Skip to content
RSS feed for this category

Integrated circuits & microelectronics

Standards in development (422)

Sort by: Title | Status

Standard TitleStatus
BS 10175+A1 Investigation of potentially contaminated sites. Code of practiceAccepted
BS 8485 Code of practice for the characterization and remediation from groundgas in affected developmentsnull
BS CLC/TS 50546 Railway applications - Shore (external) supply system for rail vehiclesApproval
BS EN 1015-11 Methods of test for mortar for masonry —Part 11: Determination of flexural and compressive strength of hardened mortarIdea
BS EN 1015-12 Methods of test of mortar for masonry Part 12: Determination of adhesive strength of hardened rendering and plastering mortars on substratesIdea
BS EN 1052-2 Methods of test for masonry Part 2: Determination of flexural strengthIdea
BS EN 140101-806:2008/A Detail Specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leadsAccepted
BS EN 140401-801:2007/A Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1Accepted
BS EN 140401-802:2007/A Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2Public Comment
BS EN 140401-803:2007/AB Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2Approval
BS EN 140401-804:2011/A Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25Accepted
BS EN 140402 Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistorsIdea
BS EN 140402-801 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2Idea
BS EN 14169-2 Protection Profile for Secure Signature Creation Device Part 2: Device with key generationApproval
BS EN 14890-1 Application Interface for smart cards used as Secure Signature Creation Devices Part 1: Basic servicesPublic Comment
BS EN 14890-2 Application Interface for smart cards used as Secure Signature Creation Devices Part 2: Additional ServicesPublic Comment
BS EN 1545-1 Identification card systems - Surface transport applications Part 1: elementary data types, general code lists and general data elementsPublic Comment
BS EN 1545-2 Identification card systems - Surface transport applications Part 2: Transport and travel payment related data elements and code listsPublic Comment
BS EN 15910 Water quality - Guidance on the estimation of fish abundance with mobile hydroacoustic methodsAccepted
BS EN 16479-1 Water quality - Performance requirements and conformity test procedures for water monitoring equipment Part 1: Automated sampling devices (samplers) for water and waste waterPublic Comment
Opens a new windowBS EN 419111-1 Protection profiles for signature creation and verification application Part 1: Introduction to the European NormPublic Comment
BS EN 419111-2 Protection profiles for signature creation and verification application - Signature creation application Part 2: Core PPAccepted
Opens a new windowBS EN 419111-3 Protection profiles for signature creation and verification application - Signature creation application Part 3: Possible extensionsPublic Comment
Opens a new windowBS EN 419111-4 Protection profiles for signature creation and verification application - Signature verification application Part 4: Core PPPublic Comment
Opens a new windowBS EN 419111-5 Protection profiles for signature creation and verification application - Signature verification application Part 5: Possible extensionsPublic Comment
BS EN 50117-1:2002/A + A2 Coaxial cables Part 1: General specificationApproval
BS EN 50117-2-1:2005/A + A2 Coaxial cables Part 2-1: Sectional specification for cables used in cabled distribution networks - Indoor drop cables for systems operating at 5 MHz - 1000 MHzApproval
BS EN 50117-2-2:2004/A + A2 Coaxial cables Part 2-2: Sectional specification for cables used in cabled distribution networks - Outdoor drop cables for systems operating at 5 MHz - 1000 MHzApproval
BS EN 50117-2-3:2004/AC + A2 Coaxial cables Part 2-3: Sectional specification for cables used in cabled distribution networks - Distribution and trunk cables for systems operating at 5 MHz - 1000 MHzApproval
BS EN 50117-2-4:2004/A + A2 Coaxial cables Part 2-4: Sectional specification for cables used in cabled distribution networks - Indoor drop cables for systems operating at 5 MHz - 3000 MHzApproval
BS EN 50117-2-5:2004/A + A1 Coaxial cables - Part 2-5: Sectional specification for cables used in cabled distribution networks - Outdoor drop cables for systems operating at 5 MHz - 3000 MHzApproval
BS EN 50117-4-1:2008/AA + A1 Coaxial cables Part 4-1: Sectional specification for cables used in cabled for BCT cabling in accordance with EN 50173 - Indoor drop cables for systems operating at 5 MHz - 3000 MHzApproval
BS EN 50125-1 Railway applications - Environmental conditions for equipment Part 1: Equipment on board rolling stockPublic Comment
BS EN 50153 Railway applications - Rolling stock - Protective provisions relating to electrical hazardsPublic Comment
BS EN 50155 Railway applications - Electronic equipment used on rolling stockIdea
BS EN 50288-1 Multi-element metallic cables used in analouge and digital communication and control - Part 1: Generic specificationApproval
BS EN 50288-10-2 Multi-element metallic cables used in analogue and digital communication and control Part 10-2: Sectional specification for screened cables characterized up to 500 MHz - Work area and patch cord cablesIdea
BS EN 50288-11-2 Multi-element metallic cables used in analogue and digital communication and control - Part 11-2: Blank detail speification .for horizontal, building backbone and patch cables - For industrial or environmental demanding areasIdea
BS EN 50288-2-1 Multi-element metallic cables used in analouge and digital communication and control - Part 2-1: Sectional specification for screened cables characterised up to 100 MHz - Horizontal and building backbone cablesApproval
BS EN 50288-2-2 Multi-element metallic cables used in analouge and digital communication and control - Part 2-2: Sectional specification for screened cables characterised from 1 MHz up to 100 MHz - Work area, patch cord and data centres cablesApproval
BS EN 50288-3-1 Multi-element metallic cables used in analouge and digital communication and control - Part 3-1: Sectional specification for unscreened cables characterised up to 100 MHz - Horizontal and building backbone cablesApproval
BS EN 50288-3-2 Multi-element metallic cables used in analouge and digital communication and control - Part 3-2: Sectional specification for unscreened cables characterised up to 100 MHz - Work area and patch cord cablesApproval
BS EN 50288-4-1 Multi-element metallic cables used in analouge and digital communication and control - Part 4-1: Sectional specification for screened cables characterised up to 600 MHz - Horizontal and building backbone cablesApproval
BS EN 50288-4-2 Multi-element metallic cables used in analouge and digital communication and control - Part 4-2: Sectional specification for screened cables characterised up to 600 MHz - Work area and patch cord cablesApproval
BS EN 50288-5-1 Multi-element metallic cables used in analouge and digital communication and control - Part 5-1: Sectional specification for screened cables characterised up to 250 MHz - Horizontal and building backbone cablesApproval
BS EN 50288-5-2 Multi-element metallic cables used in analouge and digital communication and control - Part 5-2: Sectional specification for screened cables characterised up to 250 MHz - Work area and patch cord cablesApproval
BS EN 50288-6-1 Multi-element metallic cables used in analouge and digital communication and control - Part 6-1: Sectional specification for unscreened cables characterised up to 250 MHz - Horizontal and building backbone cablesApproval
BS EN 50288-6-2 Multi-element metallic cables used in analouge and digital communication and control - Part 6-2: Sectional specification for unscreened cables characterised up to 250 MHz - Work area and patch cord cablesApproval
BS EN 50288-7:2005/COR 1 Multi-element metallic cables used in analogue and digital communicatio n and control. Sectional specification for instrumentation and control cablesnull
BS EN 50288-9-2 Multi-element metallic cables used in analogue and digital communication and control Part 9-2: Sectional specification for screened cables characterised up to 1 000 MHz - work area and patch cord cablesIdea
BS EN 50289-3-8 Communication cables - Specifications for test methods Part 3-8: Mechanical test methods - Abrasion resistance of cable sheath markingsPublic Comment
BS EN 50290-2-23 Communication cables Part 2-23: Common design rules and construction - PE insulationPublic Comment
BS EN 50290-2-25 Communication cables Part 2-25: Common design rules and construction - Polypropylene insulation compoundsPublic Comment
BS EN 50290-4-1 Ed.2 prEN 50290-4-1 ed.2 : Communication cables Part 4-1: General considerations for the use of cables - Environmental conditions and safety aspectsApproval
BS EN 50290-4-2 Ed.2 prEN 50290-4-2 ed.2 : Communication cables Part 4-2: General considerations for the use of cables - Guide to useApproval
