1:2002Delay and power calculation standards - Integrated circuit delay and power calculation systemsCurrent
BS EN 62433-2:2010EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)Current, Work in Hand
PD IEC/TR 62433-2-1:2010EMC IC modelling - Theory of black box modelling for conducted emissionCurrent
DD IEC/TS 62433-1:2011EMC IC modelling - General modelling frameworkCurrent
BS EN 165000-2:1996Film and hybrid integrated circuits - Internal visual inspection and special testsCurrent
BS EN 165000-1:1996Film and hybrid integrated circuits - Generic specification. Capability approval procedureCurrent
BS EN 165000-3:1996Film and hybrid integrated circuits - Self-audit checklist and report for film and hybrid integrated circuit manufacturersCurrent
BS EN 165000-4:1996Film and hybrid integrated circuits - Customer information, product assessment level schedules and blank detail specificationCurrent
BS EN 165000-5:1998Film and hybrid integrated circuits - Procedure for qualification approvalCurrent
DD ENV 190000-6:1994Generic specification: monolithic integrated circuits - Procedure for approval and quality managementCurrent
BS EN 190116:1994Harmonized system of quality assessment for electronic components. Family specification: AC MOS digital integrated circuitsCurrent
BS QC 760000:1990Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specificationCurrent
BS QC 760001:1994Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Generic specification. Requirements for internal visual inspectionCurrent
BS CECC 63000:1990Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuitsObsolescent
BS CECC 90000:1985Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS CECC 90000:1991Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS EN 190000:1996Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsCurrent
BS CECC 90000:Addendum No. 1:1983Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits. Internal visual inspectionObsolescent
BS CECC 90300:1988Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuitsCurrent
BS QC 760101:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval proceduresCurrent
BS QC 760201:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760100:1991Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film and hybrid integrated circuits: qualification approvalWithdrawn
BS QC 760200:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760100:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval proceduresCurrent
BS QC 760200:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approvalWithdrawn
BS QC 790101:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integrated circuits excluding hybrid circuitsCurrent
BS CECC 00013:1985Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor diceWithdrawn
BS CECC 90200:1988Harmonized system of quality assessment for electronic components: sectional specification: analogue monolithic integrated circuitsCurrent, Work in Hand
BS EN 190100:1993Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuitsCurrent, Work in Hand
BS CECC 63100:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuitsObsolescent
BS CECC 63200:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS ISO/IEC 14443-1:2000Identification cards. Contactless integrated circuit(s) cards. Proximity cards - Physical characteristicsWithdrawn
DD IEC/TS 62228:2007Integrated circuits. EMC evaluation of CAN transceiversCurrent
BS EN 61943:1999Integrated circuits. Manufacturing line approval application guidelineCurrent
BS EN 61967-8:2011Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. IC stripline methodCurrent
PD IEC/TR 61967-1-1:2010Integrated circuits. Measurement of electromagnetic emissions - General conditions and definitions. Near-field scan data exchange formatWithdrawn
PD IEC/TS 61967-3:2014Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. Surface scan methodCurrent
PD IEC/TR 61967-1-1:2015Integrated circuits. Measurement of electromagnetic emissions - General conditions and definitions. Near-field scan data exchange formatCurrent
PD IEC/TR 61967-4-1:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4Current
BS EN 61967-6:2002+A1:2008Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Magnetic probe methodCurrent
BS EN 61967-5:2003Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Workbench Faraday Cage methodCurrent
BS EN 61967-4:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 ohm/150 ohm direct coupling methodCurrent
BS EN 61967-1:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - General conditions and definitionsCurrent
BS EN 61967-2:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of radiated emissions. TEM cell and wideband TEM cell methodCurrent
DD IEC/TS 61967-3:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz - Measurement of radiated emissions. Surface scan methodWithdrawn
BS EN 62132-8:2012Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. IC stripline methodCurrent
BS EN 62132-1:2016Integrated circuits. Measurement of electromagnetic immunity - General conditions and definitions Current
