BSI Corporate | Contact Us | Site Map | Help

Integrated circuits & microelectronics

Parent Category: Electronics

Standards in development (421)
Published standards (135)
Committees (16)

Standards in development (421)

Standard Title	Status
BS 10175+A1 Investigation of potentially contaminated sites. Code of practice	Accepted
BS 8485 Code of practice for the characterization and remediation from groundgas in affected developments	null
BS CLC/TS 50546 Railway applications - Shore (external) supply system for rail vehicles	Approval
BS EN 1015-11 Methods of test for mortar for masonry —Part 11: Determination of flexural and compressive strength of hardened mortar	Idea
BS EN 1015-12 Methods of test of mortar for masonry Part 12: Determination of adhesive strength of hardened rendering and plastering mortars on substrates	Idea
BS EN 1052-2 Methods of test for masonry Part 2: Determination of flexural strength	Idea
BS EN 140101-806:2008/A Detail Specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads	Accepted
BS EN 140401-801:2007/A Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1	Accepted
BS EN 140401-802:2007/A Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2	Public Comment
BS EN 140401-803:2007/AB Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2	Approval
BS EN 140401-804:2011/A Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25	Accepted
BS EN 140402 Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors	Idea
BS EN 140402-801 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2	Idea
BS EN 14169-2 Protection Profile for Secure Signature Creation Device Part 2: Device with key generation	Approval
BS EN 14890-1 Application Interface for smart cards used as Secure Signature Creation Devices Part 1: Basic services	Public Comment
BS EN 14890-2 Application Interface for smart cards used as Secure Signature Creation Devices Part 2: Additional Services	Public Comment
BS EN 1545-1 Identification card systems - Surface transport applications Part 1: elementary data types, general code lists and general data elements	Public Comment
BS EN 1545-2 Identification card systems - Surface transport applications Part 2: Transport and travel payment related data elements and code lists	Public Comment
BS EN 15910 Water quality - Guidance on the estimation of fish abundance with mobile hydroacoustic methods	Accepted
BS EN 16479-1 Water quality - Performance requirements and conformity test procedures for water monitoring equipment Part 1: Automated sampling devices (samplers) for water and waste water	Public Comment
BS EN 419111-1 Protection profiles for signature creation and verification application Part 1: Introduction to the European Norm	Public Comment
BS EN 419111-2 Protection profiles for signature creation and verification application - Signature creation application Part 2: Core PP	Accepted
BS EN 419111-3 Protection profiles for signature creation and verification application - Signature creation application Part 3: Possible extensions	Public Comment
BS EN 419111-4 Protection profiles for signature creation and verification application - Signature verification application Part 4: Core PP	Public Comment
BS EN 419111-5 Protection profiles for signature creation and verification application - Signature verification application Part 5: Possible extensions	Public Comment
BS EN 50117-1:2002/A + A2 Coaxial cables Part 1: General specification	Approval
BS EN 50117-2-1:2005/A + A2 Coaxial cables Part 2-1: Sectional specification for cables used in cabled distribution networks - Indoor drop cables for systems operating at 5 MHz - 1000 MHz	Approval
BS EN 50117-2-2:2004/A + A2 Coaxial cables Part 2-2: Sectional specification for cables used in cabled distribution networks - Outdoor drop cables for systems operating at 5 MHz - 1000 MHz	Approval
BS EN 50117-2-3:2004/AC + A2 Coaxial cables Part 2-3: Sectional specification for cables used in cabled distribution networks - Distribution and trunk cables for systems operating at 5 MHz - 1000 MHz	Approval
BS EN 50117-2-4:2004/A + A2 Coaxial cables Part 2-4: Sectional specification for cables used in cabled distribution networks - Indoor drop cables for systems operating at 5 MHz - 3000 MHz	Approval
BS EN 50117-2-5:2004/A + A1 Coaxial cables - Part 2-5: Sectional specification for cables used in cabled distribution networks - Outdoor drop cables for systems operating at 5 MHz - 3000 MHz	Approval
BS EN 50117-4-1:2008/AA + A1 Coaxial cables Part 4-1: Sectional specification for cables used in cabled for BCT cabling in accordance with EN 50173 - Indoor drop cables for systems operating at 5 MHz - 3000 MHz	Approval
BS EN 50125-1 Railway applications - Environmental conditions for equipment Part 1: Equipment on board rolling stock	Public Comment
BS EN 50153 Railway applications - Rolling stock - Protective provisions relating to electrical hazards	Public Comment
BS EN 50155 Railway applications - Electronic equipment used on rolling stock	Idea
BS EN 50288-1 Multi-element metallic cables used in analouge and digital communication and control - Part 1: Generic specification	Approval
BS EN 50288-10-2 Multi-element metallic cables used in analogue and digital communication and control Part 10-2: Sectional specification for screened cables characterized up to 500 MHz - Work area and patch cord cables	Idea
BS EN 50288-11-2 Multi-element metallic cables used in analogue and digital communication and control - Part 11-2: Blank detail speification .for horizontal, building backbone and patch cables - For industrial or environmental demanding areas	Idea
BS EN 50288-2-1 Multi-element metallic cables used in analouge and digital communication and control - Part 2-1: Sectional specification for screened cables characterised up to 100 MHz - Horizontal and building backbone cables	Approval
BS EN 50288-2-2 Multi-element metallic cables used in analouge and digital communication and control - Part 2-2: Sectional specification for screened cables characterised from 1 MHz up to 100 MHz - Work area, patch cord and data centres cables	Approval
BS EN 50288-3-1 Multi-element metallic cables used in analouge and digital communication and control - Part 3-1: Sectional specification for unscreened cables characterised up to 100 MHz - Horizontal and building backbone cables	Approval
BS EN 50288-3-2 Multi-element metallic cables used in analouge and digital communication and control - Part 3-2: Sectional specification for unscreened cables characterised up to 100 MHz - Work area and patch cord cables	Approval
BS EN 50288-4-1 Multi-element metallic cables used in analouge and digital communication and control - Part 4-1: Sectional specification for screened cables characterised up to 600 MHz - Horizontal and building backbone cables	Approval
BS EN 50288-4-2 Multi-element metallic cables used in analouge and digital communication and control - Part 4-2: Sectional specification for screened cables characterised up to 600 MHz - Work area and patch cord cables	Approval
BS EN 50288-5-1 Multi-element metallic cables used in analouge and digital communication and control - Part 5-1: Sectional specification for screened cables characterised up to 250 MHz - Horizontal and building backbone cables	Approval
BS EN 50288-5-2 Multi-element metallic cables used in analouge and digital communication and control - Part 5-2: Sectional specification for screened cables characterised up to 250 MHz - Work area and patch cord cables	Approval
BS EN 50288-6-1 Multi-element metallic cables used in analouge and digital communication and control - Part 6-1: Sectional specification for unscreened cables characterised up to 250 MHz - Horizontal and building backbone cables	Approval
BS EN 50288-6-2 Multi-element metallic cables used in analouge and digital communication and control - Part 6-2: Sectional specification for unscreened cables characterised up to 250 MHz - Work area and patch cord cables	Approval
BS EN 50288-7:2005/COR 1 Multi-element metallic cables used in analogue and digital communicatio n and control. Sectional specification for instrumentation and control cables	null
BS EN 50288-9-2 Multi-element metallic cables used in analogue and digital communication and control Part 9-2: Sectional specification for screened cables characterised up to 1 000 MHz - work area and patch cord cables	Idea
BS EN 50289-3-8 Communication cables - Specifications for test methods Part 3-8: Mechanical test methods - Abrasion resistance of cable sheath markings	Public Comment
BS EN 50290-2-23 Communication cables Part 2-23: Common design rules and construction - PE insulation	Public Comment
BS EN 50290-2-25 Communication cables Part 2-25: Common design rules and construction - Polypropylene insulation compounds	Public Comment
BS EN 50290-4-1 Ed.2 prEN 50290-4-1 ed.2 : Communication cables Part 4-1: General considerations for the use of cables - Environmental conditions and safety aspects	Approval
BS EN 50290-4-2 Ed.2 prEN 50290-4-2 ed.2 : Communication cables Part 4-2: General considerations for the use of cables - Guide to use	Approval