BS EN 50343 Railway applications - Rolling stock - Rules for installation of cablingPublic Comment
BS EN 50405 Railway applications - Current collection systems - Pantographs, testing methods for contact stripsIdea
BS EN 50407-2 Multi-pair cables used in high bite rate digital access telecommunication networks Part 2:Indoor multi-pair/quad cables for installation in Multi Dwelling Units shaft supporting universal services, xDSL and applications up to 100 MBits over IPPublic Comment
BS EN 50449 Electromagnetic devices and components - General specificationApproval
BS EN 50502 Railway applications - Rolling stock - Electric equipment in trolley buses - Safety requirements and connection systemsIdea
BS EN 50530:2010/A1 Overall efficiency of grid connected photovoltaic invertersPublication
BS EN 50547:2013/Cor1 Railway applications - Batteries for auxiliary power supply systemsPublication
BS EN 50583 Photovoltaics in buildingsPublic Comment
BS EN 50599 Balanced communication cabling in accordance with EN 50173-4 screened straight patch cords and straight work area cords for class D applications ? detail specificationApproval
BS EN 50601 Balanced communication cabling in accordance with EN 50173-4 unscreened straight patch cords and straight work area cords for class D applications ? detail specificationApproval
BS EN 50602 Balanced communication cabling in accordance with EN 50173-4 unscreened straight patch cords and straight work area cords for class E applications ? detail specificationApproval
BS EN 50603 Balanced communication cabling in accordance with EN 50173-4 screened straight patch cords and straight work area cords for class E applications ? detail specificationApproval
BS EN 50882-11 Multi-element metalic cables used in analogue and digital communication and control Part 11: Sectional specification for un-screened cables, characterised up to 500 MHz, for horizontal and building backbone wiringPublic Comment
BS EN 60068-2-58 ED.4 Environmental testing - Part 2-58: Tests Td- Test methodds for solderability, resistance to dissolution of metalization and to soldering heat of surface mounting devices (SMD)Public Comment
BS EN 60068-3-13 Environmental testing - Part 3-13: Supporting documentation and guidance on test T: SolderingPublic Comment
BS EN 60096-0-1 Radio Frequency cables - Part 0-1: Guide to the design of detail specifications - Coaxial cablesApproval
BS EN 60115-2 Fixed resistors for use in electronic equipment. Part 2: Sectional specification: Fixed low-power non-wirewound resistorsPublic Comment
BS EN 60115-8-1 Fixed resistors for use in electronic equipment Part 8-1: Blank detail specification - Fixed chip resistors. Assessment level EPublic Comment
BS EN 60191-2+A19 Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved.Public Comment
BS EN 60191-2/F67 Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.Public Comment
BS EN 60191-2/F68 Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.Public Comment
BS EN 60191-2/F69 Proposed new package outline - flange mount package with flat leads, PSFM- F8 - To be published as outline 187E, if approved.Public Comment
BS EN 60191-4: MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of package outlines for semiconductor device packagesApproval
BS EN 60191-6-1 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductir device packages - Design guide for gull-wing lead terminalsPublic Comment
BS EN 60191-6-13 Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)null
BS EN 60191-6-14 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)Accepted
BS EN 60191-6-15 Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages –Measuring methods for package dimensions of small outline packages (SOP)Accepted
BS EN 60191-6-16 Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAnull
BS EN 60191-6-5 General rules for the preparation of outline drawings of surface mounted semiconductor device package--Design guide for fine-pitch ball grid (FBGA)Publication
BS EN 60194 ED.6 Printed board design, manufacture and assembly - Terms and definitionsPublic Comment
BS EN 60286-2 Packaging of components for automatic handling Part 2: Tape packaging of components with unidirectional leads on continuous tapesAccepted
BS EN 60286-3 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapesApproval
BS EN 60286-4 ED 3.0 Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of form E and GApproval
BS EN 60297-3-108 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 108: Dimensions of R-type subracks and plug-in unitsAccepted
BS EN 60310 ED 4.0 Railway applications - Traction transformers and inductors on board rolling stockAccepted
BS EN 60352-2+A1 Solderless connections Part 2: Crimped connections - General requirements, test methods and practical guidanceApproval
BS EN 60384-1 Fixed capacitors for use in electronic equipment - Part 1: Generic specificationAccepted
BS EN 60384-14 Fixed capacitors for use in electronic equipment - Part 14: Sectional specification: Fixed capacitors for electromagnetic interference suppression and connection to the supply mainsApproval
BS EN 60384-19 Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene- terephthalate film dielectric surface mount d.c. capacitorsAccepted
BS EN 60384-20 Fixed capacitors for use in electronic equipment Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitorsPublic Comment
BS EN 60384-23 Fixed capacitors for use in electronic equipment - Part 23: Sectional specification: Fixed surface mount metallized polyethylene naphthalate film dielectric d.c. capacitorsnull
BS EN 60384-24 Fixed capacitors for use in electronic equipment Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolytePublic Comment
BS EN 60384-25 Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolytePublic Comment
BS EN 60384-8 Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1Accepted
BS EN 60384-9 Fixed capacitors for use in electronic equipment - Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2Accepted
BS EN 60512-1-101 Connectors for electronic equipment - Basic testing and measurements Part 1-101x: Blank detail specificationAccepted
BS EN 60512-17-5 Connectors for electronic equipment - Tests and measurements - Part 17-5: Cable clamping tests - Test 17X: Cable clamp resistance to dynamic cablenull
BS EN 60512-29-100 ED 1.0 Connectors for electronic equipment - Tests and measurements Part 29-100: Signal integrity tests up to 500 MHz on M12 style connectors - Tests 29a to 29gAccepted
BS EN 60747-14-6 ED 1.0 Semiconductor devices Part 14-6: Semiconductor sensors - Humidity sensorIdea
BS EN 60747-14-7 ED 1.0 Semiconductor devices Part 14-7: Semiconductor sensors - Flow meterIdea
BS EN 60747-14-8 ED 1.0 Semiconductor devices Part 14-8: Semiconductor sensors - Capacitive degradation sensor of liquidIdea
BS EN 60747-16-5 Semiconductor devices Part 16-5: Microwave integrated circuits - OscillatorsApproval
BS EN 60747-3 Semiconductor devices Part 3: Signal (including switching diodes) and regulator diodesApproval
BS EN 60747-5-5+A1 Semiconductor devices - Discrete devices Part 5-5: Optoelectronic devices – PhotocouplersPublic Comment
BS EN 60747-5-6 Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodesAccepted
BS EN 60747-5-7 Semiconductor devices - Discrete devices - Part 5-7: Photodiodes and phototransistorsAccepted
BS EN 60747-6 Ed 3.0 Semiconductor devices - Discrete devices Part 6 : ThyristorsAccepted
BS EN 60747-6 Semiconductor devices - Discrete devices Part 6 : Thyristorsnull
BS EN 60749-26 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)Approval
BS EN 60749-28 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Charged Device Model (CDM)Public Comment
BS EN 60749-42 Semiconductor devices - mechanical and climatic test methods Part 42: Temperature humidity storagePublic Comment
BS EN 60749-43 Semiconductor devices - mechanical and climatic test methods Part 43: Guidelines for LSI reliability qualification plansnull
BS EN 60825-1 Safety of laser products - Part 1: Equipment classification and requirementsPublic Comment
BS EN 60825-12 ED.2 Safety of laser products Part 12: Safety of free space optical communication systems used for transmission of informationAccepted
BS EN 60825-14 ED.2 Safety of laser products Part 14: A user's guideAccepted
BS EN 60825-17 ED.2 Safety aspects for use of passive optical components and optical cables in high power optical fibre communication systemsAccepted
BS EN 60848 GRAFCET specification language for sequential function chartsPublication
BS EN 60904-8 ED 3.0 Photovoltaic devices Part 8: Measurement of spectral response of a photovoltaic (PV) devicePublic Comment
BS EN 60939-3 Passive filter units for electromagnetic interference suppression Part 3: Standard for passive filter units for which safety tests are appropriateAccepted
BS EN 60940 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1Accepted
BS EN 60966-2-7 ED.1 Radio frequency and coaxial cable assemblies Part 2-7: Detail specification for cable assemblies for radio and TV recievers - Frequency range 0 MHz to 3000 MHz, IEC 61169-47 connectorsAccepted
