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Integrated circuits & microelectronics

Standards in development (412)

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Standard TitleStatus
BS 8485 Code of practice for the characterization and remediation from groundgas in affected developmentsIdea
BS EN 00125157 Guidance on the application of statistical methods for determining the properties of masonry productsIdea
BS EN 1015-12 Methods of test for mortar for masonry Part 12: Determination of adhesive strength of hardened rendering and plastering mortars on substratesIdea
BS EN 1015-2 Methods of test for masonry Part 2: Determination of flexural strengthIdea
BS EN 1052-2 Methods of test for masonry Part 2: Determination of flexural strengthIdea
BS EN 140402 Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistorsApproval
BS EN 140402-801 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2Idea
BS EN 1545-1 Identification card systems - Surface transport applications Part 1: elementary data types, general code lists and general data elementsPublication
BS EN 1545-2 Identification card systems - Surface transport applications Part 2: Transport and travel payment related data elements and code listsPublication
BS EN 419111-1 Protection profiles for signature creation and verification application Part 1: Introduction to the European NormPublic Comment
BS EN 419111-2 Protection profiles for signature creation and verification application - Signature creation application Part 2: Core PPPublic Comment
BS EN 419111-3 Protection profiles for signature creation and verification application - Signature creation application Part 3: Possible extensionsPublic Comment
BS EN 419111-4 Protection profiles for signature creation and verification application - Signature verification application Part 4: Core PPPublic Comment
BS EN 419111-5 Protection profiles for signature creation and verification application - Signature verification application Part 5: Possible extensionsPublic Comment
BS EN 419211-1 Protection Profile for Secure Signature Creation Device Part 1: OverviewPublication
BS EN 419211-6 Protection Profile for Secure Signature Creation Device Part 6: Extension for device with key import and trusted channel to signature creation applicationPublication
BS EN 419212-1 Application Interface for smart cards used as Secure Signature Creation Devices Part 1: Basic servicesPublication
BS EN 419212-2 Application Interface for smart cards used as Secure Signature Creation Devices Part 2: Additional ServicesPublication
BS EN 50117-4-2 Coaxial cables Part 4-2: Sectional specification for CATV cables up to 6 GHz used in cables distribution networksIdea
BS EN 50155 Railway applications - Electronic equipment used on rolling stockAccepted
BS EN 50288-10-2 Multi-element metallic cables used in analogue and digital communication and control Part 10-2: Sectional specification for screened cables characterized from 1 MHz up to 500 MHz - Horizontal and building backbone cablesPublic Comment
BS EN 50288-11-2 Multi-element metallic cables used in analogue and digital communication and control Sectional specification for un-screened cables, characterized from 1 MHz up to 500 MHz - Horizontal and building backbone cablesPublic Comment
BS EN 50288-9-2 Multi-element metallic cables used in analogue and digital communication and control Part 9-2: Sectional specification for screened cables characterised from 1 MHz uo to 1000 MHz - Work area, patch cord and data centre cablesPublic Comment
BS EN 50289-1-17 Communications cables – Specifications for test methods Part 1-17: Electrical test methods – Exogenous Crosstalk ExNEXT and ExFEXTAccepted
BS EN 50290-2-21:2001+A1:2007+Corr Common design rules and construction. PVC insulation compoundsnull
BS EN 50290-2-33 Communication cables Part 2-33: Common design rules and construction - Polyethylene for multi element metallic data cables for indoor applicationIdea
BS EN 50290-2-37 Communication cables Part 2-37: Common design rules and construction - Polyethylene insulation for coaxial cablesIdea
BS EN 50290-2-38 Communication cables Part 2-38: Common design rules and construction - Polypropylene insulation for coaxial cablesIdea
BS EN 50290-4-1 Ed.2 prEN 50290-4-1 ed.2 : Communication cables Part 4-1: General considerations for the use of cables - Environmental conditions and safety aspectsApproval
BS EN 50290-4-2 Ed.2 prEN 50290-4-2 ed.2 : Communication cables Part 4-2: General considerations for the use of cables - Guide to useApproval
BS EN 50405 Railway applications - Current collection systems - Pantographs, testing methods for contact stripsAccepted
BS EN 50449 Electromagnetic devices and components - General specificationApproval
BS EN 50502 Railway applications - Rolling stock - Electric equipment in trolley buses - Safety requirements and connection systemsPublic Comment
BS EN 50548:2011/A2 Junction boxes for photovoltaic modulesAccepted
BS EN 50583 Photovoltaics in buildingsPublic Comment
BS EN 50882-11 Multi-element metalic cables used in analogue and digital communication and control Part 11: Sectional specification for un-screened cables, characterised up to 500 MHz, for horizontal and building backbone wiringPublic Comment
BS EN 60062 Ed 6.0 Marking codes for resistors and capacitorsAccepted
BS EN 60063 Preferred number series for resistors and capacitorsPublic Comment
BS EN 60068-2 -69 Ed 3.0 Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) methodPublic Comment
BS EN 60068-2-58 ED.4 Environmental testing - Part 2-58: Tests Td- Test methodds for solderability, resistance to dissolution of metalization and to soldering heat of surface mounting devices (SMD)Public Comment
BS EN 60068-2-69 Ed 3.0 Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) methodAccepted
BS EN 60068-3-13 Environmental testing - Part 3-13: Supporting documentation and guidance on test T: SolderingPublic Comment
BS EN 60077-1 Ed. 2.0 Railway applications - Electric equipment for rolling stock Part 1: General service conditions and general rulesIdea
BS EN 60077-2 Ed. 2.0 Electric equipment for rolling stock Part 2: Electrotechnical components - General rulesIdea
BS EN 60096-0-1 Ed.3 Amd 1 Radio frequency cables Part 0-1: Guide to the design of detail specifications - Coaxial cables, Amendment 1null
BS EN 60115-2 Fixed resistors for use in electronic equipment. Part 2: Sectional specification: Fixed low-power non-wirewound resistorsPublication
BS EN 60115-22014+A1 Fixed resistors for use in electronic equipment Part 2: Sectional specification: Leaded fixed low power film resistorsnull
BS EN 60115-8-1 Fixed resistors for use in electronic equipment Part 8-1: Blank detail specification - Fixed chip resistors. Assessment level EPublication
BS EN 60153-1 HOLLOW METALLIC WAVEGUIDES Part 1: General requirements and measuring methodsPublic Comment
BS EN 60153-2 Ed 3.0 HOLLOW METALLIC WAVEGUIDES Part 2: Relevant specifications for ordinary rectangular waveguidesPublic Comment
BS EN 60154-1 Ed 3.0 FLANGES FOR WAVEGUIDES Part 1: General requirementsPublic Comment
BS EN 60154-2 Ed 3.0 FLANGES FOR WAVEGUIDES Part 2: Relevant specifications for flanges for ordinary rectangular waveguidesPublic Comment
BS EN 60172 Test procedure for the determination of the temperature index of enamelled winding wiresPublic Comment
BS EN 60191-1 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devicesAccepted
BS EN 60191-2/F67 Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.Public Comment
BS EN 60191-2/F68 Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.Public Comment
BS EN 60191-2/F69 Proposed new package outline - flange mount package with flat leads, PSFM- F8 - To be published as outline 187E, if approved.Public Comment
BS EN 60191-2/F70 Proposed new package outline - P-ZMP-P165Accepted
BS EN 60191-2/F71 Proposed new package outline - P-ZMP-P89Accepted
BS EN 60191-6-1 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductir device packages - Design guide for gull-wing lead terminalsPublic Comment
BS EN 60191-6-13 Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)Public Comment
BS EN 60191-6-14 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)Accepted
BS EN 60191-6-15 Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages –Measuring methods for package dimensions of small outline packages (SOP)Accepted
BS EN 60191-6-16 Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAAccepted
BS EN 60194 ED.6 Printed board design, manufacture and assembly - Terms and definitionsApproval
BS EN 60195 Method of measurement of current noise generated in fixed resistorsAccepted
BS EN 60286-2 Packaging of components for automatic handling Part 2: Tape packaging of components with unidirectional leads on continuous tapesPublic Comment
BS EN 60297-3-108 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 108: Dimensions of R-type subracks and plug-in unitsPublication