BS EN 50343 Railway applications - Rolling stock - Rules for installation of cabling	Public Comment
BS EN 50405 Railway applications - Current collection systems - Pantographs, testing methods for contact strips	Idea
BS EN 50407-2 Multi-pair cables used in high bite rate digital access telecommunication networks Part 2:Indoor multi-pair/quad cables for installation in Multi Dwelling Units shaft supporting universal services, xDSL and applications up to 100 MBits over IP	Public Comment
BS EN 50449 Electromagnetic devices and components - General specification	Approval
BS EN 50502 Railway applications - Rolling stock - Electric equipment in trolley buses - Safety requirements and connection systems	Idea
BS EN 50530:2010/A1 Overall efficiency of grid connected photovoltaic inverters	Publication
BS EN 50547:2013/Cor1 Railway applications - Batteries for auxiliary power supply systems	Publication
BS EN 50583 Photovoltaics in buildings	Public Comment
BS EN 50599 Balanced communication cabling in accordance with EN 50173-4 screened straight patch cords and straight work area cords for class D applications ? detail specification	Approval
BS EN 50601 Balanced communication cabling in accordance with EN 50173-4 unscreened straight patch cords and straight work area cords for class D applications ? detail specification	Approval
BS EN 50602 Balanced communication cabling in accordance with EN 50173-4 unscreened straight patch cords and straight work area cords for class E applications ? detail specification	Approval
BS EN 50603 Balanced communication cabling in accordance with EN 50173-4 screened straight patch cords and straight work area cords for class E applications ? detail specification	Approval
BS EN 50882-11 Multi-element metalic cables used in analogue and digital communication and control Part 11: Sectional specification for un-screened cables, characterised up to 500 MHz, for horizontal and building backbone wiring	Public Comment
BS EN 60068-2-58 ED.4 Environmental testing - Part 2-58: Tests Td- Test methodds for solderability, resistance to dissolution of metalization and to soldering heat of surface mounting devices (SMD)	Public Comment
BS EN 60068-3-13 Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering	Public Comment
BS EN 60096-0-1 Radio Frequency cables - Part 0-1: Guide to the design of detail specifications - Coaxial cables	Approval
BS EN 60115-2 Fixed resistors for use in electronic equipment. Part 2: Sectional specification: Fixed low-power non-wirewound resistors	Public Comment
BS EN 60115-8-1 Fixed resistors for use in electronic equipment Part 8-1: Blank detail specification - Fixed chip resistors. Assessment level E	Public Comment
BS EN 60191-2+A19 Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved.	Public Comment
BS EN 60191-2/F67 Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.	Public Comment
BS EN 60191-2/F68 Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.	Public Comment
BS EN 60191-2/F69 Proposed new package outline - flange mount package with flat leads, PSFM- F8 - To be published as outline 187E, if approved.	Public Comment
BS EN 60191-4: MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of package outlines for semiconductor device packages	Public Comment
BS EN 60191-6-1 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductir device packages - Design guide for gull-wing lead terminals	Public Comment
BS EN 60191-6-13 Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)	null
BS EN 60191-6-14 Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)	Accepted
BS EN 60191-6-15 Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages –Measuring methods for package dimensions of small outline packages (SOP)	Accepted
BS EN 60191-6-16 Mechanical standardization of semiconductor devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA	null
BS EN 60191-6-5 General rules for the preparation of outline drawings of surface mounted semiconductor device package--Design guide for fine-pitch ball grid (FBGA)	Publication
BS EN 60194 ED.6 Printed board design, manufacture and assembly - Terms and definitions	Public Comment
BS EN 60286-2 Packaging of components for automatic handling Part 2: Tape packaging of components with unidirectional leads on continuous tapes	Accepted
BS EN 60286-3 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes	Approval
BS EN 60286-4 ED 3.0 Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of form E and G	Approval
BS EN 60297-3-108 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 108: Dimensions of R-type subracks and plug-in units	Accepted
BS EN 60310 ED 4.0 Railway applications - Traction transformers and inductors on board rolling stock	Accepted
BS EN 60352-2+A1 Solderless connections Part 2: Crimped connections - General requirements, test methods and practical guidance	Approval
BS EN 60384-1 Fixed capacitors for use in electronic equipment - Part 1: Generic specification	Accepted
BS EN 60384-14 Fixed capacitors for use in electronic equipment - Part 14: Sectional specification: Fixed capacitors for electromagnetic interference suppression and connection to the supply mains	Approval
BS EN 60384-19 Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene- terephthalate film dielectric surface mount d.c. capacitors	null
BS EN 60384-20 Fixed capacitors for use in electronic equipment Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors	Public Comment
BS EN 60384-23 Fixed capacitors for use in electronic equipment - Part 23: Sectional specification: Fixed surface mount metallized polyethylene naphthalate film dielectric d.c. capacitors	null
BS EN 60384-24 Fixed capacitors for use in electronic equipment Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte	Public Comment
BS EN 60384-25 Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte	Public Comment
BS EN 60384-8 Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1	Accepted
BS EN 60384-9 Fixed capacitors for use in electronic equipment - Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2	Accepted
BS EN 60512-1-101 Connectors for electronic equipment - Basic testing and measurements Part 1-101x: Blank detail specification	Accepted
BS EN 60512-17-5 Connectors for electronic equipment - Tests and measurements - Part 17-5: Cable clamping tests - Test 17X: Cable clamp resistance to dynamic cable	null
BS EN 60512-29-100 ED 1.0 Connectors for electronic equipment - Tests and measurements Part 29-100: Signal integrity tests up to 500 MHz on M12 style connectors - Tests 29a to 29g	Accepted
BS EN 60747-14-6 ED 1.0 Semiconductor devices Part 14-6: Semiconductor sensors - Humidity sensor	Idea
BS EN 60747-14-7 ED 1.0 Semiconductor devices Part 14-7: Semiconductor sensors - Flow meter	Idea
BS EN 60747-14-8 ED 1.0 Semiconductor devices Part 14-8: Semiconductor sensors - Capacitive degradation sensor of liquid	Idea
BS EN 60747-16-5 Semiconductor devices Part 16-5: Microwave integrated circuits - Oscillators	Approval
BS EN 60747-3 Semiconductor devices Part 3: Signal (including switching diodes) and regulator diodes	Approval
BS EN 60747-5-5+A1 Semiconductor devices - Discrete devices Part 5-5: Optoelectronic devices – Photocouplers	Public Comment
BS EN 60747-5-6 Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes	Accepted
BS EN 60747-5-7 Semiconductor devices - Discrete devices - Part 5-7: Photodiodes and phototransistors	Accepted
BS EN 60747-6 Ed 3.0 Semiconductor devices - Discrete devices Part 6 : Thyristors	Accepted
BS EN 60747-6 Semiconductor devices - Discrete devices Part 6 : Thyristors	null
BS EN 60749-26 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)	Approval
BS EN 60749-28 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Charged Device Model (CDM)	Public Comment
BS EN 60749-42 Semiconductor devices - mechanical and climatic test methods Part 42: Temperature humidity storage	Public Comment
BS EN 60749-43 Semiconductor devices - mechanical and climatic test methods Part 43: Guidelines for LSI reliability qualification plans	null
BS EN 60825-1 Safety of laser products - Part 1: Equipment classification and requirements	Public Comment
BS EN 60825-12 ED.2 Safety of laser products Part 12: Safety of free space optical communication systems used for transmission of information	Accepted
BS EN 60825-14 ED.2 Safety of laser products Part 14: A user's guide	Accepted
BS EN 60825-17 ED.2 Safety aspects for use of passive optical components and optical cables in high power optical fibre communication systems	Accepted
BS EN 60848 GRAFCET specification language for sequential function charts	Publication
BS EN 60904-8 ED 3.0 Photovoltaic devices Part 8: Measurement of spectral response of a photovoltaic (PV) device	Public Comment
BS EN 60939-3 Passive filter units for electromagnetic interference suppression Part 3: Standard for passive filter units for which safety tests are appropriate	Accepted
BS EN 60940 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class1	Accepted
BS EN 60966-2-7 ED.1 Radio frequency and coaxial cable assemblies Part 2-7: Detail specification for cable assemblies for radio and TV recievers - Frequency range 0 MHz to 3000 MHz, IEC 61169-47 connectors	Accepted