BS EN 61045-1 Fixed film resistor networks for use in electronic equipment - Part 1 : Generic specificationPublic Comment
BS EN 61076-2-104 ED 2.0 Connectors for electronic equipment - Product requirements Part 2-104:Circular connectors - Detail specification for circular connectors with M8 screw-locking or snap-lockingPublic Comment
BS EN 61076-2-109 Connectors for electronic equipment - Product requirements Part 2-109: Circular connectors - Detail specification for connectors M 12 x 1 with screw-locking, for data transmissions with frequencies up to 500 mhzPublic Comment
BS EN 61076-2-111 Connectors for electronics equipment Part 2-111: Circular connectors - Detail specification for plug and jack for 2 mm barrel-type battery charging interfacenull
BS EN 61076-2-112 Connectors for electronic equipment Part 2-112: Product requirements - Circular connectors, Detail specification for M12 power connectors up to12 Amps with screw-lockingnull
BS EN 61076-3-104 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 2 000 MHznull
BS EN 61076-3-104 Ed 3.0 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way; shielded free and fixed connectors for data transmissions with frequencies up to 1000 MHzAccepted
BS EN 61076-4-116+A1 equipment - Product requirements Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding functionAccepted
BS EN 61082-1 Preparation of documents used in electrotechnology - Part 1: RulesAccepted
BS EN 61169-26 Radio-frequency connectors - Part 26: Sectional specification for TNCA series RF coaxial connectorsApproval
BS EN 61169-4 Radio-frequency connectors - Part 4: RF coaxial connectors with inner diameter of outer conductor 16 mm (0.63 in) with screw lock - Characteristic impedance 50 ? (Type 7-16)Approval
BS EN 61169-42 Radio-frequency connectors - Part 42: Sectional specification for CQN series quick lock RF coaxial connectorsApproval
BS EN 61169-43 ED 1.0 Radio-frequency connectors Part 43: Sectional specification for RBMA Series Blind amting RF coaxil connectorsApproval
BS EN 61169-44 ED.1 Radio-frequency connectors - Part 44: Sectional specification for SMP series RF coaxial connectorsApproval
BS EN 61169-48 Ed.1 Radio-frequency connectors - Part 48: Sectional specification for BMP Series Blind mating R.F. coaxial connectorsPublic Comment
BS EN 61169-49 Ed 1.0 Radio-frequency connectors - Part 49: Sectional specification for SMAA series R.F connectorsPublic Comment
BS EN 61169-51 Ed.1 Radio-frequency connectors - Part 51: Sectional specifications RF coaxial connectors with inner diameter of outer conductors 13.5 mm with bayonet lock characteristics impedamce 50 Ohm (type QLI)Public Comment
BS EN 61175 Industrial systems, installations and equipment and industrial products - Designation of signalsAccepted
BS EN 61188-8 ED 1.0 Componenet shape data specification for CAD library - Part 8-1: Generic descriptions of the 2D and 3D descriptionAccepted
BS EN 61189-11 ED.1 Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloysApproval
BS EN 61189-3-913 ED.1 Test methods for electronic circuit board for high-brightness LEDsPublic Comment
BS EN 61189-5-2 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering FluxPublic Comment
BS EN 61189-5-3 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering pastePublic Comment
BS EN 61189-5-4 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed abd non-fluxed solid wirePublic Comment
BS EN 61190-1-2 AM1 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality intercomnnects in electronics assemblyPublic Comment
BS EN 61191-1 ED 2.0 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologiesApproval
BS EN 61191-2 ED 2.0 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assembliesApproval
BS EN 61193-3 QUality assessment systems - Part 3: Selection and use of sampling palns for printed board and laminate end-product and in-process auditingApproval
BS EN 61196-1-119 Coaxial communication cables Part 1-119: RF Power RatingIdea
BS EN 61196-10 Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polyterafluoroethylene (PTFE) dielectricPublic Comment
BS EN 61196-10-1 Coaxial Communication Cables Part 10-1: Blank detail specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectricAccepted
BS EN 61196-9 ED.1 Coaxial Communication Cables Part 9: Sectional specification for flexible RF Coaxial cablesPublic Comment
BS EN 61215 Crystalline silicon terrestrial photovoltaic (PV) modules - Design qualification and type approvalAccepted
BS EN 61249-2-43 Ed.1 Materials for printed boards and other interconnecting structures Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublic Comment
BS EN 61249-2-44 Ed.1 Materials for printed boards and other interconnecting structures Part 2-44: Reinforced base materials clad and unclad - Non-halogened epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemblyPublic Comment
BS EN 61249-3-1, ED.1 Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad lamintes for flexible baords (adhesive and non- adhesive tpes)Idea
BS EN 61249-4-18 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepeg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepeg of defind flammability (vertical burning test) for lead- free assemblyApproval
BS EN 61249-4-19 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepeg materials, unclad (for the manufacture of multilayer boards) - High performance non- halogenated epoxide woven of defind flammability (vertical burning test) for lead-free assemblyApproval
BS EN 61360-5 Ed 2.0 Standard data element types with associated classification scheme for electric components - Part 5: Extensions to the EXPRESS dictionary schemaIdea
BS EN 61360-6 Quality guide for IEC 61360 compliant database contentnull
BS EN 61587-5 Mechanical structures for electronic equipment - Tests for IEC 60917 and and IEC 60297 Part 5: Seismic tests for chassis, subracks, and associated plug-in unitPublic Comment
BS EN 61726 ED.2 Cable assemblies, cables, connectors and passive coponents - screening attentuation measurement by the reverberation chamber methodPublic Comment
BS EN 61730-1 Ed 2.0 Photovoltaic (PV) module safety qualification Part 1: Requirements for constructionAccepted
BS EN 61730-1:2007/A2 IEC 61730-1/A2 Photovoltaic (PV) module safety qualification Part 1: Requirements for constructionPublication
BS EN 61730-2 ED 2.0 Photovoltaic (PV) module safety qualification Part 2: Requirements for testingAccepted
BS EN 61747-1-1 Liquid crystal display devices Part 1-1: Generic - Generic specificationAccepted
BS EN 61747-1-2 Liquid crystal display devices Part 1-2: Terminology and letter symbolsAccepted
BS EN 61747-10-1 Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - MechanicalPublic Comment
BS EN 61747-10-2 Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and enduranceAccepted
BS EN 61747-2 Ed 2.0 Liquid crystal display devices Part 2: Liquid crystal display modules - Sectional specificationAccepted
BS EN 61747-2 Liquid crystal display devices Part 2: Liquid crystal display modules – Sectional specificationnull
BS EN 61747-2-1 Liquid crystal display devices Part 2-1: Passive matrix monochrome LCD modules - Blank detail specificationPublic Comment
BS EN 61747-2-2 Ed 2.0 Liquid crystal display devices Part 2-2: Matrix colour LCD modules - Blank detail specificationAccepted
BS EN 61747-2-2 Liquid crystal display devices Part 2-2: Matrix colour LCD modules - Blank detail specificationnull
BS EN 61747-20-1 Liquid crystal display devices Part 20-1: Visual inspection - Monochrome liquid crystal display cellsAccepted
BS EN 61747-20-2 Ed 1.0 Liquid crystal display devices Part 20-2: Visual inspection - Monochrome matrix liquid crystal display modulesAccepted
BS EN 61747-3 Liquid crystal display devices Part 3: Liquid crystal display (LCD) cells - Sectional specificationAccepted
BS EN 61747-4-1 Ed 2.0 Liquid crystal display devices Part 4-1: Matrix colour LCD modules - Essential ratings and characteristicsAccepted
BS EN 61747-4-1 Liquid crystal display devices Part 4-1: Matrix colour LCD modules - Essential ratings and characteristicsnull
BS EN 61747-40-1 Liquid crystal display devices Part 40-1: Mechanical testing guidelines for display cover glass for mobile devicesApproval
BS EN 61747-5-4 ED.1 Liquid crystal display devices Part 5-4: Environmental, endurance and mechanicaltest methods - Mechanical testing guidelines for display cover glass for display cover glass for mobile devicesnull
BS EN 61747-6-2:2011/COR1 Liquid crystal display devices - Part 6-2: Measuring methods for liquid crystal display modules - Reflective typePublication
BS EN 61760-4 ED 1.0 Classification, Packaging,Labelling and handling of moisture sensitive devicesAccepted
BS EN 61829 Crystalline silicon photovoltaic (pv) array – On-site measurement of i-vcharacteristicsPublic Comment
BS EN 61837-2:2011+A1 Surface mounted piezoelectric devices for frequency control and and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures Amendment 1null