BS EN 60297-3-109 Mechanical structures for electronic equipment - Dimensions ofmechanical structures of the 482,6 mm (19 in) series - Part 109: dimensions of chassis for embedded computingAccepted
BS EN 60310 ED 4.0 Railway applications - Traction transformers and inductors on board rolling stockPublic Comment
BS EN 60317-0-4 Specifications for particular types of winding wires - Part 0-4: General requirements - Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wireAccepted
BS EN 60317-0-9 Specifications for particular types of winding wires - Part 0-9: General requirements - Enamelled rectangular aluminium wirePublic Comment
BS EN 60317-1 Specifications for particular types of winding wires – Part 1: Polyvinyl acetal enamelled round copper wire, class 105Idea
BS EN 60317-31 Specifications for particular types of winding wires - Part 31: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 180Public Comment
BS EN 60317-32 Specifications for particular types of winding wires - Part 32: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 155Public Comment
BS EN 60317-33 Specifications for particular types of winding wires - Part 33: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200Public Comment
BS EN 60317-35:2012 Specifications for particular types of winding wires Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layerApproval
BS EN 60317-39 Specifications for particular types of winding wires - Part 39: Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 180Public Comment
BS EN 60317-4 Specifications for particular types of winding wires - Part 4: Solderable polyurethane enamelled round copper wire, class 130Public Comment
BS EN 60317-40 Specifications for particular types of winding wires - Part 40: Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200Public Comment
BS EN 60317-59 Specifications for particular types of winding wires - Part 59: Polyamide-imide enameled round copper wire, class 240Accepted
BS EN 60352-5:2012/Cor 1 Solderless Connections - Part 5: Press-in connections - General requirements, test methods and practical guidancePublication
BS EN 60384-1 Fixed capacitors for use in electronic equipment - Part 1: Generic specificationPublic Comment
BS EN 60384-14 Ed 4.0 /A1 Fixed capacitors for use in electronic equipment Part 14: Sectional specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mainsAccepted
BS EN 60384-14-1 Ed 3.0 Fixed capacitors for use in electronic equipment Part 14-1: Blank detail specification: Fixed capacitors for electromagnetic interference suppression and connection to the supply mains - Assessment level DZAccepted
BS EN 60384-14-2 Ed 2.0 Fixed capacitors for use in electronic equipment Part 14-2: Blank detail specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mains - Safety tests onlyAccepted
BS EN 60384-18 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyteAccepted
BS EN 60384-19 Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene- terephthalate film dielectric surface mount d.c. capacitorsPublic Comment
BS EN 60384-20 Fixed capacitors for use in electronic equipment Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitorsPublic Comment
BS EN 60384-23 Fixed capacitors for use in electronic equipment - Part 23: Sectional specification: Fixed surface mount metallized polyethylene naphthalate film dielectric d.c. capacitorsPublic Comment
BS EN 60384-24 Fixed capacitors for use in electronic equipment Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolytePublic Comment
BS EN 60384-25 Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolytePublic Comment
BS EN 60384-3 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification: Surface mount fixed tantalum electrolyt capacitors with manganese dioxide solid electrolyteAccepted
BS EN 60384-4 Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyteAccepted
BS EN 60384-8 Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1Public Comment
BS EN 60384-9 Fixed capacitors for use in electronic equipment - Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2Public Comment
BS EN 60512-1-101 Connectors for electronic equipment - Basic testing and measurements Part 1-101x: Blank detail specificationPublic Comment
BS EN 60512-17-5 Connectors for electronic equipment - Tests and measurements - Part 17-5: Cable clamping tests - Test 17X: Cable clamp resistance to dynamic cablenull
BS EN 60539-1 Directly heated negative temperature coefficient thermistors Part 1: Generic specificationPublic Comment
BS EN 60603-7+A2 Connectors for electronic equipment Part 7: Detail specification for 8-way, unshielded, free and fixed connectorsAccepted
BS EN 60603-7-81 Connectors for electronic equipment Part 7-81: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 2000 mhzAccepted
BS EN 60603-7-82 Connectors for electronic equipment Part 7-82: Detail specification for 8-way, shielded, individual pair shielded, free and fixed connectors, for data transmission with frequencies up to 2 000 mhzAccepted
BS EN 60747-14-6 ED 1.0 Semiconductor devices Part 14-6: Semiconductor sensors - Humidity sensorAccepted
BS EN 60747-14-7 ED 1.0 Semiconductor devices Part 14-7: Semiconductor sensors - Flow meterAccepted
BS EN 60747-14-8 ED 1.0 Semiconductor devices Part 14-8: Semiconductor sensors - Capacitive degradation sensor of liquidAccepted
BS EN 60747-16-1 Ed1.0 Amd 2 Semiconductor devices Part 16-1: Microwave integrated circuits - AmplifiersAccepted
BS EN 60747-2 Semiconductor devices - Discrete devices - Part 2 : Rectifier diodesPublic Comment
BS EN 60747-3 Semiconductor devices Part 3: Signal (including switching diodes) and regulator diodesPublication
BS EN 60747-4 Ed2.0 Amd 1 Semiconductor devices - Discrete devices Part 4: Microwave diodes and transistors Amendment 1Accepted
BS EN 60747-5-5+A1 Semiconductor devices - Discrete devices Part 5-5: Optoelectronic devices – PhotocouplersPublication
BS EN 60747-5-5:2011/A1 Semiconductor devices - Discrete devices Part 5-5: Optoelectronic devices- Photocouplersnull
BS EN 60747-5-6 Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodesPublic Comment
BS EN 60747-5-7 Semiconductor devices - Discrete devices - Part 5-7: Photodiodes and phototransistorsPublic Comment
BS EN 60747-6 Ed 3.0 Semiconductor devices - Discrete devices Part 6 : ThyristorsAccepted
BS EN 60747-6 Semiconductor devices - Discrete devices Part 6 : ThyristorsPublic Comment
BS EN 60749-28 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Charged Device Model (CDM)Public Comment
BS EN 60749-42 Semiconductor devices - mechanical and climatic test methods Part 42: Temperature humidity storagePublication
BS EN 60749-43 Semiconductor devices - mechanical and climatic test methods Part 43: Guidelines for LSI reliability qualification plansAccepted
BS EN 60749-44 Semiconductor devices - Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devicesAccepted
BS EN 60825-12 ED.2 Safety of laser products Part 12: Safety of free space optical communication systems used for transmission of informationAccepted
BS EN 60825-14 ED.2 Safety of laser products Part 14: A user's guideAccepted
BS EN 60825-17 ED.2 Safety aspects for use of passive optical components and optical cables in high power optical fibre communication systemsApproval
BS EN 60851-2:2009+A1 Winding wires - Test methods Part 2: Determination of dimensionsPublic Comment
BS EN 60851-4 Winding wires - Methods of test for winding wires - Part 4: Chemical propertiesAccepted
BS EN 60904-2 Ed 3.0 Photovoltaic devices Part 2: Requirements for reference solar devicesApproval
BS EN 60904-8 ED 3.0 Photovoltaic devices Part 8: Measurement of spectral response of a photovoltaic (PV) deviceApproval
BS EN 60939-3 Passive filter units for electromagnetic interference suppression Part 3: Standard for passive filter units for which safety tests are appropriatePublic Comment
BS EN 60940 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1Public Comment
BS EN 60966-1 Ed.3 Cables, wires, waveguides, r.f. connectors, and accessories for communication and signallingPublic Comment
BS EN 60966-2-4 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-2 connectorsPublic Comment
BS EN 60966-2-5 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-2 connectorsPublic Comment
BS EN 60966-2-6 Ed 4 Detail specification for cable assebmblies for radio and TV receivers - Frequency range 0 MHz to 3000 MHz, IEC 61196-24 connectorsPublic Comment
BS EN 60966-2-7 ED.1 Radio frequency and coaxial cable assemblies Part 2-7: Detail specification for cable assemblies for radio and TV recievers - Frequency range 0 MHz to 3000 MHz, IEC 61169-47 connectorsApproval
BS EN 61045-1 Fixed film resistor networks for use in electronic equipment - Part 1 : Generic specificationPublic Comment
BS EN 61076-1+A1 Connectors for electronic equipment - Product equirements Part 1: Generic specificationAccepted