BS EN 61045-1 Fixed film resistor networks for use in electronic equipment - Part 1 : Generic specification	Public Comment
BS EN 61076-2-104 ED 2.0 Connectors for electronic equipment - Product requirements Part 2-104:Circular connectors - Detail specification for circular connectors with M8 screw-locking or snap-locking	Accepted
BS EN 61076-2-109 Connectors for electronic equipment - Product requirements Part 2-109: Circular connectors - Detail specification for connectors M 12 x 1 with screw-locking, for data transmissions with frequencies up to 500 mhz	Public Comment
BS EN 61076-2-111 Connectors for electronics equipment Part 2-111: Circular connectors - Detail specification for plug and jack for 2 mm barrel-type battery charging interface	null
BS EN 61076-2-112 Connectors for electronic equipment Part 2-112: Product requirements - Circular connectors, Detail specification for M12 power connectors up to12 Amps with screw-locking	null
BS EN 61076-3-104 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 2 000 MHz	null
BS EN 61076-3-104 Ed 3.0 Connectors for electronic equipment - Product requirements Part 3-104: Detail specification for 8-way; shielded free and fixed connectors for data transmissions with frequencies up to 1000 MHz	Accepted
BS EN 61076-4-116+A1 equipment - Product requirements Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function	Accepted
BS EN 61082-1 Preparation of documents used in electrotechnology - Part 1: Rules	Accepted
BS EN 61169-26 Radio-frequency connectors - Part 26: Sectional specification for TNCA series RF coaxial connectors	Approval
BS EN 61169-4 Radio-frequency connectors - Part 4: RF coaxial connectors with inner diameter of outer conductor 16 mm (0.63 in) with screw lock - Characteristic impedance 50 ? (Type 7-16)	Approval
BS EN 61169-42 Radio-frequency connectors - Part 42: Sectional specification for CQN series quick lock RF coaxial connectors	Approval
BS EN 61169-43 ED 1.0 Radio-frequency connectors Part 43: Sectional specification for RBMA Series Blind amting RF coaxil connectors	Approval
BS EN 61169-44 ED.1 Radio-frequency connectors - Part 44: Sectional specification for SMP series RF coaxial connectors	Approval
BS EN 61169-48 Ed.1 Radio-frequency connectors - Part 48: Sectional specification for BMP Series Blind mating R.F. coaxial connectors	Public Comment
BS EN 61169-49 Ed 1.0 Radio-frequency connectors - Part 49: Sectional specification for SMAA series R.F connectors	Public Comment
BS EN 61169-51 Ed.1 Radio-frequency connectors - Part 51: Sectional specifications RF coaxial connectors with inner diameter of outer conductors 13.5 mm with bayonet lock characteristics impedamce 50 Ohm (type QLI)	Public Comment
BS EN 61175 Industrial systems, installations and equipment and industrial products - Designation of signals	Accepted
BS EN 61188-8 ED 1.0 Componenet shape data specification for CAD library - Part 8-1: Generic descriptions of the 2D and 3D description	Accepted
BS EN 61189-11 ED.1 Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys	Approval
BS EN 61189-3-913 ED.1 Test methods for electronic circuit board for high-brightness LEDs	Public Comment
BS EN 61189-5-2 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux	Public Comment
BS EN 61189-5-3 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste	Public Comment
BS EN 61189-5-4 Ed.1 Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed abd non-fluxed solid wire	Public Comment
BS EN 61190-1-2 AM1 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality intercomnnects in electronics assembly	Public Comment
BS EN 61191-1 ED 2.0 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies	Approval
BS EN 61191-2 ED 2.0 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies	Approval
BS EN 61193-3 QUality assessment systems - Part 3: Selection and use of sampling palns for printed board and laminate end-product and in-process auditing	Approval
BS EN 61196-1-119 Coaxial communication cables Part 1-119: RF Power Rating	Idea
BS EN 61196-10 Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polyterafluoroethylene (PTFE) dielectric	Public Comment
BS EN 61196-10-1 Coaxial Communication Cables Part 10-1: Blank detail specification for semi-rigid cables with polytetrafluoroethylene (PTFE) dielectric	Accepted
BS EN 61196-9 ED.1 Coaxial Communication Cables Part 9: Sectional specification for flexible RF Coaxial cables	Public Comment
BS EN 61215 Crystalline silicon terrestrial photovoltaic (PV) modules - Design qualification and type approval	Accepted
BS EN 61249-3-1, ED.1 Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad lamintes for flexible baords (adhesive and non- adhesive tpes)	Idea
BS EN 61249-4-18 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepeg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepeg of defind flammability (vertical burning test) for lead- free assembly	Approval
BS EN 61249-4-19 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepeg materials, unclad (for the manufacture of multilayer boards) - High performance non- halogenated epoxide woven of defind flammability (vertical burning test) for lead-free assembly	Approval
BS EN 61360-5 Ed 2.0 Standard data element types with associated classification scheme for electric components - Part 5: Extensions to the EXPRESS dictionary schema	Idea
BS EN 61360-6 Quality guide for IEC 61360 compliant database content	null
BS EN 61587-3 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 Part 3: Electromagnetic shielding performance tests for cabinets and subracks	Publication
BS EN 61587-5 Mechanical structures for electronic equipment - Tests for IEC 60917 and and IEC 60297 Part 5: Seismic tests for chassis, subracks, and associated plug-in unit	Public Comment
BS EN 61726 ED.2 Cable assemblies, cables, connectors and passive coponents - screening attentuation measurement by the reverberation chamber method	Public Comment
BS EN 61730-1 Ed 2.0 Photovoltaic (PV) module safety qualification Part 1: Requirements for construction	Accepted
BS EN 61730-1:2007/A2 IEC 61730-1/A2 Photovoltaic (PV) module safety qualification Part 1: Requirements for construction	Publication
BS EN 61730-2 ED 2.0 Photovoltaic (PV) module safety qualification Part 2: Requirements for testing	Accepted
BS EN 61747-1-1 Liquid crystal display devices Part 1-1: Generic - Generic specification	Accepted
BS EN 61747-1-2 Liquid crystal display devices Part 1-2: Terminology and letter symbols	Accepted
BS EN 61747-10-1 Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical	Public Comment
BS EN 61747-10-2 Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance	Accepted
BS EN 61747-2 Ed 2.0 Liquid crystal display devices Part 2: Liquid crystal display modules - Sectional specification	Accepted
BS EN 61747-2 Liquid crystal display devices Part 2: Liquid crystal display modules – Sectional specification	null
BS EN 61747-2-1 Liquid crystal display devices Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification	Public Comment
BS EN 61747-2-2 Ed 2.0 Liquid crystal display devices Part 2-2: Matrix colour LCD modules - Blank detail specification	Accepted
BS EN 61747-2-2 Liquid crystal display devices Part 2-2: Matrix colour LCD modules - Blank detail specification	null
BS EN 61747-20-1 Liquid crystal display devices Part 20-1: Visual inspection - Monochrome liquid crystal display cells	Accepted
BS EN 61747-20-2 Ed 1.0 Liquid crystal display devices Part 20-2: Visual inspection - Monochrome matrix liquid crystal display modules	Accepted
BS EN 61747-3 Liquid crystal display devices Part 3: Liquid crystal display (LCD) cells - Sectional specification	Accepted
BS EN 61747-4-1 Ed 2.0 Liquid crystal display devices Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics	Accepted
BS EN 61747-4-1 Liquid crystal display devices Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics	null
BS EN 61747-40-1 Liquid crystal display devices Part 40-1: Mechanical testing guidelines for display cover glass for mobile devices	Approval
BS EN 61747-5-4 ED.1 Liquid crystal display devices Part 5-4: Environmental, endurance and mechanicaltest methods - Mechanical testing guidelines for display cover glass for display cover glass for mobile devices	null
BS EN 61747-6-2:2011/COR1 Liquid crystal display devices - Part 6-2: Measuring methods for liquid crystal display modules - Reflective type	Publication
BS EN 61760-4 ED 1.0 Classification, Packaging,Labelling and handling of moisture sensitive devices	Accepted
BS EN 61829 Crystalline silicon photovoltaic (pv) array – On-site measurement of i-vcharacteristics	Public Comment
BS EN 61837-2:2011+A1 Surface mounted piezoelectric devices for frequency control and and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures Amendment 1	null
BS EN 61853-2 ED 1.0 Photovoltaic (PV) module performance testing and energy rating Part 2: Spectral response, incidence angle and module operating temperature measurements	Public Comment
BS EN 61881-3/ AMD 1 Railway application – Rolling stock equipment – Capacitors for Power electronic Part 3: Electric double-layer capacitors	Public Comment