BS EN 61853-2 ED 1.0 Photovoltaic (PV) module performance testing and energy rating Part 2: Spectral response, incidence angle and module operating temperature measurementsPublic Comment
BS EN 61881-3/ AMD 1 Railway application – Rolling stock equipment – Capacitors for Power electronic Part 3: Electric double-layer capacitorsPublic Comment
BS EN 61935-1 Ed.4 TESTING OF BALANCED COMMUNICATION CABLING IN ACCORDANCE WITH ISO/IEC 11801 Part 1: Installed cablingPublic Comment
BS EN 61935-2-21 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-21: Cord and work area cord category 6- Blank detail specificationPublic Comment
BS EN 61935-2-22 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-22: Cord and work area cord category 6A- Blank detail specificationPublic Comment
BS EN 61935-2-23 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-23: Cord and work area cord category 7- Blank detail specificationPublic Comment
BS EN 61935-2-24 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-24: Cord and work area cord category 7A- Blank detail specificationPublic Comment
BS EN 61988-2-6 Plasma display panels Part 2-6: Measuring methods - APL dependent gamma and colour characteristicsAccepted
BS EN 61988-4-2 Plasma Display Panels Part 4-2: Panel strength measuring methodsApproval
BS EN 62047-11 Semiconductor devices - Micro-electromechanical devices Part 11: Test method for linear thermal expansion coefficients of MEMS materialsApproval
BS EN 62047-15 Semiconductor devices - Micro - electromechanical devices - Part 14: Forming limit measuring method of metallic film materialsAccepted
BS EN 62047-16 ED 1.0 Semiconductor devices – Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methodsAccepted
BS EN 62047-17 Semiconductor devices – Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin filmsAccepted
BS EN 62047-18 Semiconductor devices – Micro-electromechanical devices Part 18: Microelectro mechanical devises - Bending test methods of thin film materialsApproval
BS EN 62047-19 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compassesApproval
BS EN 62047-20 Semiconductor devices - Micro-electromechanical devices - Part 20: GyroscopesAccepted
BS EN 62047-21 Semiconductor devices – Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materialsPublic Comment
BS EN 62047-22 Semiconductor devices – Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substratesPublic Comment
BS EN 62116 ED 2.0 Test procedure of islanding prevention measures for utility-interconnected photovoltaic invertersPublic Comment
BS EN 62132-1 Integrated circuits - Measurement of electromagnetic immunity Part 1: General conditions and definitionsnull
BS EN 62132-6 Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) methodnull
BS EN 62137-4 Ed.1 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devicesPublic Comment
BS EN 62137-4 Review report on IEC 62137-4 Ed.1: Electronics assembly technology Part 4: Environmental and endurance test methods for solder joint of area array type package surface mount devicesAccepted
BS EN 62153-4-1 Ed.3 Metallic communication cable test methods Part 4-1: Introduction to Electromagnetic (EMC) Test MethodsPublic Comment
BS EN 62153-4-15 Ed.1 Metallic Communication Cable test methods Part 4-15: Electromagnetic compatibility (EMC) – Test method for measuring transfer impedance and screening attenuation – or coupling attenuation with Triaxial CellPublic Comment
BS EN 62153-4-3 ED.2 Metalic communication cable test methods Part 4-3: Electromagnetic compatability (EMC) - Surface tarnsfer impedance - Triaxial methodPublic Comment
BS EN 62153-4-7 Ed.2 Metallic Communication Cable test methods Part 4-7: Electromagnetic compatibility (EMC) - Shielded screening attenuation test method for measuring the Transfer impedance Zt and the screening attenuation aS or the Coupling attenuation aC of RF-Connectors and assemblies up to and above 3 GHz; Tube in Tube methodPublic Comment
BS EN 62215-3 ED 1.0 Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection methodPublic Comment
BS EN 62326-15 Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active device, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and dicrete packages.Public Comment
BS EN 62326-18 Ed.1 Printed boards Part 18: Standard on Device Embeded Substrate - Test methodsIdea
BS EN 62326-20 ED.1 Electronic circuit board for high-brightness LEDs Printed boardsIdea
BS EN 62341-1-2 Organic light emitting diode displays Part 1-2: Terminology and letter symbolsAccepted
BS EN 62341-5-2 Organic Light Emitting Diode (OLED) Displays Part 5-2: Mechanical endurance test methodsApproval
BS EN 62341-5-3 ED 1.0 Organic light emitting diode (OLED) displays Part 5-3: Measuring methods of image sticking and lifetimeApproval
BS EN 62362/ED.1 Product description standard for printed board, printed board assembly, and testing in XML schemanull
BS EN 62391-1 Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specificationPublic Comment
BS EN 62435 ED 1.0 Long-term storage of electronic semiconductor devicesIdea
BS EN 62446 Ed 2.0 Grid connected PV systems - Minimum requirements for system documentation; commissioning tests and inspectionAccepted
BS EN 62446 Ed2 Grid connected PV systems - Minimum requirements for system documentation, commissioning tests and inspectionnull
BS EN 62449 Connectors for electronic equipment – Product requirements – Detail specification for SCA-2 (Single Connector Attach -2) unshielded connectorsPublic Comment
BS EN 62451 HSSDC-2 Shielded ConnectorsAccepted
BS EN 62468 ED. 1.0 The marking for presence and absence of the specified chemical substancein materials, components and mounted boards in electrical and electronicequipmentApproval
BS EN 62483 Environmental acceptance requirements for tin whisker susceptibility tin and tin alloy surface finishesnull
BS EN 62588 ED.1 Marking and labeling components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributesPublic Comment
BS EN 62595-1-1 ED 1.0 LCD Backlight unit Part 1-1: Generic specificationPublic Comment
BS EN 62610-4 ED 1.0 Mechanical structures for electronic equipment-Thermal management Part 4:Cooling performance tests for water supplied heat exchangers in electron cabinetsApproval
BS EN 62629-1-2 3D display devices - Part 1-2: Terminology and letter symbolsApproval
BS EN 62629-12-1 3D display devices- Part 12-1: Measuring methods for Stereoscopic displays using glasses - OpticalPublic Comment
BS EN 62629-22-1 3D display devices Part 22-1: Measuring methods for Autostereoscopic displays - OpticalApproval
BS EN 62629-6-2 3D display devices - Part 6-2: Optical measuring methods for stereoscopic displays using glassesnull
BS EN 62656-1 Standardized product ontology register and transfer by spreadsheets - Part 1:Logical structure for data parcelsPublic Comment
BS EN 62656-3 Standardized product ontology register and transfer by spreadsheets - Part 3:Interface for Common Information ModelPublic Comment
BS EN 62670-1 ED 1.0 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 1: Performance measurements and power rating - Irradiance and tempe raturePublic Comment
BS EN 62679-1 Electronic Paper Display Part 1:Terminology and generic specificationPublic Comment
BS EN 62679-3-1 Electronic paper display Part 3-1: Measuring methods - OpticalPublic Comment
BS EN 62688-1 ED 1.0 Concentrator photovoltaic (CPV) module and assembly safety qualificationAccepted
BS EN 62699 ED 1.0 Mapping Rules and Exchange Methods for Heterogeneous Part LibrariesPublic Comment
BS EN 62715-1-1 Flexible display devices - Part 1-1: Terminology and letter symbolsPublic Comment
BS EN 62715-6-1 Flexible display devices Part 6-1: Mechanical stress test methodsPublic Comment
BS EN 62739-1 Test method for erosion of wave solering equipment by molten lead free solder alloy Part 1: Erosion test method for the metalic material without surface treatmentApproval
BS EN 62744 Dynamic representation of Graphical symbolsPublic Comment
BS EN 62759-1 Transportation testing of photovoltaic (PV) modules Part 1: Transportation and shipping of PV module stacksAccepted
BS EN 62779-1 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirementsAccepted
BS EN 62779-2 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performancesAccepted
BS EN 62782 Dynamic mechanical load testing for photovoltaic (PV) modulesAccepted
BS EN 62783-1Ed.1 TWINAX CABLES FOR DIGITAL COMMUNICATIONS - Part 1: GENERIC SPECIFICATIONPublic Comment
BS EN 62804 System voltage durability qualification test for crystalline silicon modulesAccepted
BS EN 62810 Ed.1 Cylindrical cavity method to measure the complex permittivity of low-loss dielectric rodsPublic Comment
BS EN 62812 Method of measurement of low resistancenull
BS EN 62813 Electrical characteristics test methods of lithium ion capacitors for use in electric and electronic equipmentAccepted
Opens a new windowBS EN 62817 Solar trackers for photovoltaic systems - Design qualificationPublic Comment