BS EN 61076-2-104 ED 2.0 Connectors for electronic equipment - Product requirements Part 2-104:Circular connectors - Detail specification for circular connectors with M8 screw-locking or snap-lockingPublication
BS EN 61076-2-111 Connectors for electronics equipment Part 2-111: Circular connectors - Detail specification for plug and jack for 2 mm barrel-type battery charging interfaceAccepted
BS EN 61076-2-112 Connectors for electronic equipment Part 2-112: Product requirements - Circular connectors, Detail specification for M12 power connectors up to12 Amps with screw-lockingAccepted
BS EN 61076-2-113 Connectors for electronic equipment - Product requirements Part 2-113: circular connectors - Detail specification for connectors with data and power contacts with M12 screw-lockingAccepted
BS EN 61076-3-104 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 2 000 MHzAccepted
BS EN 61076-3-110 Connectors for electronic equipment - product requirements Part 3-110: detail specification for free and fixed connectors for data transmission with frequencies up to 3 000 mhzAccepted
BS EN 61076-3-120 Connectors for electronic equipment - Product requirements Part 3-120: rectangular connectors -Detail specification for rewirable power connector with snap locking for 250 v d.c. And rated current of 30aAccepted
BS EN 61076-4-116+A1 equipment - Product requirements Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding functionPublic Comment
BS EN 61082-1 Preparation of documents used in electrotechnology - Part 1: RulesPublication
BS EN 61156-10 Ed1.0 pair/quad cables for digitial communications Part 10: Cables for work area wiring with transmission characteristics up to 2 GHz - Sectional specificationPublic Comment
BS EN 61156-9 Ed1.0 pair/quad cables for digitial communications Part 9: Cables for horizontal floor wiring with transmission characteristics up to 2 GHz - Sectional specificationPublic Comment
BS EN 61169-11 Radio-frequency connectors Part 11: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 9.5 mm with threaded coupling - characteristic impedance 50 ohm (Type 4.1-9.5)Accepted
BS EN 61169-47 Ed 2.0 Radio-Frequency Connectors Part 47: Sectional specification for radio-frequency coaxial connectors with clamp coupling, typically for use in 75 ? cable networks (type F- Quick)Public Comment
BS EN 61169-48 Ed.1 Radio-frequency connectors - Part 48: Sectional specification for BMP Series Blind mating R.F. coaxial connectorsPublic Comment
BS EN 61169-49 Ed 1.0 Radio-frequency connectors - Part 49: Sectional specification for SMAA series R.F connectorsPublication
BS EN 61169-50 Ed1.0 Radio-frequency connectors Part 50: Sectional specifications RF coaxial connectors with inner diameter of outer conductors 4.11 mm with quick lock system. Characteristics impendance 50 Ohm (type QMA)Public Comment
BS EN 61169-51 Ed1.0 Radio-frequency connectors - Part 51: Sectional specifications RF coaxial connectors with inner diameter of outer conductors 13.5 mm with bayonet lock characteristics impedamce 50 Ohm (type QLI)Approval
BS EN 61169-52 Ed1.0 Radio- Frequency Connectors Part 52: Sectional specification for series MMCX RF coaxial connectorsPublic Comment
BS EN 61169-53 Radio-frequency connectors Part 53: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 16 mm with screw lock -Characteristic impedance 50 ohm (Type S7-16)Accepted
BS EN 61169-54 RADIO-FREQUENCY CONNECTORS Part 54: Sectional Specification for Coaxial Connectors with 10mm inner of outer Conductor,nominal Characteristic Impedance 50 Ohms, Series 4.3- 10Public Comment
BS EN 61169-58 Radio-frequency connectors Part 58: Sectional specification for RF coaxial connectors with blind-mate coupling - characteristic impedance 50 ohm (type SBMA)Accepted
BS EN 61169-58 Radio-frequency connectors Part 58: Sectional specification for RF coaxial connectors with blind-mate coupling - characteristic impedance 50 ohm (type SBMA)null
BS EN 61175 Industrial systems, installations and equipment and industrial products - Designation of signalsPublic Comment
BS EN 61188-8-1 ED 1.0 Componenet shape data specification for CAD library - Part 8-1: Generic descriptions of the 2D and 3D descriptionAccepted
BS EN 61189-2-721 Ed.1 Measurement of Relative Permitivity and loss for Copper Clad Laminate at Microwave Frequency using split post dielectric resonatorPublic Comment
BS EN 61189-3-719 Ed1.0 materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cyclingPublic Comment
BS EN 61189-3-913 ED.1 Test methods for electronic circuit board for high-brightness LEDsPublic Comment
BS EN 61189-5-1 Test methods for electrical materials, Interconnection structures and assemblies Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and HandbooksPublic Comment
BS EN 61196-1-110 Ed. 1.0 Coaxial communication cables Part 1-110: Electrical test methods - Test for continuityIdea
BS EN 61196-1-114 Ed. 1.0 Coaxial communication cables Part 1-114: Electrical test methods - InductancePublic Comment
BS EN 61196-1-116 Ed. 1.0 Coaxial communication cables Part 1-116: Electrical test methods - Test for characteristic impedance with time domain reflectometry (TDR)Public Comment
BS EN 61196-1-209 Ed. 1.0 Coaxial communication cables Part 1-209: Environmental test methods - Thermal cyclingAccepted
BS EN 61196-1-215 Ed1.0 Environmental test methods Part 1-215: High Temperature Cable AgeingAccepted
BS EN 61196-1-314 Ed2.0 Coaxial communication cables Part 1-314: Mechanical test methods - Test for bendingPublic Comment
BS EN 61196-10 Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polyterafluoroethylene (PTFE) dielectricApproval
BS EN 61196-10-1 Ed1.0 Coaxial Communication Cables Part 10-1: Blank detail specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectricPublication
BS EN 61196-11 Ed1.0 Coaxial communication cables Part 11: Sectional specification for semi-rigid cables with polyethylene (PE) dielectricPublic Comment
BS EN 61196-11-1 Ed.1 Coaxial communication cables Part 11-1: Blank detail specification for semi-rigid cables with polyethylene (PE) dielectricPublic Comment
BS EN 61196-4-1 Ed1.0 Coaxial communication cables Part 4-1: Blank detail specification for radiating cablesPublic Comment
BS EN 61196-9-1 Ed. 1.0 Coaxial communication cables Part 9-1: Blank detail specification for flexible RF coaxial cablesPublic Comment
BS EN 61215 Crystalline silicon terrestrial photovoltaic (PV) modules - Design qualification and type approvalPublic Comment
BS EN 61215-1-1 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 1-1: Special requirements for testing of crystalline silicon photovoltaic (PV) modulesPublic Comment
BS EN 61215-1-2 Terrestrial photovoltaic (PV) modules - Design qualification and typ approval Part 1-2: Special requirements for testing of cadmium telluride (CdTe) photovoltaic (PV) modulesAccepted
BS EN 61215-1-3 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 1-3: Special requirements for testing of amorphous silicon (a-Si) and microcrystalline silicon (micro c-Si) photovoltaic (PV) modulesAccepted
BS EN 61215-1-4 Terrestrial photovoltaic (PV) modules Design qualification and type approval Part 1-4: Special requirements for testing of copper indium gallium selenide (CIGS) and copper indium selenide (CIS) photovoltaic (PV) modulesAccepted
BS EN 61215-2 Terrestrial photovoltaic (PV) modules - Design qualification and type approval Part 2: Test proceduresPublic Comment
BS EN 61249-2-43 Ed.1 Materials for printed boards and other interconnecting structures Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublic Comment
BS EN 61249-2-44 Ed.1 Materials for printed boards and other interconnecting structures Part 2-44: Reinforced base materials clad and unclad - Non-halogened epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublic Comment
BS EN 61360-1 Standard data elements types with associated classification scheme forelectric items - Part 1: Definitions - Principles and methodsAccepted
BS EN 61360-6 QIEC Common Data Dictionary (IEC CDD) Quality guidePublic Comment
BS EN 61377 Ed. 2.0 Railway Applications - Rolling stock - Combined-testing of motors andtheir control systemPublic Comment
BS EN 61587-1 Ed. 4.0 Mechanical structures for electronic equipment - Tests for IEC 60917 andIEC 60297 series Part 1: Environmental requirements; test set-up and safety aspects for cabinets; racks; subracks and chassis under indoor conditionsAccepted
BS EN 61587-6 Mechanical structures for electronic equipment Part 6: Security and performance for door locking handles for indoor cabinetsAccepted
BS EN 61726 ED.2 Cable assemblies, cables, connectors and passive coponents - screening attentuation measurement by the reverberation chamber methodPublic Comment
BS EN 61730-1 Ed 2.0 Photovoltaic (PV) module safety qualification Part 1: Requirements for constructionAccepted