BS EN 61935-1 Ed.4 TESTING OF BALANCED COMMUNICATION CABLING IN ACCORDANCE WITH ISO/IEC 11801 Part 1: Installed cabling	Public Comment
BS EN 61935-2-21 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-21: Cord and work area cord category 6- Blank detail specification	Public Comment
BS EN 61935-2-22 Ed.1 Generic cabling systems — Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-22: Cord and work area cord category 6A- Blank detail specification	Public Comment
BS EN 61935-2-23 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-23: Cord and work area cord category 7- Blank detail specification	Public Comment
BS EN 61935-2-24 Ed.1 Specification for the testing of balanced communication cabling in accordance with ISO/IEC 11801 Part 2-24: Cord and work area cord category 7A- Blank detail specification	Public Comment
BS EN 61988-2-6 Plasma display panels Part 2-6: Measuring methods - APL dependent gamma and colour characteristics	Accepted
BS EN 61988-4-2 Plasma Display Panels Part 4-2: Panel strength measuring methods	Approval
BS EN 62047-11 Semiconductor devices - Micro-electromechanical devices Part 11: Test method for linear thermal expansion coefficients of MEMS materials	Approval
BS EN 62047-15 Semiconductor devices - Micro - electromechanical devices - Part 14: Forming limit measuring method of metallic film materials	Accepted
BS EN 62047-16 ED 1.0 Semiconductor devices – Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods	Accepted
BS EN 62047-17 Semiconductor devices – Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films	Accepted
BS EN 62047-18 Semiconductor devices – Micro-electromechanical devices Part 18: Microelectro mechanical devises - Bending test methods of thin film materials	Approval
BS EN 62047-19 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compasses	Approval
BS EN 62047-20 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes	Accepted
BS EN 62047-21 Semiconductor devices – Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials	Public Comment
BS EN 62047-22 Semiconductor devices – Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates	Public Comment
BS EN 62116 ED 2.0 Test procedure of islanding prevention measures for utility-interconnected photovoltaic inverters	Public Comment
BS EN 62132-1 Integrated circuits - Measurement of electromagnetic immunity Part 1: General conditions and definitions	null
BS EN 62132-6 Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method	null
BS EN 62137-4 Ed.1 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices	Public Comment
BS EN 62137-4 Review report on IEC 62137-4 Ed.1: Electronics assembly technology Part 4: Environmental and endurance test methods for solder joint of area array type package surface mount devices	Accepted
BS EN 62153-4-1 Ed.3 Metallic communication cable test methods Part 4-1: Introduction to Electromagnetic (EMC) Test Methods	Public Comment
BS EN 62153-4-15 Ed.1 Metallic Communication Cable test methods Part 4-15: Electromagnetic compatibility (EMC) – Test method for measuring transfer impedance and screening attenuation – or coupling attenuation with Triaxial Cell	Public Comment
BS EN 62153-4-3 ED.2 Metalic communication cable test methods Part 4-3: Electromagnetic compatability (EMC) - Surface tarnsfer impedance - Triaxial method	Public Comment
BS EN 62153-4-7 Ed.2 Metallic Communication Cable test methods Part 4-7: Electromagnetic compatibility (EMC) - Shielded screening attenuation test method for measuring the Transfer impedance Zt and the screening attenuation aS or the Coupling attenuation aC of RF-Connectors and assemblies up to and above 3 GHz; Tube in Tube method	Public Comment
BS EN 62215-3 ED 1.0 Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method	Public Comment
BS EN 62326-15 Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active device, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and dicrete packages.	Public Comment
BS EN 62326-18 Ed.1 Printed boards Part 18: Standard on Device Embeded Substrate - Test methods	Idea
BS EN 62326-20 ED.1 Electronic circuit board for high-brightness LEDs Printed boards	Idea
BS EN 62341-1-2 Organic light emitting diode displays Part 1-2: Terminology and letter symbols	Accepted
BS EN 62341-5-2 Organic Light Emitting Diode (OLED) Displays Part 5-2: Mechanical endurance test methods	Approval
BS EN 62341-5-3 ED 1.0 Organic light emitting diode (OLED) displays Part 5-3: Measuring methods of image sticking and lifetime	Approval
BS EN 62362/ED.1 Product description standard for printed board, printed board assembly, and testing in XML schema	null
BS EN 62391-1 Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specification	Public Comment
BS EN 62435 ED 1.0 Long-term storage of electronic semiconductor devices	Idea
BS EN 62446 Ed 2.0 Grid connected PV systems - Minimum requirements for system documentation; commissioning tests and inspection	Accepted
BS EN 62446 Ed2 Grid connected PV systems - Minimum requirements for system documentation, commissioning tests and inspection	null
BS EN 62449 Connectors for electronic equipment – Product requirements – Detail specification for SCA-2 (Single Connector Attach -2) unshielded connectors	Public Comment
BS EN 62451 HSSDC-2 Shielded Connectors	Accepted
BS EN 62468 ED. 1.0 The marking for presence and absence of the specified chemical substancein materials, components and mounted boards in electrical and electronicequipment	Approval
BS EN 62483 Environmental acceptance requirements for tin whisker susceptibility tin and tin alloy surface finishes	null
BS EN 62588 ED.1 Marking and labeling components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes	Public Comment
BS EN 62595-1-1 ED 1.0 LCD Backlight unit Part 1-1: Generic specification	Public Comment
BS EN 62610-4 ED 1.0 Mechanical structures for electronic equipment-Thermal management Part 4:Cooling performance tests for water supplied heat exchangers in electron cabinets	Approval
BS EN 62629-1-2 3D display devices - Part 1-2: Terminology and letter symbols	Approval
BS EN 62629-12-1 3D display devices- Part 12-1: Measuring methods for Stereoscopic displays using glasses - Optical	Public Comment
BS EN 62629-22-1 3D display devices Part 22-1: Measuring methods for Autostereoscopic displays - Optical	Approval
BS EN 62629-6-2 3D display devices - Part 6-2: Optical measuring methods for stereoscopic displays using glasses	null
BS EN 62656-1 Standardized product ontology register and transfer by spreadsheets - Part 1:Logical structure for data parcels	Public Comment
BS EN 62656-3 Standardized product ontology register and transfer by spreadsheets - Part 3:Interface for Common Information Model	Public Comment
BS EN 62670-1 ED 1.0 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 1: Performance measurements and power rating - Irradiance and tempe rature	Public Comment
BS EN 62679-1 Electronic Paper Display Part 1:Terminology and generic specification	Public Comment
BS EN 62679-3-1 Electronic paper display Part 3-1: Measuring methods - Optical	Accepted
BS EN 62688-1 ED 1.0 Concentrator photovoltaic (CPV) module and assembly safety qualification	Accepted
BS EN 62699 ED 1.0 Mapping Rules and Exchange Methods for Heterogeneous Part Libraries	Public Comment
BS EN 62715-1-1 Flexible display devices - Part 1-1: Terminology and letter symbols	Public Comment
BS EN 62715-6-1 Flexible display devices Part 6-1: Mechanical stress test methods	Public Comment
BS EN 62739-1 Test method for erosion of wave solering equipment by molten lead free solder alloy Part 1: Erosion test method for the metalic material without surface treatment	Approval
BS EN 62744 Dynamic representation of Graphical symbols	Public Comment
BS EN 62759-1 Transportation testing of photovoltaic (PV) modules Part 1: Transportation and shipping of PV module stacks	Accepted
BS EN 62779-1 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements	Accepted
BS EN 62779-2 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances	Accepted
BS EN 62782 Dynamic mechanical load testing for photovoltaic (PV) modules	Accepted
BS EN 62783-1Ed.1 TWINAX CABLES FOR DIGITAL COMMUNICATIONS - Part 1: GENERIC SPECIFICATION	Public Comment
BS EN 62804 System voltage durability qualification test for crystalline silicon modules	Accepted
BS EN 62810 Ed.1 Cylindrical cavity method to measure the complex permittivity of low-loss dielectric rods	Public Comment
BS EN 62812 Method of measurement of low resistance	null
BS EN 62813 Electrical characteristics test methods of lithium ion capacitors for use in electric and electronic equipment	Accepted
BS EN 62817 Solar trackers for photovoltaic systems - Design qualification	Public Comment
BS EN 772-5 Methods of test for masonry units Part 5: Determination of the active soluble salts content of clay masonry units	Idea
BS EN 846-9 Methods of test for ancillary components for masonry Part 9: Determination of flexural resistance and shear resistance of lintels	Idea
BS EN IEC 60940/A1 AMD 1 Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression	null