BS EN 772-5 Methods of test for masonry units Part 5: Determination of the active soluble salts content of clay masonry unitsIdea
BS EN 846-9 Methods of test for ancillary components for masonry Part 9: Determination of flexural resistance and shear resistance of lintelsIdea
BS EN IEC 60940/A1 AMD 1 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppressionnull
BS EN ISO 11267 Soil quality - Inhibition of reproduction of Collembola (Folsomia candida) by soil pollutants (ISO 11267:1999)Public Comment
BS EN ISO 16387 Soil quality - Effects of pollutants on Enchytraeidae (Enchytraeus sp.) - Determination of effects on reproductionApproval
BS EN NWIP TEST METHOD 3 Test Method 3 - Temperature humidity storagenull
BS EN TR 60825-15 Safety of laser products - Part 15: Guidance on manufacturing requirements relating to non-laser optical radiation safetyPublic Comment
BS EN TS 62789 Specification of concentrator cell descriptionnull
BS EN WI 00230304 Water quality — Performance requirements and conformity test procedures for water monitoring equipment — Part 2: Continuous measuring devicesIdea
BS EN WI 00230305 Water quality — Performance requirements and conformity test procedures for water monitoring equipment — Part 3: Portable measuring devicesIdea
BS ENISO 10710 Water quality - Growth inhibition test with the marine and brackish water macroalga Ceramium tenuicornePublication
BS ENISO 11063 Soil quality - Method to directly extract DNA from soil samplesPublication
BS ENISO 11206 Water quality - Determination of dissolved bromate - Method using ionchromatography (IC) and post column reaction (PCR)Publication
BS ENISO 11269-2 Soil quality - Determination of the effects of pollutants on soil flora Part 2: Effects of contaminated soils on the emergence and early growth of higher plantsPublication
BS ENISO 11272 Soil quality - Determination of dry bulk density (ISO 11272)Accepted
BS ENISO 11274 Soil quality - Determination of the water-retention characteristic - Laboratory methods (ISO 11274:1998 + C1:2009)Accepted
BS ENISO 11275 Soil quality - Determination of unsaturated hydraulic conductivity and water-retention characteristic - Wind's evaporation method (ISO 11275)Accepted
BS ENISO 11276 Soil quality - Determination of pore water pressure - Tensiometer method (ISO 11276)Accepted
BS ENISO 11461 Soil quality - Determination of soil water content as a volume fraction using coring sleeves - Gravimetric method (ISO 11461)Accepted
BS ENISO 11508 Soil quality - Determination of particle density (ISO 11508)Accepted
BS ENISO 14238 Soil quality - Biological methods - Determination of nitrogen mineralization and nitrification in soils and the influence of chemicals on these processes (ISO/DIS 14238)Approval
BS ENISO 15009 Soil quality - Gas chromatographic determination of the content of volatile aromatic hydrocarbons, naphthalene and volatile halogenated hydrocarbons - Purge-and-trap method with thermal desorptionApproval
Opens a new windowBS ENISO 16198 Soil quality - Plant-based biotest to assess the environmental bioavailability of trace elements to plantsPublic Comment
BS ENISO 16558-1 Soil quality - Risk based petroleum hydrocarbons Part 1: Determination of aliphatic and aromatic fractions of volatile petroleum hydrocarbons using gas chromatography (static headspace method)Public Comment
BS ENISO 16558-2 Soil quality - Risk-based petroleum hydrocarbons Part 2: Determination of aliphatic and aromatic fractions of semi-volatile petroleum hydrocarbons using gas chromatography with flame ionisation detection (GC/FID)Public Comment
BS ENISO 17184 Soil quality - Determination of carbon and nitrogen by near infrared spectrometryPublic Comment
BS ENISO 17380 Soil quality - Determination of total cyanide and easily liberatable cyanide - Continuous-flow analysis methodApproval
BS ENISO 19250 Water quality - Detection of Salmonella spp.Approval
BS ENISO 22155 Soil quality - Gas chromatographic determination of volatile aromatic and halogenated hydrocarbons and selected ethers - Static headspace method (ISO 22155:2011)Publication
BS ENISO 23611-5 Soil quality - Sampling of soil invertebrates Part 5: Sampling and extraction of soil macro-invertebratesPublication
BS ENISO 23611-6 Soil quality - Sampling of soil invertebrates Part 6: Guidance for the design of sampling programmes with soil invertebratesApproval
BS ENISO 27108 Water quality - Determination of selected plant treatment agents and biocide products - Method using solid-phase microextraction (SPME) followed by gas chromatography-mass spectrometry (GC-MS)Approval
BS IEC 60191-2/F65 Proposed new package outline - Plastic Bottom-landed Small Outline Non-lead package (P-BSO-N2/3/4/5/6)Public Comment
BS IEC 60393-2 Potentiometers for use in electronic equipment. Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometersPublic Comment
BS IEC 60393-5 Potentiometers for use in electronic equipment. Part 5: Sectional specification - Single-turn rotary low-power wirewound and non-wirewound potentiometersPublic Comment
BS IEC 60393-6 Potentiometers for use in electronic equipment. Part 6: Sectional specification - Surface mount preset potentiometersPublic Comment
BS IEC 60494-2 ED 2.0 Railway applications - Rolling stock - Pantographs: Characteristics and tests - Part 2: Pantographs for metros and light rail vehiclesApproval
BS IEC 62243 IEEE standard for artificial intelligence exchange and service tie to all test environments (AIESTATE)(IEEE 1232-2010)Approval
BS IEC 62483 ED 1.0 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishesPublic Comment
BS IEC 62670-2 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 2: Energy rating by measurementAccepted
BS IEC 62679-3-2 ED 1.0 Electronic paper display Part 3-2 : Measuring methods - Electro-opticalApproval
BS ISO 11074 Soil quality - VocabularyPublic Comment
BS ISO 11268-3 Soil quality - Effects of pollutants on earthworms Part 3: Guidance on the determination of effects in field situationsPublic Comment
BS ISO 11916-1 Soil quality - Determination of selected explosive compounds Part 1: Method using high-performance liquid chromatography (HPLC) with ultraviolet detectionApproval
BS ISO 11916-2 Soil quality - Determination of selected explosive compounds Part 2: Method using gas chromatography with electron capture detection (ECD)or mass spectrometric detection (MS)Approval
BS ISO 13163-1 Water quality - Measurement of lead 210 activity concentration Part 1: Liquid scintillation counting methodPublic Comment
BS ISO 13164-1 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 1: Radon origins and measurement methodsApproval
BS ISO 13164-2 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 2: Direct measurement by gamma spectrometryApproval
BS ISO 13164-3 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 3: Indirect measurement with degassingApproval
BS ISO 13164-4 Water quality - Measurement of the activity concentration of radon-222 Part 4: Test method using liquid scintillation countingAccepted
BS ISO 13165-2 Water quality - Measurement of radium 226 activity concentration Part 2: Method using emanometryPublic Comment
BS ISO 13165-3 Water quality - Measurement of radium 226 activity concentration Part 3: Method by coprecipitation and gamma spectrometryAccepted
BS ISO 13166-1 Water quality - Measurement of uranium activity concentration - Method using alpha spectrometryPublic Comment
BS ISO 13168 Water quality - Simultaneous determination of tritium and carbon 14 activities - Test method using liquid scintillation countingPublic Comment
BS ISO 13859 Soil quality - Determination of polycyclic aromatic hydrocarbons (PAH)by gas chromatography (GC) and high performance liquid chromatography (HPLC)Public Comment
BS ISO 13876 Soil quality — Determination of polychlorinated biphenyls (PCB) by gas c hromatography with mass selective detection (GC-MS) and gas chromatograp hy with electron-capture detection (GC ECD)Public Comment
BS ISO 13913 Soil quality — Determination of selected phthalates using capillary gas chromatography with mass spectrometric detection (GC/MS)Public Comment
BS ISO 13914 Soil quality — Determination of dioxins and furans and dioxinlike polych lorinated biphenyls by gas chromatography with high-resolution mass sele ctive detection (HR GC/MS)Public Comment
BS ISO 14388-1 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 1: Introduction and definitions, symbols and acronyms, sampling and sample preparationPublic Comment
BS ISO 14388-2 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 2: Chromium reducible sulfur (CRS) methodologyPublic Comment
BS ISO 14388-3 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 3: Suspension peroxide oxidation combined acidity and sulfur (SPOCAS) methodologyPublic Comment
BS ISO 14858 Soil quality - Assessment of bioavailability in terrestrial systems - Use of extracts for the estimation of the transfer of metalsPublic Comment
BS ISO 16727 Soil quality - Determination of mercury in aqua regia and nitric acid digests - Cold vapour atomic fluorescence spectrometry (CVAFS)Accepted