BS EN 61730-1:2007/AB Photovoltaic (PV) module safety qualification Part 1: Requirements for constructionAccepted
BS EN 61730-2 ED 2.0 Photovoltaic (PV) module safety qualification Part 2: Requirements for testingAccepted
BS EN 61747-2 Ed 2.0 Liquid crystal display devices Part 2: Liquid crystal display modules - Sectional specificationAccepted
BS EN 61747-2-2 Ed 2.0 Liquid crystal display devices Part 2-2: Matrix colour LCD modules - Blank detail specificationPublic Comment
BS EN 61747-4-1 Ed 2.0 Liquid crystal display devices Part 4-1: Matrix colour LCD modules - Essential ratings and characteristicsAccepted
BS EN 61747-5-4 ED.1 Liquid crystal display devices Part 5-4: Environmental, endurance and mechanicaltest methods - Mechanical testing guidelines for display cover glass for display cover glass for mobile devicesnull
BS EN 61829 Crystalline silicon photovoltaic (pv) array – On-site measurement of i-vcharacteristicsPublic Comment
BS EN 61853-2 ED 1.0 Photovoltaic (PV) module performance testing and energy rating Part 2: Spectral response, incidence angle and module operating temperature measurementsPublic Comment
BS EN 61935-1 Ed.4 TESTING OF BALANCED COMMUNICATION CABLING IN ACCORDANCE WITH ISO/IEC 11801 Part 1: Installed cablingPublic Comment
BS EN 61935-2-21 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-21: Cord and work area cord category 6- Blank detail specificationPublic Comment
BS EN 61935-2-22 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-22: Cord and work area cord category 6A- Blank detail specificationPublic Comment
BS EN 61935-2-23 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-23: Cord and work area cord category 7- Blank detail specificationPublic Comment
BS EN 61935-2-24 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-24: Cord and work area cord category 7A- Blank detail specificationPublic Comment
BS EN 61935-2-25 Ed1.0 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-25: Work area with M12 4 poles connectors Blank detail specificationPublic Comment
BS EN 61988-2-6 Plasma display panels Part 2-6: Measuring methods - APL dependent gamma and colour characteristicsPublic Comment
BS EN 61988-4-1 Plasma display panels Part 4-1: Environmental testing methods - Climatic and mechanicalPublic Comment
BS EN 62047-1 Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitionsAccepted
BS EN 62047-15 Semiconductor devices - Micro - electromechanical devices - Part 14: Forming limit measuring method of metallic film materialsPublic Comment
BS EN 62047-16 ED 1.0 Semiconductor devices – Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methodsPublic Comment
BS EN 62047-17 Semiconductor devices – Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin filmsPublic Comment
BS EN 62047-20 Semiconductor devices - Micro-electromechanical devices - Part 20: GyroscopesPublication
BS EN 62047-21 Semiconductor devices – Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materialsPublication
BS EN 62047-22 Semiconductor devices – Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substratesPublication
BS EN 62047-25 Semiconductor devices - Micro-electromechanical devices Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding areaAccepted
BS EN 62047-26 Ed1.0 Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structuresAccepted
BS EN 62109-3 Safety of power converters for use in photovoltaic power systems Part 3: Particular requirements for electronic devices in combination with photovoltaic elementsAccepted
BS EN 62132-6 Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) methodnull
BS EN 62137-4 Ed.1 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devicesApproval
BS EN 62153-4-10 Ed2 Metallic Communication Cable Test Methods Part 4-10: Electromagnetic compatability (EMC) - Shielded screening attenuation test method for measuring the screening effectiveness of feed-throughs and electromagnetic gaskets double coaxial methodPublic Comment
BS EN 62153-4-7 Ed.2 Metallic Communication Cable test methods Part 4-7: Electromagnetic compatibility (EMC) - Shielded screening attenuation test method for measuring the Transfer impedance Zt and the screening attenuation aS or the Coupling attenuation aC of RF-Connectors and assemblies up to and above 3 GHz; Tube in Tube methodPublic Comment
BS EN 62228-2 Integrated circuits - EMC evaluation of LIN transceiversAccepted
BS EN 62326-20 ED.1 Electronic circuit board for high-brightness LEDs Printed boardsAccepted
BS EN 62341-2-1 Organic light emitting diode (OLED) displays - Part 2-1: Essential ratings and characteristics of OLED display modulesPublic Comment
BS EN 62341-6-1 Organic light emitting diode (OLED) displays Part 6-1: Measuring methods of optical and electro-optical parametersAccepted
BS EN 62341-6-2 Organic light emitting diode (OLED) displays - Part 6-2: Measuring methods of visual quality and ambient performanceAccepted
BS EN 62341-6-3 Organic light emitting diode (OLED) displays Part 6-3: Measuring methods of image qualityAccepted
BS EN 62391-1 Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specificationApproval
BS EN 62433-3 EMC IC modelling Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)Accepted
BS EN 62433-4 Ed1.0 EMC IC modelling Part 4: Models of Integrated Circuits for RF immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI)Accepted
BS EN 62435-1 ED 1.0 Long-term storage of electronic semiconductor devicesAccepted
BS EN 62435-1 Electronic components - Long-term storage of electronic semiconductor devices Part 1: Generalnull
BS EN 62435-2 Electronic components - Long-term storage of electronic semiconductor devices Part 2 - Deterioration MechanismsAccepted
BS EN 62435-5 Electronic components - Long-term storage of electronic semiconductor devices Part 5 - Die & Wafer Devicesnull
BS EN 62435-5 Electronic components - Long-term storage of electronic semiconductor devices Part 5 - Die & Wafer DevicesAccepted
BS EN 62446 Ed 2.0 Grid connected PV systems - Minimum requirements for system documentation; commissioning tests and inspectionPublic Comment
BS EN 62446 Ed2 Grid connected PV systems - Minimum requirements for system documentation, commissioning tests and inspectionnull
BS EN 62449 Connectors for electronic equipment – Product requirements – Detail specification for SCA-2 (Single Connector Attach -2) unshielded connectorsPublic Comment
BS EN 62451 HSSDC-2 Shielded ConnectorsAccepted
BS EN 62471-5 Ed.1.0 Photobiological Safety of Lamp Systems for Image ProjectorsPublic Comment
BS EN 62483 Environmental acceptance requirements for tin whisker susceptibility tin and tin alloy surface finishesnull
BS EN 62595-1-2 LCD backlight unit Part 1-2: Terminology and letter symbolsAccepted
BS EN 62595-2 Ed 2.0 LCD backlight unit Part 2: Electro-optical measurement methods of LED backlight unitAccepted
BS EN 62610-5 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 5: Guideline of cooling performance evaluation for indoor cabinetsAccepted
BS EN 62629-22-1 3D display devices Part 22-1: Measuring methods for autostereoscopic displays - OpticalAccepted
BS EN 62629-6-2 3D display devices - Part 6-2: Optical measuring methods for stereoscopic displays using glassesnull
BS EN 62656-1 Standardized product ontology register and transfer by spreadsheets - Part 1:Logical structure for data parcelsPublication
BS EN 62656-3 Standardized product ontology register and transfer by spreadsheets - Part 3:Interface for Common Information ModelApproval
BS EN 62656-5 Standardized product ontology register and register by spreadsheets - Part 5: Interface for activity descriptionAccepted
BS EN 62670-1 ED 1.0 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 1: Performance measurements and power rating - Irradiance and tempe raturePublic Comment
BS EN 62688 ED 1.0 Concentrator photovoltaic (CPV) module and assembly safety qualificationAccepted
BS EN 62718 Railway applications - Rolling stock - DC supplied electronic ballastsfor lighting fluorescent lampsApproval
BS EN 62744 Representation of states of objects by graphic symbolsApproval
BS EN 62759-1 Transportation testing of photovoltaic (PV) modules Part 1: Transportation and shipping of PV module stacksPublic Comment
BS EN 62779-1 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirementsPublic Comment
BS EN 62779-2 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performancesPublic Comment
BS EN 62779-3 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditionsAccepted
BS EN 62782 Dynamic mechanical load testing for photovoltaic (PV) modulesAccepted
BS EN 62783-1Ed.1 TWINAX CABLES FOR DIGITAL COMMUNICATIONS - Part 1: GENERIC SPECIFICATIONPublic Comment
BS EN 62788-1-2 Measurement procedures for materials used in photovoltaic modules Part 1-2: Encapsulants - Measurement of volume resistivity of photovoltaic encapsulation and backsheet materialsAccepted