BS EN ISO 11267 Soil quality - Inhibition of reproduction of Collembola (Folsomia candida) by soil pollutants (ISO 11267:1999)	Public Comment
BS EN ISO 16387 Soil quality - Effects of pollutants on Enchytraeidae (Enchytraeus sp.) - Determination of effects on reproduction	Approval
BS EN NWIP TEST METHOD 3 Test Method 3 - Temperature humidity storage	null
BS EN TR 60825-15 Safety of laser products - Part 15: Guidance on manufacturing requirements relating to non-laser optical radiation safety	Public Comment
BS EN TS 62789 Specification of concentrator cell description	null
BS EN WI 00230304 Water quality — Performance requirements and conformity test procedures for water monitoring equipment — Part 2: Continuous measuring devices	Idea
BS EN WI 00230305 Water quality — Performance requirements and conformity test procedures for water monitoring equipment — Part 3: Portable measuring devices	Idea
BS ENISO 10710 Water quality - Growth inhibition test with the marine and brackish water macroalga Ceramium tenuicorne	Publication
BS ENISO 11063 Soil quality - Method to directly extract DNA from soil samples	Publication
BS ENISO 11206 Water quality - Determination of dissolved bromate - Method using ionchromatography (IC) and post column reaction (PCR)	Publication
BS ENISO 11269-2 Soil quality - Determination of the effects of pollutants on soil flora Part 2: Effects of contaminated soils on the emergence and early growth of higher plants	Publication
BS ENISO 11272 Soil quality - Determination of dry bulk density (ISO 11272)	Accepted
BS ENISO 11274 Soil quality - Determination of the water-retention characteristic - Laboratory methods (ISO 11274:1998 + C1:2009)	Accepted
BS ENISO 11275 Soil quality - Determination of unsaturated hydraulic conductivity and water-retention characteristic - Wind's evaporation method (ISO 11275)	Accepted
BS ENISO 11276 Soil quality - Determination of pore water pressure - Tensiometer method (ISO 11276)	Accepted
BS ENISO 11461 Soil quality - Determination of soil water content as a volume fraction using coring sleeves - Gravimetric method (ISO 11461)	Accepted
BS ENISO 11508 Soil quality - Determination of particle density (ISO 11508)	Accepted
BS ENISO 14238 Soil quality - Biological methods - Determination of nitrogen mineralization and nitrification in soils and the influence of chemicals on these processes (ISO/DIS 14238)	Accepted
BS ENISO 15009 Soil quality - Gas chromatographic determination of the content of volatile aromatic hydrocarbons, naphthalene and volatile halogenated hydrocarbons - Purge-and-trap method with thermal desorption	Approval
BS ENISO 16198 Soil quality - Plant-based biotest to assess the environmental bioavailability of trace elements to plants	Public Comment
BS ENISO 16558-1 Soil quality - Risk based petroleum hydrocarbons Part 1: Determination of aliphatic and aromatic fractions of volatile petroleum hydrocarbons using gas chromatography (static headspace method)	Public Comment
BS ENISO 16558-2 Soil quality - Risk-based petroleum hydrocarbons Part 2: Determination of aliphatic and aromatic fractions of semi-volatile petroleum hydrocarbons using gas chromatography with flame ionisation detection (GC/FID)	Public Comment
BS ENISO 17184 Soil quality - Determination of carbon and nitrogen by near infrared spectrometry	Public Comment
BS ENISO 17380 Soil quality - Determination of total cyanide and easily liberatable cyanide - Continuous-flow analysis method	Approval
BS ENISO 19250 Water quality - Detection of Salmonella spp.	Approval
BS ENISO 22155 Soil quality - Gas chromatographic determination of volatile aromatic and halogenated hydrocarbons and selected ethers - Static headspace method (ISO 22155:2011)	Publication
BS ENISO 23611-5 Soil quality - Sampling of soil invertebrates Part 5: Sampling and extraction of soil macro-invertebrates	Publication
BS ENISO 23611-6 Soil quality - Sampling of soil invertebrates Part 6: Guidance for the design of sampling programmes with soil invertebrates	Approval
BS ENISO 27108 Water quality - Determination of selected plant treatment agents and biocide products - Method using solid-phase microextraction (SPME) followed by gas chromatography-mass spectrometry (GC-MS)	Approval
BS IEC 60191-2/F65 Proposed new package outline - Plastic Bottom-landed Small Outline Non-lead package (P-BSO-N2/3/4/5/6)	Public Comment
BS IEC 60393-2 Potentiometers for use in electronic equipment. Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometers	Public Comment
BS IEC 60393-5 Potentiometers for use in electronic equipment. Part 5: Sectional specification - Single-turn rotary low-power wirewound and non-wirewound potentiometers	Public Comment
BS IEC 60393-6 Potentiometers for use in electronic equipment. Part 6: Sectional specification - Surface mount preset potentiometers	Public Comment
BS IEC 60494-2 ED 2.0 Railway applications - Rolling stock - Pantographs: Characteristics and tests - Part 2: Pantographs for metros and light rail vehicles	Public Comment
BS IEC 62243 IEEE standard for artificial intelligence exchange and service tie to all test environments (AIESTATE)(IEEE 1232-2010)	Approval
BS IEC 62483 ED 1.0 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes	Public Comment
BS IEC 62670-2 Concentrator photovoltaic (CPV) module and assembly performance testing and energy rating Part 2: Energy rating by measurement	Accepted
BS IEC 62679-3-2 ED 1.0 Electronic paper display Part 3-2 : Measuring methods - Electro-optical	Approval
BS ISO 11074 Soil quality - Vocabulary	Public Comment
BS ISO 11268-3 Soil quality - Effects of pollutants on earthworms Part 3: Guidance on the determination of effects in field situations	Public Comment
BS ISO 11916-1 Soil quality - Determination of selected explosive compounds Part 1: Method using high-performance liquid chromatography (HPLC) with ultraviolet detection	Approval
BS ISO 11916-2 Soil quality - Determination of selected explosive compounds Part 2: Method using gas chromatography with electron capture detection (ECD)or mass spectrometric detection (MS)	Approval
BS ISO 13163-1 Water quality - Measurement of lead 210 activity concentration Part 1: Liquid scintillation counting method	Public Comment
BS ISO 13164-1 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 1: Radon origins and measurement methods	Approval
BS ISO 13164-2 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 2: Direct measurement by gamma spectrometry	Approval
BS ISO 13164-3 Water quality - Measurement of the activity concentration of radon-222 and its short-lived decay products Part 3: Indirect measurement with degassing	Approval
BS ISO 13164-4 Water quality - Measurement of the activity concentration of radon-222 Part 4: Test method using liquid scintillation counting	Accepted
BS ISO 13165-2 Water quality - Measurement of radium 226 activity concentration Part 2: Method using emanometry	Public Comment
BS ISO 13165-3 Water quality - Measurement of radium 226 activity concentration Part 3: Method by coprecipitation and gamma spectrometry	Accepted
BS ISO 13166-1 Water quality - Measurement of uranium activity concentration - Method using alpha spectrometry	Public Comment
BS ISO 13168 Water quality - Simultaneous determination of tritium and carbon 14 activities - Test method using liquid scintillation counting	Accepted
BS ISO 13859 Soil quality - Determination of polycyclic aromatic hydrocarbons (PAH)by gas chromatography (GC) and high performance liquid chromatography (HPLC)	Public Comment
BS ISO 13876 Soil quality — Determination of polychlorinated biphenyls (PCB) by gas c hromatography with mass selective detection (GC-MS) and gas chromatograp hy with electron-capture detection (GC ECD)	Public Comment
BS ISO 13913 Soil quality — Determination of selected phthalates using capillary gas chromatography with mass spectrometric detection (GC/MS)	Public Comment
BS ISO 13914 Soil quality — Determination of dioxins and furans and dioxinlike polych lorinated biphenyls by gas chromatography with high-resolution mass sele ctive detection (HR GC/MS)	Public Comment
BS ISO 14388-1 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 1: Introduction and definitions, symbols and acronyms, sampling and sample preparation	Public Comment
BS ISO 14388-2 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 2: Chromium reducible sulfur (CRS) methodology	Public Comment
BS ISO 14388-3 Soil quality - Acid-base accounting procedure for acid sulfate soils Part 3: Suspension peroxide oxidation combined acidity and sulfur (SPOCAS) methodology	Public Comment
BS ISO 14858 Soil quality - Assessment of bioavailability in terrestrial systems - Use of extracts for the estimation of the transfer of metals	Public Comment
BS ISO 16727 Soil quality - Determination of mercury in aqua regia and nitric acid digests - Cold vapour atomic fluorescence spectrometry (CVAFS)	Accepted
BS ISO 16729 Soil quality - Digestion of nitric acid soluble fractions of elements	Public Comment
BS ISO 16965 Soil quality - Determination of trace elements using inductively coupled plasma mass spectrometry (ICP-MS)	Accepted