BS EN 62132-2:2011Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. TEM cell and wideband TEM cell methodCurrent
PD IEC/TS 62132-9:2014Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. Surface scan methodCurrent
BS EN 62132-1:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - General conditions and definitionsWithdrawn
BS EN 62132-3:2007Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) methodCurrent
BS EN 62132-5:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Workbench Faraday cage methodCurrent
BS EN 62132-4:2006Integrated circuits. Measurement of electromagnetic immunity. 150 kHz to 1 GHz - Direct RF power injection methodCurrent
DD IEC/TS 62215-2:2007Integrated circuits. Measurement of impulse immunity - Synchronous transient injection methodCurrent
BS EN 62215-3:2013Integrated circuits. Measurement of impulse immunity - Non-synchronous transient injection methodCurrent
BS EN 61964:1999Integrated circuits. Memory devices pin configurationsCurrent
DD IEC/TS 62404:2007Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)Current
PD IEC/TR 61352:2006Mnemonics and symbols for integrated circuitsCurrent
BS 7240:1990Pin allocations for microprocessor systems using the IEC 603-2 connectorWithdrawn
BS EN 62090:2003Product package labels for electronic components using bar code and two-dimensional symbologiesCurrent
BS 9491:1975Rules for the preparation of detail specifications for analogue integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9492:1978Rules for the preparation of detail specifications for capacitively coupled digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9490:1975Rules for the preparation of detail specifications for digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9493:1981Rules for the preparation of detail specifications for integrated circuits of assessed quality which perform mixed digital and/or analogue functionsWithdrawn
BS 9460:1974Rules for the preparation of detail specifications for integrated circuits of assessed quality: differential operational amplifiers. General application categoryWithdrawn
BS 9430:1978Rules for the preparation of detail specifications for integrated circuits of assessed quality: voltage regulators. Full assessment levelWithdrawn
BS EN 60747-16-1:2002+A1:2007Semiconductor devices - Microwave integrated circuits. AmplifiersCurrent, Work in Hand
BS 6493-3:1985Semiconductor devices - Mechanical and climatic test methodsWithdrawn
BS EN 60747-16-10:2004Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuitsCurrent
BS IEC 60747-10:1991Semiconductor devices - Generic specification for discrete devices and integrated circuitsCurrent
BS IEC 60747-4-1:2000Semiconductor devices. Discrete devices - Microwave diodes and transistors. Microwave field effect transistors. Blank detail specification - BDS for microwave field-effect transistorsWithdrawn
BS IEC 60747-4-2:2000Semiconductor devices. Discrete devices - Microwave diodes and transistors. Integrated-circuit microwave amplifiers. Blank detail specificationWithdrawn
BS 6493-2-2.4:1989Semiconductor devices. Integrated circuits - Recommendations for interface integrated circuitsWithdrawn
BS IEC 60748-11:2000Semiconductor devices. Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuitsCurrent
BS IEC 60748-1:2002Semiconductor devices. Integrated circuits - GeneralCurrent
BS IEC 60748-23-5:2003Semiconductor devices. Integrated circuits - Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approvalCurrent
BS IEC 60748-2:1997Semiconductor devices. Integrated circuits - Digital integrated circuitsCurrent
BS 6493-2-2.2:1986Semiconductor devices. Integrated circuits - Recommendations for digital integrated circuitsWithdrawn
BS 6493-2.3:1987Semiconductor devices. Integrated circuits - Recommendations for analogue integrated circuitsCurrent
BS 6493-2.1:1985Semiconductor devices. Integrated circuits - GeneralWithdrawn
BS IEC 60748-4-3:2006Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)Current
BS IEC 60748-5:1997Semiconductor devices. Integrated circuits - Semicustom integrated circuitsCurrent
BS IEC 60748-4:1997Semiconductor devices. Integrated circuits - Interface integrated circuitsCurrent
BS IEC 60748-2-20:2008Semiconductor devices. Integrated circuits - Digital integrated circuits. Family specification. Low voltage integrated circuitsCurrent
BS IEC 60748-2-11:1999Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated circuits electrically erasible and programmable read-only memoryCurrent
BS IEC 60748-2-20:2000Semiconductor devices. Integrated circuits. Digital integrated circuits - Family specification. Low voltage integrated circuitsWithdrawn
BS IEC 60748-2-12:2001Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)Current
BS IEC 60748-23-3:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Manufacturers' self-audit checklist and reportCurrent
BS IEC 60748-23-2:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Internal visual inspection and special testsCurrent
BS IEC 60748-23-4:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Blank detail specificationCurrent