BS EN 62788-1-4 Measurement procedures for materials used in Photovoltaic Modules Part 1-4: Encapsulants - Measurement of optical transmittance and calculation of the solar-weighted photon transmittance; yellowness index; and UV cut-off frequencyAccepted
BS EN 62788-1-5 Measurement procedures for materials used in photovoltaic modules Part 1-5: Encapsulants - Measurement of change in linear dimensions of sheet encapsulation material under thermal conditionsAccepted
BS EN 62788-1-6 Measurement procedures for materials used in photovoltaic modules Part 1-6: Encapsulants - Test methods for determining the degree of cure in Ethylene-Vinyl Acetate encapsulation for photovoltaic modulesAccepted
BS EN 62790 Junction boxes for photovoltaic modules - Safety requirements and testsApproval
BS EN 62804 System voltage durability qualification test for crystalline silicon modulesApproval
BS EN 62810 Ed.1 Cylindrical cavity method to measure the complex permittivity of low-loss dielectric rodsPublic Comment
BS EN 62812 Method of measurement of low resistanceAccepted
BS EN 62813 Electrical characteristics test methods of lithium ion capacitors for use in electric and electronic equipmentApproval
BS EN 62817 Solar trackers for photovoltaic systems - Design qualificationApproval
BS EN 62830-1 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 1: Vibration based piezoelectric energy harvestingAccepted
BS EN 62830-2 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 2: Thermo power based thermoelectric energy harvestingAccepted
BS EN 62830-3 Semiconductor devices - Semiconductor devices for energy harvesting and generation Part 3: Vibration based electromagnetic energy harvestingAccepted
BS EN 62852 Connectors for DC-application in photovoltaic systems - Safety requirements and testsApproval
BS EN 62880-1 Semiconductor devices - Wafer Level Reliability for Semiconductor Devices Part 1: Copper Stress Migration Test MethodAccepted
BS EN 62891 Overall efficiency of grid connected photovoltaic invertersPublic Comment
BS EN 62894 Data sheet and name plate for photovoltaic invertersApproval
BS EN 62899-1 Ed.1 Printed electronics - Materials Part 1: SubstratesIdea
BS EN 62899-2-1 Ed.1 Printed electronics - Materials Part 2-1: Conductive Material InkAccepted
BS EN 62906-1-2 Laser display devices Part 1-2: Terminology and Letter symbolsPublic Comment
BS EN 62906-5-2 Laser display and devices Part 5-2: Optical measuring methods of speckleAccepted
BS EN 62925 Thermal cycling test for CPV modules to differentiate increased thermal fatigue durabilityAccepted
BS EN 772-1:2011/A1 Methods of test for masonry units Part 1: Determination of compressive strengthAccepted
BS EN 772-5 Methods of test for masonry units Part 5: Determination of the active soluble salts content of clay masonry unitsIdea
BS EN 81346-2 and equipment and industrial products- Structuring principles and reference designations - Part 2: Classification of objects and codes for classesIdea
BS EN 82079-1 Ed 2.0 Preparation of instructions for use - Structuring, content andpresentation - Part 1: General principles and detailed requirementsIdea
BS EN 846-9 Methods of test for ancillary components for masonry Part 9: Determination of flexural resistance and shear resistance of lintelsIdea
BS EN IEC 60940/A1 AMD 1 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppressionnull
BS EN ISO 11553-1 Ed.2 Safety of machinery - Laser processing machines Part 1: General safety requirementsIdea
BS EN ISO 11553-2 Ed.2 Safety of machinery - Laser processing machines Part 2: Safety requirements for hand-held processing devicesIdea
BS EN NWIP TEST METHOD 3 Test Method 3 - Temperature humidity storagenull
BS EN TS 62789 Specification of concentrator cell descriptionnull
BS ENISO 11074 Soil quality - VocabularyApproval
Opens a new windowBS ENISO 15009 Soil quality - Gas chromatographic determination of the content of volatile aromatic hydrocarbons, naphthalene and volatile halogenated hydrocarbons - Purge-and-trap method with thermal desorptionPublic Comment
BS ENISO 16198 Soil quality - Plant-based biotest to assess the environmental bioavailability of trace elements to plantsPublication
BS ENISO 16558-1 Soil quality - Risk based petroleum hydrocarbons Part 1: Determination of aliphatic and aromatic fractions of volatile petroleum hydrocarbons using gas chromatography (static headspace method)Public Comment
BS ENISO 16558-2 Soil quality - Risk-based petroleum hydrocarbons Part 2: Determination of aliphatic and aromatic fractions of semi-volatile petroleum hydrocarbons using gas chromatography with flame ionisation detection (GC/FID)Public Comment
Opens a new windowBS ENISO 22155 Soil quality - Gas chromatographic determination of volatile aromatic and halogenated hydrocarbons and selected ethers - Static headspace methodPublic Comment
BS IEC 60050-726 Ed2.0 IEC 60050-726. International electrotechnical vocabulary. Transmissionlines and waveguidesPublic Comment
BS IEC 60393-2 Potentiometers for use in electronic equipment. Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometersPublic Comment
BS IEC 60393-5 Potentiometers for use in electronic equipment. Part 5: Sectional specification - Single-turn rotary low-power wirewound and non-wirewound potentiometersPublic Comment
BS IEC 60393-6 Potentiometers for use in electronic equipment. Part 6: Sectional specification - Surface mount preset potentiometersPublic Comment
BS IEC 60512-29-100 Ed1.0 ED 1.0 Connectors for electronic equipment - Tests and measurements Part 29-100: Signal integrity tests up to 500 MHz on M12 style connectors - Tests 29a to 29gPublic Comment
BS IEC 61189-5-2 Ed1.0 Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering FluxApproval
BS IEC 61189-5-3 Ed1.0 Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering pasteApproval
BS IEC 61189-5-4 Ed1.0 Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed abd non-fluxed solid wireApproval
BS IEC 61747-40-2 Liquid crystal display devices Part 40-2: Mechanical testing of display cover glass for mobile devices - Uni-axial flexural strength (4-point bend)Publication
BS IEC 61747-40-3 Liquid crystal display devices Part 40-3: Mechanical testing of display cover glass for mobile devices - Biaxial flexural energy-to-failure (Ball drop)Publication
BS IEC 61747-40-4 Liquid crystal display devices Part 40-4: Mechanical testing of display cover glass for mobile devices - Biaxial flexural strenght (Ring-on-ring)Publication
BS IEC 61760-4 Ed1.0 ED 1.0 Classification, Packaging,Labelling and handling of moisture sensitive devicesPublic Comment
BS IEC 62132-1 Ed2.0 Integrated circuits - Measurement of electromagnetic immunity Part 1: General conditions and definitionsPublic Comment
BS IEC 62153-4-15 Ed.1 Metallic Communication Cable test methods Part 4-15: Electromagnetic compatibility (EMC) – Test method for measuring transfer impedance and screening attenuation – or coupling attenuation with Triaxial CellPublic Comment
BS IEC 62670-2 Ed1.0 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 2: Energy rating by measurementPublic Comment
BS IEC 62878-1-1 Ed1.0 Ed.1 Device embedded substrate Part 1-1: Generic specification - Test methodPublic Comment
BS IEC 62908-1-2 Touch and interactive displays Part 1-2: Terminology and letter symbolsAccepted
BS IEC 62908-12-10 Touch and interactive displays Part 12-10: Touch performance measuring methodsAccepted
BS ISO 11268-3 Soil quality - Effects of pollutants on earthworms Part 3: Guidance on the determination of effects in field situationsApproval
BS ISO 11504 Soil quality - Assessment of impact from soil contaminated with petroleum hydrocarbonsAccepted
BS ISO 14869-3 Soil quality - Dissolution for the determination of total element content Part 3: Dissolution with hydrofluoric and nitric acids using pressurised microwave techniqueAccepted
BS ISO 16751-1 Soil quality - Environmental availability of non-polar organic compounds Part 1: Determination of potential availability using a strong absorbent or complexing agentIdea
BS ISO 17182 Soil quality - Determination of some selected phenols and chlorophenols - Gas chromatographic method with mass spectrometric detectionPublic Comment
BS ISO 17183 Soil quality - Screening soils for alcohol-extracted organic compounds by turbidity analysisAccepted
BS ISO 17183 Soil quality - Screening soils for isopropanol-extractable organic compounds by determining emulsification index by light attenuationPublic Comment
BS ISO 17586 Soil quality - Assessment of the bioavailability - Extraction of metals using 0,43 mol/l nitric acid solutionPublic Comment
BS ISO 17601 Soil quality - Method to quantify the abundance of microbial communities from soil DNA extractsPublic Comment
BS ISO 17924 Soil quality - Assessment of human exposure from ingestion of soil and soil material - Guidance on the application and selection of physiologically based extraction methods for the estimation of the human bioaccessibility/bioavailability of metals inIdea