BS ISO 17073 Soil quality - Determination of trace elements in aqua regia and nitric acid digests - Graphite furnace atomic absorption spectrometry method (GFAAS)	Accepted
BS ISO 17182 Soil quality - Determination of some selected phenols and chlorophenols - Gas chromatographic method with mass spectrometric detection	Public Comment
BS ISO 17183 Soil quality - Screening soils for alcohol-extracted organic compounds by turbidity analysis	Accepted
BS ISO 17586 Soil quality - Assessment of the bioavailability - Extraction of metals using 0,43 mol/l nitric acid solution	Accepted
BS ISO 17601 Soil quality - Method to quantify the abundance of microbial communities from soil DNA extracts	Accepted
BS ISO 18105 Soil quality - Detection of water soluble chromium(VI) using a test-kit method	Accepted
BS ISO 18187 Soil quality - Quality of solid samples - Solid contact test using the dehydrogenase activity of Arthrobacter globiformis	Accepted
BS ISO 18227 Soil quality - Determination of elemental composition by X-ray fluorescence	Public Comment
BS ISO 18311 Soil quality - Method for testing effects of soil contaminants on the feeding activity of soil dwelling organisms - Bait-lamina test	Accepted
BS ISO 18400-101 Soil quality - Sampling Part 101: Framework for the preparartion and application of a sampling plan	Accepted
BS ISO 18400-102 Soil quality - Sampling Part 102: Selection and application of sampling techniques	Accepted
BS ISO 18400-103 Soil quality - Sampling Part 103: Safety	Accepted
BS ISO 18400-105 Soil quality - Sampling Part 105: Package, transport, storage, preservation	Accepted
BS ISO 18400-106 Soil quality - Sampling Part 106: Quality control and quality assurance	Accepted
BS ISO 18400-107 Soil quality - Sampling Part 107: Recording and reporting	Accepted
BS ISO 18400-201 Soil quality - Sampling Part 201: Pretreatment in the field	Accepted
BS ISO 18504 Soil quality - Guidance on sustainable remediation	Idea
BS ISO 28258 Soil quality - Digital exchange of soil-related data	Approval
BS ISO 29200 Soil quality — Assessment of genotoxic effects on higher plants — Vicia faba micronucleus test	Approval
BS ISO 9696 Water quality - Measurement of gross alpha activity in non-saline water - Thick source method	Public Comment
BS ISO 9697 Water quality - Measurement of gross beta activity in non-saline water - Thick source method	Accepted
BS ISO/IEC 10373-2 Identification cards - Test methods Part 2: Cards with magnetic stripes	Public Comment
BS ISO/IEC 10373-5 Identification cards - Test methods Part 5: Optical memory cards	Accepted
BS ISO/IEC 10373-6:2011/AMD 4 Bits rates higher than fc/16 up to fc/2	Publication
BS ISO/IEC 10373-6:2011/AMD 5 Bit rates of 3fc/4 and fc	Public Comment
BS ISO/IEC 10373-6:2011/AMD 6 Identification cards - Test methods Part 6: Proximity cards - Amendment 6: Alternating between PICC and PCD functionalities	Public Comment
BS ISO/IEC 11694-4 Identification cards - Optical memory cards - Linear recording method Part 4: Logical data structures	Accepted
BS ISO/IEC 11694-5 Identification cards - Optical memory cards - Linear recording method Part 5: Data format for information interchange for applications using ISO/IEC 11694-4, Annex B	Public Comment
BS ISO/IEC 11694-6 Identification cards - Optical memory cards - Linear recording method Part 6: Use of biometrics on an optical memory card	Public Comment
BS ISO/IEC 11695-4 Identification cards - Optical memory cards - Holographic recording me method Part 4: Logical data structures	Public Comment
BS ISO/IEC 14443-2:2010/AMD 5 Bits rates of 3fc/4 and fc	Public Comment
BS ISO/IEC 14443-2:2010/Amd 6 Identification cards - Contactless integrated circuit cards - Proximity cards Part 2: Radio frequency power and signal interface - Amendment 6: PICC's with external power supply	Accepted
BS ISO/IEC 14443-3:2001/AMD 5 Activation of higher layer protocols	Accepted
BS ISO/IEC 14443-3:2011/AMD 3 Identification cards - Contactless integrated circuit cards - Proximity cards Part 3: Initialization and anticollision - Amendment 3: Alternating support of PICC and PCD roles	Public Comment
BS ISO/IEC 14443-3:2011/AMD 6 Bit rates of 3fc/4 and fc	Public Comment
BS ISO/IEC 14443-4:2008/AMD 3 Bit rates of 3fc/4 and fc	Approval
BS ISO/IEC 14443-4:2008/Amd 4 Identification cards - Contactless integrated circuit cards - Proximity cards Part 4: Transmission protocol - Amendment 4: Frame with error correction	Public Comment
BS ISO/IEC 17839 Identification cards - Biometric system on card	Accepted
BS ISO/IEC 17839-2 Information technology - Identification cards - Biometric system on card Part 2: Physical characteristics	Accepted
BS ISO/IEC 17839-3 Information technology - Identification cards - Biometric system on card Part 3: Logical information interchange mechanism	Accepted
BS ISO/IEC 18013-3:2009/AMD 2 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 2: Extended Access Control EAC v1.11	Accepted
BS ISO/IEC 18013-3:2009/Amd 3 Information technology - Personal identification - ISO-compliant driving licence Part 3: Access control, authentication and integrity validation - Amendment 3: PACE	Accepted
BS ISO/IEC 18328 Input Devices on ICC and enhancements of electronic Displays	Idea
BS ISO/IEC 18745-1 Test methods for machine readable travel documents (MRTD) Part 1: Physical Test Methods for Passport Books (durability)	Public Comment
BS ISO/IEC 18745-2 Test methods for machine readable travel documents (MRTD) Part 2: Test methods for the contactless interface	Accepted
BS ISO/IEC 18745-3 Test methods for machine readable travel documents (MRTD) Part 3: LDS and security protocols	Accepted
BS ISO/IEC 24727-1 Identification cards - Integrated circuit card programming interfaces Part 1: Architecture	Public Comment
BS ISO/IEC 24727-2:2008/AMD 1 Enhanced discovery mechanism to identify DER or XER encoding of SAL	Public Comment
BS ISO/IEC 24727-3:2008/AMD 1 Identification cards - Integrated circuit card programming interfaces - Part 3: Application interface - Amendment 1: Use of the 7816-15-based Registry and XML representation	Public Comment
BS ISO/IEC 24727-4:2008/AMD 1 Identification cards - Integrated circuit card programming interfaces - Part 4: Application programming interface (API) administration - Amendment 1: XML representation	Public Comment
BS ISO/IEC 25185-1 Identification cards - Integrated circuit card authentication protocols Part 1: Protocol for Lightweight Authentication of Identity	Public Comment
BS ISO/IEC 7811-1 Identification cards - Recording technique Part 1: Embossing	Public Comment
BS ISO/IEC 7811-2 Identification cards - Recording technique Part 2: Magnetic stripe	Public Comment
BS ISO/IEC 7811-6 Identification cards - Recording technique Part 6: Magnetic stripe - High coercivity	Public Comment
BS ISO/IEC 7811-7 Identification cards - Recording technique Part 7: Magnetic stripe - High coercivity, high density	Public Comment
BS ISO/IEC 7811-8 Identification cards - Recording technique Part 8: Magnetic stripe - Coercivity of 51,7 kA/m (650 Oe)	Public Comment
BS ISO/IEC 7811-9 Identification cards - Recording technique Part 9: Tactile identifier mark	Accepted
BS ISO/IEC 7812-1 Identification cards - Identification of issuers Part 1: Numbering system	Approval
BS ISO/IEC 7812-2 Identification cards - Identification of issuers Part 2: Application and registration procedures	Approval
BS ISO/IEC 7816-13:2007/COR 1D COR 1 Identification cards - Integrated circuit cards Part 13: Commands for application management in a multi-application environment	Accepted
BS ISO/IEC 8484 Information technology - Magnetic stripes on savingsbooks	Accepted
BS ISO/IEC I 18584 Test Methods for ISO/IEC 24787 based Applications	Idea
BS ISO/IEC/TR 30117 Information Technology - Guide to on-card biometric comparison standards and applications	Public Comment
BSEN 61169-1 Radio Frequency Connectors Part 1: Generic specification - General requirements and measuring methods	Approval
BSEN62145 ED 1.0 Crystalline silicon terrrestrial photovoltaic (PV) modules - Blank detail specification	Accepted
BSEN62326-3 ED 1.0 PRINTED BOARDS Part 3: Safety Certification of Rigid Printed Circuit Boards for Electronic Assemblies	Public Comment
BSIEC61926-2 ED 1.0 Standard Test Languages - Part 2: Test Language for All Systems Requirements	null
DD IEC/TS 61967-3 Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan method	Accepted
PD BS EN 62716 Ammonia corrosion testing of photovoltaic (PV) modules	Approval
PD CEN/TS 15480-3 Identification card systems - European Citizen Card Part 3: European Citizen Card Interoperability using an application interface	Accepted
PD CEN/TS 15480-5 Identification card systems - European Citizen Card Part 5: General Introduction	Publication
PD CEN/TS 16634 Recommendations for using biometrics in European automated border crossing	Accepted
PD CEN/TS 419241 Security Requirements for Trustworthy Systems supporting Server Signing Part 5: Server Signing	Accepted
PD CLC/TR 62258-4 Semiconductor die products - Part 4: Questionnaire for die users and suppliers	Publication
PD EN 62548 Design requirements for photovoltaic (PV) arrays	Approval
PD IEC TS 61910 ED1 Interoperability Verilog and VHDL (Technical report)	null