BS IEC 60748-23-1:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Generic specificationCurrent
BS CECC 90112:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write dynamic memories silicon monolithic circuitsCurrent
BS CECC 90111:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write static memories silicon monolithic circuitsCurrent
BS CECC 90113:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS ultra-violet light erasable electrically programmable read only memories silicon monolithic circuitsCurrent
BS CECC 90115:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital gate array integrated circuitsCurrent
BS EN 190110:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital microprocessor integrated circuitsCurrent
BS CECC 63101:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuitsObsolescent
BS CECC 63201:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS CECC 90105:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fusible link programmable bipolar read only memories, silicon monolithic integrated circuitsCurrent
BS CECC 90203:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated analogue switching circuitsCurrent
BS CECC 90301:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated line transmitters and receiversCurrent
BS CECC 90114:1990Specification for harmonized system of quality assessment for electronic components. Blank detail specification: programmable logic arrays (PLA)Current
BS EN 190106:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced low power SCHOTTKY digital integrated circuits series 54 ALS, 74 ALSCurrent
BS EN 190108:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced SCHOTTKY digital integrated circuits series 54 AS, 74 ASCurrent
BS EN 190107:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL FAST digital integrated circuits series 54 F, 74 FCurrent
BS CECC 90104:1981Specification for harmonized system of quality assessment for electronic components. Family specification: C. Mos digital integrated circuits, series 4000B and 4000UBCurrent
BS EN 190109:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCUCurrent, Work in Hand
BS EN 190101:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84Current
BS CECC 90101:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits, series 54, 64, 74, 84Current
BS CECC 90103:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS EN 190103:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS CECC 90102:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SWithdrawn
BS EN 190102:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SCurrent
BS QC 790132:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)Current
BS QC 790131:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Complementary MOS digital integrated circuits (series 4000 B and 4000 UB)Current
BS QC 760201:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approvalWithdrawn
BS QC 760101:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedureWithdrawn
BS QC 790130:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)Current
BS QC 790105:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Integrated circuit fusible-link programmable bipolar read-only memoriesCurrent
BS QC 790304:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear analogue-to-digital converters (ADC)Current
BS QC 790303:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear digital-to-analogue converters (DAC)Current
BS QC 790202:1991Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Monolithic integrated operational amplifiersCurrent
BS QC 790111:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification: integrated circuit static read/write memoriesCurrent
BS QC 790107:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. Integrated circuit dynamic read/write memoriesCurrent
BS QC 790106:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. MOS ultraviolet light erasable electrically programmable read-only memoriesCurrent
BS QC 790104:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification. Complementary MOS digital integrated circuits, series 4000 B and 4000 UBCurrent
BS QC 790110:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Blank detail specification. Microprocessor integrated circuitsCurrent
BS QC 790109:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCUCurrent
BS 9450:1998Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of testWithdrawn
BS 9450:1975Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of testWithdrawn
BS 9400:1970Specification for integrated electronic circuits and micro-assemblies of assessed quality (qualification approval procedures): generic data and methods of testWithdrawn
BS 3363:1980Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 1:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 2:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS IEC 62528:2007Standard testability method for embedded core-based integrated circuitsCurrent

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