BS ISO 18187 Soil quality - Quality of solid samples - Solid contact test using the dehydrogenase activity of Arthrobacter globiformisPublic Comment
BS ISO 18311 Soil quality - Method for testing effects of soil contaminants on the feeding activity of soil dwelling organisms - Bait-lamina testPublic Comment
BS ISO 18400-101 Soil quality - Sampling Part 101: Framework for the preparartion and application of a sampling planAccepted
BS ISO 18400-102 Soil quality - Sampling Part 102: Selection and application of sampling techniquesAccepted
BS ISO 18400-103 Soil quality - Sampling Part 103: SafetyAccepted
BS ISO 18400-104 Soil quality - Sampling Part 104: Strategies and statistical evaluationsIdea
BS ISO 18400-105 Soil quality - Sampling Part 105: Package, transport, storage, preservationAccepted
BS ISO 18400-106 Soil quality - Sampling Part 106: Quality control and quality assuranceAccepted
BS ISO 18400-107 Soil quality - Sampling Part 107: Recording and reportingAccepted
BS ISO 18400-201 Soil quality - Sampling Part 201: Pretreatment in the fieldAccepted
BS ISO 18400-202 Soil quality - Sampling Part 202: Preliminary investigationsIdea
BS ISO 18400-203 Soil quality - Sampling Part 203: Investigation of potentially contaminated sitesIdea
BS ISO 18400-204 Soil quality - Sampling Part 204: Guidance on sampling of soil gasIdea
BS ISO 18504 Soil quality - Guidance on sustainable remediationIdea
Opens a new windowBS ISO 18763 Determination of the toxic effects of pollutants on germination and early growth of higher plantsPublic Comment
BS ISO 19204 Soil quality - Procedure for site-specific ecological risk assessment of soil contamination (TRIAD approach)Accepted
BS ISO/IEC 10373-2 Identification cards - Test methods Part 2: Cards with magnetic stripesPublication
BS ISO/IEC 10373-5 Identification cards - Test methods Part 5: Optical memory cardsPublication
BS ISO/IEC 10373-6 Identification cards - Test methods Part 6: Proximity cardsPublic Comment
BS ISO/IEC 10373-6/Amd 1 Identification cards - Test methods Part 6: Proximity cards - Amendment 1: Frame with error correctionPublic Comment
BS ISO/IEC 10373-6/Amd 2 Identification cards - Test methods Part 6: Proximity cards - Amendment 2: Extension of PICC and PCD test methodsPublic Comment
BS ISO/IEC 10373-9 Identification cards - Test methods Part 9: Optical memory cards - Holographic recording methodAccepted
BS ISO/IEC 11693-3 Identification cards - Optical memory cards Part 3: Authentication techniquesPublication
BS ISO/IEC 11694-3 Identification cards - Optical memory cards - Linear recording method Part 3: Optical properties and characteristicsAccepted
BS ISO/IEC 11694-5 Identification cards - Optical memory cards - Linear recording method Part 5: Data format for information interchange for applications using ISO/IEC 11694-4, Annex BPublication
BS ISO/IEC 11695-3 Identification cards - Optical memory cards - Holographic recording method Part 3: Optical properties and characteristicsAccepted
BS ISO/IEC 11695-4 Identification cards - Optical memory cards - Holographic recording me method Part 4: Logical data structuresPublic Comment
BS ISO/IEC 14443-2 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interfacePublic Comment
BS ISO/IEC 14443-2/Amd 1 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 1: PICC's with external power supplyAccepted
BS ISO/IEC 14443-2:2010/AMD 5 Bits rates of 3fc/4 and fcPublication
BS ISO/IEC 14443-3:2011/Amd 4 Identification cards - Contactless integrated circuit cards - Proximity cards Part 3: Initialization and anticollision - Amendment 4Public Comment
BS ISO/IEC 14443-4:2008/Amd 5 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendment 5Public Comment
BS ISO/IEC 15693-3:2009/Amd 2 Identification cards - Contactless integrated circuit cards - Vicinity cards Part 3: Anticollision and transmission protocol - Amendment 2: Clarification of use of Data ElementsPublic Comment
BS ISO/IEC 15693-3:2009/Amd 3 Identification cards - Contactless integrated circuit cards - Vicinity cards Part 3: Anticollision and transmission protocol - Amendment 3: Extended VICC memory organisatioPublic Comment
BS ISO/IEC 15693-3:2009/Amd 4 Identification cards - Contactless integrated circuit cards - Vicinity cards Part 3: Anticollision and transmission protocol - Amendment 4: Adding security frameworkAccepted
BS ISO/IEC 17839-2 Information technology - Identification cards - Biometric system on card Part 2: Physical characteristicsPublic Comment
BS ISO/IEC 17839-3 Information technology - Identification cards - Biometric system on card Part 3: Logical information interchange mechanismAccepted
BS ISO/IEC 18013-1 Information technology - Personal identification - ISO-compliant driving licence Part 1: Physical characteristics and basic data setAccepted
BS ISO/IEC 18013-3:2009/AMD 2 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 2: Extended Access Control EAC v1.11Publication
BS ISO/IEC 18013-3:2009/Amd 3 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 3: PACEAccepted
BS ISO/IEC 18013-4:2011/Amd 1 Information technology - Personal identification - ISO-compliant driving licence Part 4: Test methods - Amendment 1Accepted
BS ISO/IEC 18328 Input Devices on ICC and enhancements of electronic DisplaysIdea
BS ISO/IEC 18328-1 Devices on cards Part 1: General frameworkAccepted
BS ISO/IEC 18328-2 Devices on cards Part 2: Physical characteristicsPublic Comment
BS ISO/IEC 18745-2 Test methods for machine readable travel documents (MRTD) Part 2: Test methods for the contactless interfacePublic Comment
BS ISO/IEC 18745-3 Test methods for machine readable travel documents (MRTD) Part 3: LDS and security protocolsAccepted
BS ISO/IEC 25185-1 Identification cards - Integrated circuit card authentication protocols Part 1: Protocol for Lightweight Authentication of IdentityPublication
BS ISO/IEC 7811-8 Identification cards - Recording technique Part 8: Magnetic stripe - Coercivity of 51,7 kA/m (650 Oe)Publication
BS ISO/IEC 7811-9 Identification cards - Recording technique Part 9: Tactile identifier markAccepted
BS ISO/IEC 7812-1 Identification cards - Identification of issuers Part 1: Numbering systemAccepted
BS ISO/IEC 7812-2 Identification cards - Identification of issuers Part 2: Application and registration proceduresAccepted
BS ISO/IEC 7816-13:2007/COR 1D COR 1 Identification cards - Integrated circuit cards Part 13: Commands for application management in a multi-application environmentAccepted
BS ISO/IEC 7816-15 Identification cards - Integrated circuit cards Part 15: Cryptographic information applicationAccepted
BS ISO/IEC 7816-4:2013/Cor 1 Identification cards — Integrated circuit cards — Part 4: Organization, security and commands for interchangePublication
BS ISO/IEC 7816-6 Identification cards - Integrated circuit cards Part 6: Interindustry data elements for interchangePublic Comment
BS ISO/IEC 7816-8 Identification cards - Integrated circuit cards Part 8: Commands for security operationsAccepted
BS ISO/IEC I 18584 Test Methods for ISO/IEC 24787 based ApplicationsAccepted
BS ISO/IECF 11695-1 memory cards - Holographic recording method Part 1: Physical characteristicsApproval
BS ISO/IECF 11695-2 memory cards - Holographic recording method Part 2: Dimensions and location of accessible optical areaApproval
BSEN62145 ED 1.0 Crystalline silicon terrrestrial photovoltaic (PV) modules - Blank detail specificationAccepted
PD CEN/TS 419261 Security requirements for trustworthy systems managing certificates for electronic signaturesApproval
PD CENISO/TS 29843-1 microbial diversity Part 1: Method by phospholipid fatty acid analysis (PLFA) and phospholipid ether lipids (PLEL) analysisPublication
PD CENISO/TS 29843-2 microbial diversity Part 2: Method by phospholipid fatty acid analysis (PLFA) using the simple PLFA extraction methodPublication
PD CLC/TR 62258-4 Semiconductor die products - Part 4: Questionnaire for die users and suppliersPublication
PD IEC/PAS 61076-3-122 Detail specification for rugged 8-way, shielded, free and fixed connectorsApproval
PD IEC/PAS 61182-12 Generic requirements for printed board assembly products manufacturing description data and transfer methodologyPublication
PD IEC/PAS 62515 Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems - Maintenance of project 62515 including development of IEC/TS 62515Idea
PD IEC/TR 60068-3-12 Ed. 2 Environmental testing Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profilePublication
PD IEC/TR 61156-1-2:2009+A1 symmetrical pair/quad cables for digital communications Part 1-2: Electrical transmissoin characteristics and test methods of symmetrical pair/quad cablesApproval
PD IEC/TR 61156-1-6 Ed1.0 pair/quad cables for digital communications Part 1-6: Exploratory DC-resistance values of floor-wiring and work-area cables for digital communicationsAccepted