PD IEC/PAS 61169-42 Radio-frequency connectors - Part 42: Sectional specification for CQN series quick lock RF coaxial connectors	Approval
PD IEC/PAS 62515 Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems - Maintenance of project 62515 including development of IEC/TS 62515	null
PD IEC/TR 6082-5-16 ED 1.0 Safety of intense light source equipment - Guidelines for the use of intense light sourse equipment on humans and animals	Idea
PD IEC/TR 60825-16 ED.1 Safety of intense light source equipment - Part 16: Guidelines for the safe use of intense light source equipment on humans and animals	Idea
PD IEC/TR 61156-1-5 Ed 1.0 Multicore and symmetrical pair/quad cables for digital communications Part 1-5: Correction procedures for the measurement results of return loss and input impedance	Approval
PD IEC/TR 61156-1-5 Multicore and symmetrical pair/quad cables for digital communications Part 1-5: Correction procedures for the measurement results of return loss and input impedance	Idea
PD IEC/TR 62839-1 Ed.1 Environmental declaration Part 1: wires and cables and accessories products specific rules	Idea
PD IEC/TS 62132-9 Integrated circuits, measurement of electromagnetic immunity Part 9: Measurement of radiated immunity - Surface scan method	null
PD IEC/TS 62326-16 Ed.1 Printed boards Part 16: Device Enbedded Subctrate Technology - Generics	Idea
PD IEC/TS 62326-17 Ed.1 Printed boards Part 17: Device enbedded substrates - TEG (test element group)	Idea
PD IEC/TS 62326-19 Ed.1 Printed boards Part 19: Device Embedded Substrate - Design Guide	Accepted
PD IEC/TS 62326-7-1 Printed boards - Part 7-1: Performance guide for single-and double-sided flexible peinted boards	Accepted
PD IEC/TS 62450 Technical Specification for 40 pin SCA 2 connector with parallel selection	Public Comment
PD IEC/TS 62452 Testing and performance requirements for high speed serial and parallel- serial copper links	Accepted
PD IEC/TS 62656-2 Standardized product ontology register and transfer by spread sheets - Part 2: Implementation guide for parcel interchange with IEC CDD	Publication
PD IEC/TS 62720 Identification of units of measurement for computer based processing	Publication
PD IEC/TS 62789 Ed 1.0 Specification of concentrator cell description	Accepted
PD IECTS61907 ED 1.0 Technical Report on System Verilog	null
PD ISO/IEC/TR 18268 Identification cards - Contactless integrated circuit cards - Proximity cards - Multiple PICCs in a single PCD field	Accepted

[ back to top ]

Published standards (135)

Sort by: Reference | Title | Status

Standard reference	Name	Status
BS IEC 62265:2005	Advanced library format (ALF) describing integrated circuit (IC) technology, cells and blocks	Withdrawn
BS EN 61523-1:2002	Delay and power calculation standards - Integrated circuit delay and power calculation systems	Current
BS EN 61523-2:2002	Delay and power calculation standards - Pre-layout delay calculation specification for CMOS ASIC libraries	Current
DD ENV 50218:1996	Description of a parametrized European mini test chip	Withdrawn
DD ENV 50219:1996	Description of the reliability test structures of the European mini test chip	Withdrawn
BS EN 62433-2:2010	EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)	Current
DD IEC/TS 62433-1:2011	EMC IC modelling - General modelling framework	Current
PD IEC/TR 62433-2-1:2010	EMC IC modelling - Theory of black box modelling for conducted emission	Current
BS EN 165000-5:1998	Film and hybrid integrated circuits - Procedure for qualification approval	Current
BS EN 165000-4:1996	Film and hybrid integrated circuits - Customer information, product assessment level schedules and blank detail specification	Current
BS EN 165000-3:1996	Film and hybrid integrated circuits - Self-audit checklist and report for film and hybrid integrated circuit manufacturers	Current
BS EN 165000-2:1996	Film and hybrid integrated circuits - Internal visual inspection and special tests	Current
BS EN 165000-1:1996	Film and hybrid integrated circuits - Generic specification. Capability approval procedure	Current
DD ENV 190000-6:1994	Generic specification: monolithic integrated circuits - Procedure for approval and quality management	Current
BS EN 190116:1994	Harmonized system of quality assessment for electronic components. Family specification: AC MOS digital integrated circuits	Current
BS QC 760000:1990	Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification	Current
BS QC 760001:1994	Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Generic specification. Requirements for internal visual inspection	Current
BS CECC 63000:1990	Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits	Obsolescent
BS CECC 90000:1991	Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits	Obsolescent
BS EN 190000:1996	Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits	Current
BS CECC 90000:1985	Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits	Obsolescent
BS CECC 90000:Addendum No. 1:1983	Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits. Internal visual inspection	Obsolescent
BS CECC 90300:1988	Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuits	Current
BS QC 760101:1997	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures	Current
BS QC 760201:1997	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures	Current
BS QC 760100:1991	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film and hybrid integrated circuits: qualification approval	Withdrawn
BS QC 760200:1997	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures	Current
BS QC 760100:1997	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures	Current
BS QC 760200:1992	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval	Withdrawn
BS QC 790101:1992	Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits	Current
BS CECC 00013:1985	Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor dice	Withdrawn
BS CECC 90200:1988	Harmonized system of quality assessment for electronic components: sectional specification: analogue monolithic integrated circuits	Current, Work in Hand
BS EN 190100:1993	Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuits	Current, Work in Hand
BS CECC 63100:1985	Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits	Obsolescent
BS CECC 63200:1985	Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits (capability approval)	Obsolescent
BS ISO/IEC 14443-1:2000	Identification cards. Contactless integrated circuit(s) cards. Proximity cards - Physical characteristics	Withdrawn
DD IEC/TS 62228:2007	Integrated circuits. EMC evaluation of CAN transceivers	Current
BS EN 61943:1999	Integrated circuits. Manufacturing line approval application guideline	Current
BS EN 61967-8:2011	Integrated circuits. Measurement of electromagnetic emissions - Measurement of radiated emissions. IC stripline method	Current
PD IEC/TR 61967-1-1:2010	Integrated circuits. Measurement of electromagnetic emissions - General conditions and definitions. Near-field scan data exchange format	Current
BS EN 61967-4:2002	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 ohm/150 ohm direct coupling method	Current
PD IEC/TR 61967-4-1:2005	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4	Current
BS EN 61967-6:2002+A1:2008	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Magnetic probe method	Current
BS EN 61967-1:2002	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - General conditions and definitions	Current
BS EN 61967-5:2003	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of conducted emissions. Workbench Faraday Cage method	Current
BS EN 61967-2:2005	Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Measurement of radiated emissions. TEM cell and wideband TEM cell method	Current
DD IEC/TS 61967-3:2005	Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz - Measurement of radiated emissions. Surface scan method	Current
BS EN 62132-8:2012	Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. IC stripline method	Current
BS EN 62132-2:2011	Integrated circuits. Measurement of electromagnetic immunity - Measurement of radiated immunity. TEM cell and wideband TEM cell method	Current
BS EN 62132-5:2006	Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Workbench Faraday cage method	Current
BS EN 62132-1:2006	Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - General conditions and definitions	Current, Work in Hand
BS EN 62132-3:2007	Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Bulk current injection (BCI) method	Current
BS EN 62132-4:2006	Integrated circuits. Measurement of electromagnetic immunity. 150 kHz to 1 GHz - Direct RF power injection method	Current
DD IEC/TS 62215-2:2007	Integrated circuits. Measurement of impulse immunity - Synchronous transient injection method	Current
BS EN 61964:1999	Integrated circuits. Memory devices pin configurations	Current
PD 6601:1996	JESSI 0.8 µm CMOS transistor model for analogue and digital circuit simulation	Withdrawn
DD IEC/TS 62404:2007	Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)	Current
PD 6598:1996	Measurement techniques for the characterization of the European mini test chip	Withdrawn