BS ISO 16729 Soil quality - Digestion of nitric acid soluble fractions of elementsPublic Comment
BS ISO 16965 Soil quality - Determination of trace elements using inductively coupled plasma mass spectrometry (ICP-MS)Accepted
BS ISO 17073 Soil quality - Determination of trace elements in aqua regia and nitric acid digests - Graphite furnace atomic absorption spectrometry method (GFAAS)Accepted
BS ISO 17182 Soil quality - Determination of some selected phenols and chlorophenols - Gas chromatographic method with mass spectrometric detectionPublic Comment
BS ISO 17183 Soil quality - Screening soils for alcohol-extracted organic compounds by turbidity analysisAccepted
BS ISO 17586 Soil quality - Assessment of the bioavailability - Extraction of metals using 0,43 mol/l nitric acid solutionAccepted
BS ISO 17601 Soil quality - Method to quantify the abundance of microbial communities from soil DNA extractsAccepted
BS ISO 18105 Soil quality - Detection of water soluble chromium(VI) using a test-kit methodAccepted
BS ISO 18187 Soil quality - Quality of solid samples - Solid contact test using the dehydrogenase activity of Arthrobacter globiformisAccepted
BS ISO 18227 Soil quality - Determination of elemental composition by X-ray fluorescencePublic Comment
BS ISO 18311 Soil quality - Method for testing effects of soil contaminants on the feeding activity of soil dwelling organisms - Bait-lamina testAccepted
BS ISO 18400-101 Soil quality - Sampling Part 101: Framework for the preparartion and application of a sampling planAccepted
BS ISO 18400-102 Soil quality - Sampling Part 102: Selection and application of sampling techniquesAccepted
BS ISO 18400-103 Soil quality - Sampling Part 103: SafetyAccepted
BS ISO 18400-105 Soil quality - Sampling Part 105: Package, transport, storage, preservationAccepted
BS ISO 18400-106 Soil quality - Sampling Part 106: Quality control and quality assuranceAccepted
BS ISO 18400-107 Soil quality - Sampling Part 107: Recording and reportingAccepted
BS ISO 18400-201 Soil quality - Sampling Part 201: Pretreatment in the fieldAccepted
BS ISO 18504 Soil quality - Guidance on sustainable remediationIdea
BS ISO 28258 Soil quality - Digital exchange of soil-related dataApproval
BS ISO 29200 Soil quality — Assessment of genotoxic effects on higher plants — Vicia faba micronucleus testApproval
BS ISO 9696 Water quality - Measurement of gross alpha activity in non-saline water - Thick source methodPublic Comment
BS ISO 9697 Water quality - Measurement of gross beta activity in non-saline water - Thick source methodAccepted
BS ISO/IEC 10373-2 Identification cards - Test methods Part 2: Cards with magnetic stripesPublic Comment
BS ISO/IEC 10373-5 Identification cards - Test methods Part 5: Optical memory cardsAccepted
BS ISO/IEC 10373-6:2011/AMD 4 Bits rates higher than fc/16 up to fc/2Publication
BS ISO/IEC 10373-6:2011/AMD 5 Bit rates of 3fc/4 and fcPublic Comment
BS ISO/IEC 10373-6:2011/AMD 6 Identification cards - Test methods Part 6: Proximity cards - Amendment 6: Alternating between PICC and PCD functionalitiesPublic Comment
BS ISO/IEC 11694-4 Identification cards - Optical memory cards - Linear recording method Part 4: Logical data structuresAccepted
BS ISO/IEC 11694-5 Identification cards - Optical memory cards - Linear recording method Part 5: Data format for information interchange for applications using ISO/IEC 11694-4, Annex BPublic Comment
BS ISO/IEC 11694-6 Identification cards - Optical memory cards - Linear recording method Part 6: Use of biometrics on an optical memory cardPublic Comment
BS ISO/IEC 11695-4 Identification cards - Optical memory cards - Holographic recording me method Part 4: Logical data structuresPublic Comment
BS ISO/IEC 14443-2:2010/AMD 5 Bits rates of 3fc/4 and fcPublic Comment
BS ISO/IEC 14443-2:2010/Amd 6 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 6: PICC's with external power supplyAccepted
BS ISO/IEC 14443-3:2001/AMD 5 Activation of higher layer protocolsAccepted
BS ISO/IEC 14443-3:2011/AMD 3 Identification cards - Contactless integrated circuit cards - Proximity cards Part 3: Initialization and anticollision - Amendment 3: Alternating support of PICC and PCD rolesPublic Comment
BS ISO/IEC 14443-3:2011/AMD 6 Bit rates of 3fc/4 and fcPublic Comment
BS ISO/IEC 14443-4:2008/AMD 3 Bit rates of 3fc/4 and fcApproval
BS ISO/IEC 14443-4:2008/Amd 4 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendment 4: Frame with error correctionPublic Comment
BS ISO/IEC 17839 Identification cards - Biometric system on cardAccepted
BS ISO/IEC 17839-2 Information technology - Identification cards - Biometric system on card Part 2: Physical characteristicsAccepted
BS ISO/IEC 17839-3 Information technology - Identification cards - Biometric system on card Part 3: Logical information interchange mechanismAccepted
BS ISO/IEC 18013-3:2009/AMD 2 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 2: Extended Access Control EAC v1.11Accepted
BS ISO/IEC 18013-3:2009/Amd 3 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 3: PACEAccepted
BS ISO/IEC 18328 Input Devices on ICC and enhancements of electronic DisplaysIdea
BS ISO/IEC 18745-1 Test methods for machine readable travel documents (MRTD) Part 1: Physical Test Methods for Passport Books (durability)Public Comment
BS ISO/IEC 18745-2 Test methods for machine readable travel documents (MRTD) Part 2: Test methods for the contactless interfaceAccepted
BS ISO/IEC 18745-3 Test methods for machine readable travel documents (MRTD) Part 3: LDS and security protocolsAccepted
BS ISO/IEC 24727-1 Identification cards - Integrated circuit card programming interfaces Part 1: ArchitecturePublic Comment
BS ISO/IEC 24727-2:2008/AMD 1 Enhanced discovery mechanism to identify DER or XER encoding of SALPublic Comment
BS ISO/IEC 24727-3:2008/AMD 1 Identification cards - Integrated circuit card programming interfaces - Part 3: Application interface - Amendment 1: Use of the 7816-15-based Registry and XML representationPublic Comment
BS ISO/IEC 24727-4:2008/AMD 1 Identification cards - Integrated circuit card programming interfaces - Part 4: Application programming interface (API) administration - Amendment 1: XML representationPublic Comment
BS ISO/IEC 25185-1 Identification cards - Integrated circuit card authentication protocols Part 1: Protocol for Lightweight Authentication of IdentityPublic Comment
BS ISO/IEC 7811-1 Identification cards - Recording technique Part 1: EmbossingPublic Comment
BS ISO/IEC 7811-2 Identification cards - Recording technique Part 2: Magnetic stripePublic Comment
BS ISO/IEC 7811-6 Identification cards - Recording technique Part 6: Magnetic stripe - High coercivityPublic Comment
BS ISO/IEC 7811-7 Identification cards - Recording technique Part 7: Magnetic stripe - High coercivity, high densityPublic Comment
BS ISO/IEC 7811-8 Identification cards - Recording technique Part 8: Magnetic stripe - Coercivity of 51,7 kA/m (650 Oe)Public Comment
BS ISO/IEC 7811-9 Identification cards - Recording technique Part 9: Tactile identifier markAccepted
BS ISO/IEC 7812-1 Identification cards - Identification of issuers Part 1: Numbering systemApproval
BS ISO/IEC 7812-2 Identification cards - Identification of issuers Part 2: Application and registration proceduresApproval
BS ISO/IEC 7816-13:2007/COR 1D COR 1 Identification cards - Integrated circuit cards Part 13: Commands for application management in a multi-application environmentAccepted
BS ISO/IEC 8484 Information technology - Magnetic stripes on savingsbooksAccepted
BS ISO/IEC I 18584 Test Methods for ISO/IEC 24787 based ApplicationsIdea
BS ISO/IEC/TR 30117 Information Technology - Guide to on-card biometric comparison standards and applicationsPublic Comment
BSEN 61169-1 Radio Frequency Connectors Part 1: Generic specification - General requirements and measuring methodsApproval
BSEN62145 ED 1.0 Crystalline silicon terrrestrial photovoltaic (PV) modules - Blank detail specificationAccepted
BSEN62326-3 ED 1.0 PRINTED BOARDS Part 3: Safety Certification of Rigid Printed Circuit Boards for Electronic AssembliesPublic Comment
BSIEC61926-2 ED 1.0 Standard Test Languages - Part 2: Test Language for All Systems Requirementsnull
DD IEC/TS 61967-3 Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan methodAccepted
PD BS EN 62716 Ammonia corrosion testing of photovoltaic (PV) modulesApproval
PD CEN/TS 15480-3 Identification card systems - European Citizen Card Part 3: European Citizen Card Interoperability using an application interfaceAccepted
PD CEN/TS 15480-5 Identification card systems - European Citizen Card Part 5: General IntroductionPublication
PD CEN/TS 16634 Recommendations for using biometrics in European automated border crossingAccepted
PD CEN/TS 419241 Security Requirements for Trustworthy Systems supporting Server Signing Part 5: Server SigningAccepted
PD CLC/TR 62258-4 Semiconductor die products - Part 4: Questionnaire for die users and suppliersPublication