PD IEC/TR 61967-1-1 Integrated circuits - Measurement of electromagnetic emissions Part 1-1: General conditions and definitions - Near-field scan data exchange formatAccepted
PD IEC/TR 62153-4-16 Ed1.0 METALLIC COMMUNICATION CABLE TEST METHODS Part 4-16: Extension of the frequency range to higher frequencies for transfer impedance and to lower frequencies for screening attenuation measurements using the triaxial set-upApproval
PD IEC/TR 62471-3 Ed 1.0 Safety of intense pulsed light source equipment - Guidelines for the safe use of intense pulsed light source equipment on humansPublication
PD IEC/TR 62699-1 Ed1.0 methods for heterogeneous electronic parts libraries Part 1: Building an integrated search systemApproval
PD IEC/TR 62878-2-2 Ed.1 Device embedded substrate - Guidelines - Electrical testingPublic Comment
PD IEC/TS 61586 Estimation of the reliability of electrical connectorsAccepted
PD IEC/TS 62108-9 Ed 1.0 Concentrator Photovoltaic (CPV) modules and assemblies - Design qualification and type approval Part 9: Retest guidelinesApproval
PD IEC/TS 62153-4-1 Metallic communication cable test methods Part 4-1: Introduction to Electromagnetic (EMC) Test MethodsPublication
PD IEC/TS 62326-17 Ed.1 Printed boards Part 17: Device enbedded substrates - TEG (test element group)Publication
PD IEC/TS 62326-19 Ed.1 Printed boards Part 19: Device Embedded Substrate - Design GuidePublication
PD IEC/TS 62450 Technical Specification for 40 pin SCA 2 connector with parallel selectionPublic Comment
PD IEC/TS 62452 Testing and performance requirements for high speed serial and parallel- serial copper linksAccepted
PD IEC/TS 62789 Ed 1.0 Specification of concentrator cell descriptionApproval
PD IEC/TS 62878-2-1 Ed.1 Device Embedded Substrate Part 2-1: Guidelines - General description of technologyPublication
PD IEC/TS 62910 Ed 1.0 Test procedure of Low Voltage Ride-Through (LVRT) measurement for utility-interconnected photovoltaic inverterApproval
PD IEC/TS 62941 Ed 1.0 Guideline for increased confidence in PV module design qualification and type approvalAccepted
PD ISO/IEC/TR 18781 Washing Machine Test Method DraftAccepted
PD ISO/IEC/TR 19446 ISO-Compliant Driving Licence - European driving licence - Application profileAccepted

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Published standards (138)

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Standard referenceNameStatus
BS CECC 63000:1990Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuitsObsolescent
BS CECC 90000:1991Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS CECC 90000:1985Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS CECC 90000:Addendum No. 1:1983Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits. Internal visual inspectionObsolescent
BS CECC 63100:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuitsObsolescent
BS CECC 63200:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS CECC 63101:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuitsObsolescent
BS CECC 63201:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS EN 61523-1:2002Delay and power calculation standards - Integrated circuit delay and power calculation systemsCurrent
BS EN 62433-2:2010EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)Current
DD IEC/TS 62433-1:2011EMC IC modelling - General modelling frameworkCurrent
PD IEC/TR 62433-2-1:2010EMC IC modelling - Theory of black box modelling for conducted emissionCurrent
BS EN 165000-5:1998Film and hybrid integrated circuits - Procedure for qualification approvalCurrent
BS EN 165000-4:1996Film and hybrid integrated circuits - Customer information, product assessment level schedules and blank detail specificationCurrent
BS EN 165000-3:1996Film and hybrid integrated circuits - Self-audit checklist and report for film and hybrid integrated circuit manufacturersCurrent
BS EN 165000-2:1996Film and hybrid integrated circuits - Internal visual inspection and special testsCurrent
BS EN 165000-1:1996Film and hybrid integrated circuits - Generic specification. Capability approval procedureCurrent
DD ENV 190000-6:1994Generic specification: monolithic integrated circuits - Procedure for approval and quality managementCurrent
BS EN 190116:1994Harmonized system of quality assessment for electronic components. Family specification: AC MOS digital integrated circuitsCurrent
BS QC 760000:1990Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specificationCurrent
BS QC 760001:1994Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Generic specification. Requirements for internal visual inspectionCurrent
BS EN 190000:1996Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsCurrent
BS CECC 90300:1988Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuitsCurrent
BS QC 760101:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval proceduresCurrent
BS QC 760201:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760200:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760100:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval proceduresCurrent
BS QC 790101:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integrated circuits excluding hybrid circuitsCurrent
DD IEC/TS 62228:2007Integrated circuits. EMC evaluation of CAN transceiversCurrent
BS EN 61943:1999Integrated circuits. Manufacturing line approval application guidelineCurrent
PD IEC/TR 61967-1-1:2010Integrated circuits. Measurement of electromagnetic emissions - General conditions and definitions. Near-field scan data exchange formatCurrent
BS EN 61967-8:2011Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. IC stripline methodCurrent
PD IEC/TS 61967-3:2014Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. Surface scan methodCurrent
PD IEC/TR 61967-4-1:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4Current
BS EN 61967-4:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 ohm/150 ohm direct coupling methodCurrent
BS EN 61967-2:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of radiated emissions. TEM cell and wideband TEM cell methodCurrent
BS EN 61967-1:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - General conditions and definitionsCurrent
BS EN 61967-5:2003Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Workbench Faraday Cage methodCurrent
BS EN 61967-6:2002+A1:2008Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Magnetic probe methodCurrent
PD IEC/TS 62132-9:2014Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. Surface scan methodCurrent
BS EN 62132-2:2011Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. TEM cell and wideband TEM cell methodCurrent
BS EN 62132-8:2012Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. IC stripline methodCurrent
BS EN 62132-5:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Workbench Faraday cage methodCurrent
BS EN 62132-3:2007Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) methodCurrent
BS EN 62132-4:2006Integrated circuits. Measurement of electromagnetic immunity. 150 kHz to 1 GHz - Direct RF power injection methodCurrent
DD IEC/TS 62215-2:2007Integrated circuits. Measurement of impulse immunity - Synchronous transient injection methodCurrent
BS EN 62215-3:2013Integrated circuits. Measurement of impulse immunity - Non-synchronous transient injection methodCurrent
BS EN 61964:1999Integrated circuits. Memory devices pin configurationsCurrent
DD IEC/TS 62404:2007Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)Current
PD IEC/TR 61352:2006Mnemonics and symbols for integrated circuitsCurrent
BS EN 62090:2003Product package labels for electronic components using bar code and two-dimensional symbologiesCurrent
BS EN 60747-16-10:2004Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuitsCurrent
BS IEC 60747-10:1991Semiconductor devices - Generic specification for discrete devices and integrated circuitsCurrent
BS IEC 60748-11:2000Semiconductor devices. Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuitsCurrent
BS IEC 60748-23-5:2003Semiconductor devices. Integrated circuits - Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approvalCurrent
BS IEC 60748-4-3:2006Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)Current
BS IEC 60748-1:2002Semiconductor devices. Integrated circuits - GeneralCurrent
BS IEC 60748-2-20:2008Semiconductor devices. Integrated circuits - Digital integrated circuits. Family specification. Low voltage integrated circuitsCurrent
BS IEC 60748-5:1997Semiconductor devices. Integrated circuits - Semicustom integrated circuitsCurrent
BS IEC 60748-4:1997Semiconductor devices. Integrated circuits - Interface integrated circuitsCurrent
BS IEC 60748-2:1997Semiconductor devices. Integrated circuits - Digital integrated circuitsCurrent
BS 6493-2.3:1987Semiconductor devices. Integrated circuits - Recommendations for analogue integrated circuitsCurrent