PD EN 62548 Design requirements for photovoltaic (PV) arraysApproval
PD IEC TS 61910 ED1 Interoperability Verilog and VHDL (Technical report)null
PD IEC/PAS 61169-42 Radio-frequency connectors - Part 42: Sectional specification for CQN series quick lock RF coaxial connectorsApproval
PD IEC/PAS 62515 Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems - Maintenance of project 62515 including development of IEC/TS 62515null
PD IEC/TR 6082-5-16 ED 1.0 Safety of intense light source equipment - Guidelines for the use of intense light sourse equipment on humans and animalsIdea
PD IEC/TR 60825-16 ED.1 Safety of intense light source equipment - Part 16: Guidelines for the safe use of intense light source equipment on humans and animalsIdea
PD IEC/TR 61156-1-5 Ed 1.0 Multicore and symmetrical pair/quad cables for digital communications Part 1-5: Correction procedures for the measurement results of return loss and input impedanceApproval
PD IEC/TR 61156-1-5 Multicore and symmetrical pair/quad cables for digital communications Part 1-5: Correction procedures for the measurement results of return loss and input impedanceIdea
PD IEC/TR 62839-1 Ed.1 Environmental declaration Part 1: wires and cables and accessories products specific rulesIdea
PD IEC/TS 62132-9 Integrated circuits, measurement of electromagnetic immunity Part 9: Measurement of radiated immunity - Surface scan methodnull
PD IEC/TS 62326-16 Ed.1 Printed boards Part 16: Device Enbedded Subctrate Technology - GenericsIdea
PD IEC/TS 62326-17 Ed.1 Printed boards Part 17: Device enbedded substrates - TEG (test element group)Idea
PD IEC/TS 62326-19 Ed.1 Printed boards Part 19: Device Embedded Substrate - Design GuideAccepted
PD IEC/TS 62326-7-1 Printed boards - Part 7-1: Performance guide for single-and double-sided flexible peinted boardsAccepted
PD IEC/TS 62450 Technical Specification for 40 pin SCA 2 connector with parallel selectionPublic Comment
PD IEC/TS 62452 Testing and performance requirements for high speed serial and parallel- serial copper linksAccepted
PD IEC/TS 62656-2 Standardized product ontology register and transfer by spread sheets - Part 2: Implementation guide for parcel interchange with IEC CDDPublication
PD IEC/TS 62720 Identification of units of measurement for computer based processingPublication
PD IEC/TS 62789 Ed 1.0 Specification of concentrator cell descriptionAccepted
PD IECTS61907 ED 1.0 Technical Report on System Verilognull
PD ISO/IEC/TR 18268 Identification cards - Contactless integrated circuit cards - Proximity cards - Multiple PICCs in a single PCD fieldAccepted

[ back to top ]

Published standards (135)

Sort by: Reference | Title | Status

Standard referenceNameStatus
BS IEC 62265:2005Advanced library format (ALF) describing integrated circuit (IC) technology, cells and blocksWithdrawn
BS EN 61523-2:2002Delay and power calculation standards - Pre-layout delay calculation specification for CMOS ASIC librariesCurrent
BS EN 61523-1:2002Delay and power calculation standards - Integrated circuit delay and power calculation systemsCurrent
DD ENV 50218:1996Description of a parametrized European mini test chipWithdrawn
DD ENV 50219:1996Description of the reliability test structures of the European mini test chipWithdrawn
BS EN 62433-2:2010EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)Current
DD IEC/TS 62433-1:2011EMC IC modelling - General modelling frameworkCurrent
PD IEC/TR 62433-2-1:2010EMC IC modelling - Theory of black box modelling for conducted emissionCurrent
BS EN 165000-5:1998Film and hybrid integrated circuits - Procedure for qualification approvalCurrent
BS EN 165000-4:1996Film and hybrid integrated circuits - Customer information, product assessment level schedules and blank detail specificationCurrent
BS EN 165000-3:1996Film and hybrid integrated circuits - Self-audit checklist and report for film and hybrid integrated circuit manufacturersCurrent
BS EN 165000-2:1996Film and hybrid integrated circuits - Internal visual inspection and special testsCurrent
BS EN 165000-1:1996Film and hybrid integrated circuits - Generic specification. Capability approval procedureCurrent
DD ENV 190000-6:1994Generic specification: monolithic integrated circuits - Procedure for approval and quality managementCurrent
BS EN 190116:1994Harmonized system of quality assessment for electronic components. Family specification: AC MOS digital integrated circuitsCurrent
BS QC 760000:1990Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specificationCurrent
BS QC 760001:1994Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Generic specification. Requirements for internal visual inspectionCurrent
BS CECC 63000:1990Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuitsObsolescent
BS CECC 90000:1991Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS CECC 90000:1985Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsObsolescent
BS EN 190000:1996Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuitsCurrent
BS CECC 90000:Addendum No. 1:1983Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits. Internal visual inspectionObsolescent
BS CECC 90300:1988Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuitsCurrent
BS QC 760101:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval proceduresCurrent
BS QC 760201:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760100:1991Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film and hybrid integrated circuits: qualification approvalWithdrawn
BS QC 760200:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresCurrent
BS QC 760100:1997Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval proceduresCurrent
BS QC 760200:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approvalWithdrawn
BS QC 790101:1992Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integrated circuits excluding hybrid circuitsCurrent
BS CECC 00013:1985Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor diceWithdrawn
BS CECC 90200:1988Harmonized system of quality assessment for electronic components: sectional specification: analogue monolithic integrated circuitsCurrent, Work in Hand
BS EN 190100:1993Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuitsCurrent, Work in Hand
BS CECC 63100:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuitsObsolescent
BS CECC 63200:1985Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS ISO/IEC 14443-1:2000Identification cards. Contactless integrated circuit(s) cards. Proximity cards - Physical characteristicsWithdrawn
DD IEC/TS 62228:2007Integrated circuits. EMC evaluation of CAN transceiversCurrent
BS EN 61943:1999Integrated circuits. Manufacturing line approval application guidelineCurrent
PD IEC/TR 61967-1-1:2010Integrated circuits. Measurement of electromagnetic emissions - General conditions and definitions. Near-field scan data exchange formatCurrent
BS EN 61967-8:2011Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. IC stripline methodCurrent
BS EN 61967-6:2002+A1:2008Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Magnetic probe methodCurrent
BS EN 61967-4:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 ohm/150 ohm direct coupling methodCurrent
BS EN 61967-1:2002Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - General conditions and definitionsCurrent
BS EN 61967-5:2003Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Workbench Faraday Cage methodCurrent
BS EN 61967-2:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of radiated emissions. TEM cell and wideband TEM cell methodCurrent
PD IEC/TR 61967-4-1:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4Current
DD IEC/TS 61967-3:2005Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz - Measurement of radiated emissions. Surface scan methodCurrent
BS EN 62132-8:2012Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. IC stripline methodCurrent
BS EN 62132-2:2011Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. TEM cell and wideband TEM cell methodCurrent
BS EN 62132-1:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - General conditions and definitionsCurrent, Work in Hand
BS EN 62132-5:2006Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Workbench Faraday cage methodCurrent
BS EN 62132-3:2007Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) methodCurrent
BS EN 62132-4:2006Integrated circuits. Measurement of electromagnetic immunity. 150 kHz to 1 GHz - Direct RF power injection methodCurrent
DD IEC/TS 62215-2:2007Integrated circuits. Measurement of impulse immunity - Synchronous transient injection methodCurrent
BS EN 61964:1999Integrated circuits. Memory devices pin configurationsCurrent
PD 6601:1996JESSI 0.8 µm CMOS transistor model for analogue and digital circuit simulationWithdrawn
DD IEC/TS 62404:2007Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)Current
PD 6598:1996Measurement techniques for the characterization of the European mini test chipWithdrawn
BS IEC 60747-4-1:2000Microwave diodes and transistors. Microwave field effect transistors. Blank detail specification - BDS for microwave field-effect transistorsWithdrawn