BS IEC 60748-2-11:1999Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated circuits electrically erasible and programmable read-only memoryCurrent
BS IEC 60748-2-12:2001Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)Current
BS IEC 60748-23-4:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Blank detail specificationCurrent
BS IEC 60748-23-1:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Generic specificationCurrent
BS IEC 60748-23-2:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Internal visual inspection and special testsCurrent
BS IEC 60748-23-3:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Manufacturers' self-audit checklist and reportCurrent
BS CECC 90112:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write dynamic memories silicon monolithic circuitsCurrent
BS CECC 90111:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write static memories silicon monolithic circuitsCurrent
BS CECC 90113:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS ultra-violet light erasable electrically programmable read only memories silicon monolithic circuitsCurrent
BS CECC 90115:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital gate array integrated circuitsCurrent
BS EN 190110:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital microprocessor integrated circuitsCurrent
BS CECC 90105:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fusible link programmable bipolar read only memories, silicon monolithic integrated circuitsCurrent
BS CECC 90203:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated analogue switching circuitsCurrent
BS CECC 90301:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated line transmitters and receiversCurrent
BS CECC 90114:1990Specification for harmonized system of quality assessment for electronic components. Blank detail specification: programmable logic arrays (PLA)Current
BS EN 190106:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced low power SCHOTTKY digital integrated circuits series 54 ALS, 74 ALSCurrent
BS EN 190108:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced SCHOTTKY digital integrated circuits series 54 AS, 74 ASCurrent
BS EN 190107:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL FAST digital integrated circuits series 54 F, 74 FCurrent
BS CECC 90104:1981Specification for harmonized system of quality assessment for electronic components. Family specification: C. Mos digital integrated circuits, series 4000B and 4000UBCurrent
BS EN 190101:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84Current
BS CECC 90101:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits, series 54, 64, 74, 84Current
BS CECC 90103:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS EN 190103:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS EN 190102:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SCurrent
BS QC 790132:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)Current
BS QC 790131:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Complementary MOS digital integrated circuits (series 4000 B and 4000 UB)Current
BS QC 790130:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)Current
BS QC 790105:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Integrated circuit fusible-link programmable bipolar read-only memoriesCurrent
BS QC 790304:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear analogue-to-digital converters (ADC)Current
BS QC 790303:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear digital-to-analogue converters (DAC)Current
BS QC 790202:1991Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Monolithic integrated operational amplifiersCurrent
BS QC 790111:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification: integrated circuit static read/write memoriesCurrent
BS QC 790107:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. Integrated circuit dynamic read/write memoriesCurrent
BS QC 790106:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. MOS ultraviolet light erasable electrically programmable read-only memoriesCurrent
BS QC 790104:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification. Complementary MOS digital integrated circuits, series 4000 B and 4000 UBCurrent
BS QC 790110:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Blank detail specification. Microprocessor integrated circuitsCurrent
BS QC 790109:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCUCurrent
BS IEC 62528:2007Standard testability method for embedded core-based integrated circuitsCurrent
BS CECC 90200:1988Harmonized system of quality assessment for electronic components: sectional specification: analogue monolithic integrated circuitsCurrent, Work in Hand
BS EN 190100:1993Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuitsCurrent, Work in Hand
BS EN 62132-1:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - General conditions and definitionsCurrent, Work in Hand
BS EN 60747-16-1:2002+A1:2007Semiconductor devices - Microwave integrated circuits. AmplifiersCurrent, Work in Hand
BS EN 190109:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCUCurrent, Work in Hand
BS IEC 62265:2005Advanced library format (ALF) describing integrated circuit (IC) technology, cells and blocksWithdrawn
BS EN 61523-2:2002Delay and power calculation standards - Pre-layout delay calculation specification for CMOS ASIC librariesWithdrawn
DD ENV 50218:1996Description of a parametrized European mini test chipWithdrawn
DD ENV 50219:1996Description of the reliability test structures of the European mini test chipWithdrawn
BS QC 760100:1991Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film and hybrid integrated circuits: qualification approvalWithdrawn
BS QC 760200:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approvalWithdrawn
BS CECC 00013:1985Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor diceWithdrawn
BS ISO/IEC 14443-1:2000Identification cards. Contactless integrated circuit(s) cards. Proximity cards - Physical characteristicsWithdrawn
DD IEC/TS 61967-3:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz - Measurement of radiated emissions. Surface scan methodWithdrawn
PD 6601:1996JESSI 0.8 µm CMOS transistor model for analogue and digital circuit simulationWithdrawn
PD 6598:1996Measurement techniques for the characterization of the European mini test chipWithdrawn
BS IEC 60747-4-1:2000Microwave diodes and transistors. Microwave field effect transistors. Blank detail specification - BDS for microwave field-effect transistorsWithdrawn
PD 6595:1996Parameter extraction techniques for the European mini test chipWithdrawn
BS 9491:1975Rules for the preparation of detail specifications for analogue integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9492:1978Rules for the preparation of detail specifications for capacitively coupled digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9490:1975Rules for the preparation of detail specifications for digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9493:1981Rules for the preparation of detail specifications for integrated circuits of assessed quality which perform mixed digital and/or analogue functionsWithdrawn
BS 9460:1974Rules for the preparation of detail specifications for integrated circuits of assessed quality: differential operational amplifiers. General application categoryWithdrawn
BS 9430:1978Rules for the preparation of detail specifications for integrated circuits of assessed quality: voltage regulators. Full assessment levelWithdrawn
BS 6493-3:1985Semiconductor devices - Mechanical and climatic test methodsWithdrawn
BS IEC 60747-4-2:2000Semiconductor devices. Discrete devices - Microwave diodes and transistors. Integrated-circuit microwave amplifiers. Blank detail specificationWithdrawn
BS 6493-2.1:1985Semiconductor devices. Integrated circuits - GeneralWithdrawn
BS 6493-2-2.2:1986Semiconductor devices. Integrated circuits - Recommendations for digital integrated circuitsWithdrawn
BS IEC 60748-2-20:2000Semiconductor devices. Integrated circuits. Digital integrated circuits - Family specification. Low voltage integrated circuitsWithdrawn
BS CECC 90102:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SWithdrawn
BS QC 760201:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approvalWithdrawn
BS QC 760101:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedureWithdrawn
BS 9450:1998Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of testWithdrawn
BS 9450:1975Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of testWithdrawn
BS 9400:1970Specification for integrated electronic circuits and micro-assemblies of assessed quality (qualification approval procedures): generic data and methods of testWithdrawn
BS 3363:1980Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 1:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 2:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn

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