PD IEC/TR 61352:2006Mnemonics and symbols for integrated circuitsCurrent
PD 6595:1996Parameter extraction techniques for the European mini test chipWithdrawn
BS EN 62090:2003Product package labels for electronic components using bar code and two-dimensional symbologiesCurrent
BS 9491:1975Rules for the preparation of detail specifications for analogue integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9492:1978Rules for the preparation of detail specifications for capacitively coupled digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9490:1975Rules for the preparation of detail specifications for digital integrated circuits of assessed quality. Full assessment levelWithdrawn
BS 9493:1981Rules for the preparation of detail specifications for integrated circuits of assessed quality which perform mixed digital and/or analogue functionsWithdrawn
BS 9460:1974Rules for the preparation of detail specifications for integrated circuits of assessed quality: differential operational amplifiers. General application categoryWithdrawn
BS 9430:1978Rules for the preparation of detail specifications for integrated circuits of assessed quality: voltage regulators. Full assessment levelWithdrawn
BS 6493-3:1985Semiconductor devices - Mechanical and climatic test methodsWithdrawn
BS EN 60747-16-10:2004Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuitsCurrent
BS EN 60747-16-1:2002+A1:2007Semiconductor devices - Microwave integrated circuits. AmplifiersCurrent
BS IEC 60747-10:1991Semiconductor devices - Generic specification for discrete devices and integrated circuitsCurrent
BS IEC 60747-4-2:2000Semiconductor devices. Discrete devices - Microwave diodes and transistors. Integrated-circuit microwave amplifiers. Blank detail specificationWithdrawn
BS IEC 60748-2:1997Semiconductor devices. Integrated circuits - Digital integrated circuitsCurrent
BS 6493-2.3:1987Semiconductor devices. Integrated circuits - Recommendations for analogue integrated circuitsCurrent
BS IEC 60748-5:1997Semiconductor devices. Integrated circuits - Semicustom integrated circuitsCurrent
BS IEC 60748-4:1997Semiconductor devices. Integrated circuits - Interface integrated circuitsCurrent
BS IEC 60748-23-5:2003Semiconductor devices. Integrated circuits - Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approvalCurrent
BS 6493-2.1:1985Semiconductor devices. Integrated circuits - GeneralWithdrawn
BS IEC 60748-1:2002Semiconductor devices. Integrated circuits - GeneralCurrent
BS IEC 60748-11:2000Semiconductor devices. Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuitsCurrent
BS IEC 60748-4-3:2006Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)Current
BS IEC 60748-2-20:2008Semiconductor devices. Integrated circuits - Digital integrated circuits. Family specification. Low voltage integrated circuitsCurrent
BS 6493-2-2.2:1986Semiconductor devices. Integrated circuits - Recommendations for digital integrated circuitsWithdrawn
BS IEC 60748-2-20:2000Semiconductor devices. Integrated circuits. Digital integrated circuits - Family specification. Low voltage integrated circuitsWithdrawn
BS IEC 60748-2-12:2001Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)Current
BS IEC 60748-2-11:1999Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated circuits electrically erasible and programmable read-only memoryCurrent
BS IEC 60748-23-4:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Blank detail specificationCurrent
BS IEC 60748-23-1:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Generic specificationCurrent
BS IEC 60748-23-2:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Internal visual inspection and special testsCurrent
BS IEC 60748-23-3:2002Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Manufacturers' self-audit checklist and reportCurrent
BS CECC 90112:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write dynamic memories silicon monolithic circuitsCurrent
BS CECC 90111:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write static memories silicon monolithic circuitsCurrent
BS CECC 90113:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS ultra-violet light erasable electrically programmable read only memories silicon monolithic circuitsCurrent
BS CECC 90115:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital gate array integrated circuitsCurrent
BS EN 190110:1994Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital microprocessor integrated circuitsCurrent
BS CECC 63101:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuitsObsolescent
BS CECC 63201:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval)Obsolescent
BS CECC 90105:1987Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fusible link programmable bipolar read only memories, silicon monolithic integrated circuitsCurrent
BS CECC 90203:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated analogue switching circuitsCurrent
BS CECC 90301:1985Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated line transmitters and receiversCurrent
BS CECC 90114:1990Specification for harmonized system of quality assessment for electronic components. Blank detail specification: programmable logic arrays (PLA)Current
BS EN 190106:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced low power SCHOTTKY digital integrated circuits series 54 ALS, 74 ALSCurrent
BS EN 190108:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced SCHOTTKY digital integrated circuits series 54 AS, 74 ASCurrent
BS EN 190107:1994Specification for harmonized system of quality assessment for electronic components. Family specification. TTL FAST digital integrated circuits series 54 F, 74 FCurrent
BS CECC 90104:1981Specification for harmonized system of quality assessment for electronic components. Family specification: C. Mos digital integrated circuits, series 4000B and 4000UBCurrent
BS EN 190109:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCUCurrent, Work in Hand
BS EN 190101:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84Current
BS CECC 90101:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits, series 54, 64, 74, 84Current
BS CECC 90103:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS EN 190103:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LSCurrent
BS EN 190102:1994Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SCurrent
BS CECC 90102:1980Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84SWithdrawn
BS QC 790132:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)Current
BS QC 790131:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Complementary MOS digital integrated circuits (series 4000 B and 4000 UB)Current
BS QC 760201:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approvalWithdrawn
BS QC 760101:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedureWithdrawn
BS QC 790130:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)Current
BS QC 790105:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Integrated circuit fusible-link programmable bipolar read-only memoriesCurrent
BS QC 790304:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear analogue-to-digital converters (ADC)Current
BS QC 790303:1994Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear digital-to-analogue converters (DAC)Current
BS QC 790110:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Microprocessor integrated circuits.Current
BS QC 790202:1991Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Monolithic integrated operational amplifiersCurrent
BS QC 790111:1993Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification: integrated circuit static read/write memoriesCurrent
BS QC 790107:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. Integrated circuit dynamic read/write memoriesCurrent
BS QC 790106:1995Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. MOS ultraviolet light erasable electrically programmable read-only memoriesCurrent
BS QC 790109:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU.Current
BS QC 790104:1992Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification. Complementary MOS digital integrated circuits, series 4000 B and 4000 UBCurrent
BS 9450:1998Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of testObsolescent
BS 9450:1975Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of testWithdrawn
BS 9400:1970Specification for integrated electronic circuits and micro-assemblies of assessed quality (qualification approval procedures): generic data and methods of testWithdrawn
BS 3363:1980Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 1:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS 3363:Supplement No. 2:1981Specification for letter symbols for semiconductor devices and integrated microcircuitsWithdrawn
BS IEC 62528:2007Standard testability method for embedded core-based integrated circuitsCurrent

[ back to top ]

Need Help?

We are here to help you with any queries. Email us for help.

But first, why not view the Help Pages?