BS IEC 60747-4-1:2000	Microwave diodes and transistors. Microwave field effect transistors. Blank detail specification - BDS for microwave field-effect transistors	Withdrawn
PD IEC/TR 61352:2006	Mnemonics and symbols for integrated circuits	Current
PD 6595:1996	Parameter extraction techniques for the European mini test chip	Withdrawn
BS EN 62090:2003	Product package labels for electronic components using bar code and two-dimensional symbologies	Current
BS 9491:1975	Rules for the preparation of detail specifications for analogue integrated circuits of assessed quality. Full assessment level	Withdrawn
BS 9492:1978	Rules for the preparation of detail specifications for capacitively coupled digital integrated circuits of assessed quality. Full assessment level	Withdrawn
BS 9490:1975	Rules for the preparation of detail specifications for digital integrated circuits of assessed quality. Full assessment level	Withdrawn
BS 9493:1981	Rules for the preparation of detail specifications for integrated circuits of assessed quality which perform mixed digital and/or analogue functions	Withdrawn
BS 9460:1974	Rules for the preparation of detail specifications for integrated circuits of assessed quality: differential operational amplifiers. General application category	Withdrawn
BS 9430:1978	Rules for the preparation of detail specifications for integrated circuits of assessed quality: voltage regulators. Full assessment level	Withdrawn
BS 6493-3:1985	Semiconductor devices - Mechanical and climatic test methods	Withdrawn
BS EN 60747-16-10:2004	Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits	Current
BS EN 60747-16-1:2002+A1:2007	Semiconductor devices - Microwave integrated circuits. Amplifiers	Current
BS IEC 60747-10:1991	Semiconductor devices - Generic specification for discrete devices and integrated circuits	Current
BS IEC 60747-4-2:2000	Semiconductor devices. Discrete devices - Microwave diodes and transistors. Integrated-circuit microwave amplifiers. Blank detail specification	Withdrawn
BS IEC 60748-2:1997	Semiconductor devices. Integrated circuits - Digital integrated circuits	Current
BS 6493-2.3:1987	Semiconductor devices. Integrated circuits - Recommendations for analogue integrated circuits	Current
BS IEC 60748-4:1997	Semiconductor devices. Integrated circuits - Interface integrated circuits	Current
BS IEC 60748-5:1997	Semiconductor devices. Integrated circuits - Semicustom integrated circuits	Current
BS IEC 60748-4-3:2006	Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)	Current
BS IEC 60748-23-5:2003	Semiconductor devices. Integrated circuits - Hybrid integrated circuits and film structures. Manufacturing line certification. Procedure for qualification approval	Current
BS 6493-2.1:1985	Semiconductor devices. Integrated circuits - General	Withdrawn
BS IEC 60748-1:2002	Semiconductor devices. Integrated circuits - General	Current
BS IEC 60748-11:2000	Semiconductor devices. Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits	Current
BS IEC 60748-2-20:2008	Semiconductor devices. Integrated circuits - Digital integrated circuits. Family specification. Low voltage integrated circuits	Current
BS 6493-2-2.2:1986	Semiconductor devices. Integrated circuits - Recommendations for digital integrated circuits	Withdrawn
BS IEC 60748-2-20:2000	Semiconductor devices. Integrated circuits. Digital integrated circuits - Family specification. Low voltage integrated circuits	Withdrawn
BS IEC 60748-2-12:2001	Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)	Current
BS IEC 60748-2-11:1999	Semiconductor devices. Integrated circuits. Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory - Blank detail specification for single supply integrated circuits electrically erasible and programmable read-only memory	Current
BS IEC 60748-23-1:2002	Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Generic specification	Current
BS IEC 60748-23-2:2002	Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Internal visual inspection and special tests	Current
BS IEC 60748-23-3:2002	Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Manufacturers' self-audit checklist and report	Current
BS IEC 60748-23-4:2002	Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification - Blank detail specification	Current
BS CECC 90112:1987	Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write dynamic memories silicon monolithic circuits	Current
BS CECC 90111:1987	Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS read/write static memories silicon monolithic circuits	Current
BS CECC 90113:1987	Specification for harmonized system of quality assessment for electronic components. Blank detail specification. MOS ultra-violet light erasable electrically programmable read only memories silicon monolithic circuits	Current
BS CECC 90115:1994	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital gate array integrated circuits	Current
BS EN 190110:1994	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: digital microprocessor integrated circuits	Current
BS CECC 63101:1985	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits	Obsolescent
BS CECC 63201:1985	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval)	Obsolescent
BS CECC 90105:1987	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fusible link programmable bipolar read only memories, silicon monolithic integrated circuits	Current
BS CECC 90203:1985	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated analogue switching circuits	Current
BS CECC 90301:1985	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated line transmitters and receivers	Current
BS CECC 90114:1990	Specification for harmonized system of quality assessment for electronic components. Blank detail specification: programmable logic arrays (PLA)	Current
BS EN 190106:1994	Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced low power SCHOTTKY digital integrated circuits series 54 ALS, 74 ALS	Current
BS EN 190108:1994	Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced SCHOTTKY digital integrated circuits series 54 AS, 74 AS	Current
BS EN 190107:1994	Specification for harmonized system of quality assessment for electronic components. Family specification. TTL FAST digital integrated circuits series 54 F, 74 F	Current
BS CECC 90104:1981	Specification for harmonized system of quality assessment for electronic components. Family specification: C. Mos digital integrated circuits, series 4000B and 4000UB	Current
BS EN 190109:1994	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCU	Current, Work in Hand
BS EN 190101:1994	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84	Current
BS CECC 90101:1980	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits, series 54, 64, 74, 84	Current
BS CECC 90103:1980	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY circuits, series 54LS, 64LS, 74LS, 84LS	Current
BS EN 190103:1994	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LS	Current
BS EN 190102:1994	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84S	Current
BS CECC 90102:1980	Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84S	Withdrawn
BS QC 790132:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)	Current
BS QC 790131:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Complementary MOS digital integrated circuits (series 4000 B and 4000 UB)	Current
BS QC 760201:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval	Withdrawn
BS QC 760101:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedure	Withdrawn
BS QC 790130:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)	Current
BS QC 790105:1993	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Integrated circuit fusible-link programmable bipolar read-only memories	Current
BS QC 790304:1994	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear analogue-to-digital converters (ADC)	Current
BS QC 790303:1994	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear digital-to-analogue converters (DAC)	Current
BS QC 790110:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Microprocessor integrated circuits.	Current
BS QC 790202:1991	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Monolithic integrated operational amplifiers	Current
BS QC 790111:1993	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification: integrated circuit static read/write memories	Current
BS QC 790107:1995	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. Integrated circuit dynamic read/write memories	Current
BS QC 790106:1995	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Digital integrated circuits. Blank detail specification. MOS ultraviolet light erasable electrically programmable read-only memories	Current
BS QC 790109:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU.	Current
BS QC 790104:1992	Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Family specification. Complementary MOS digital integrated circuits, series 4000 B and 4000 UB	Current
BS 9450:1998	Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test	Obsolescent
BS 9450:1975	Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test	Withdrawn
BS 9400:1970	Specification for integrated electronic circuits and micro-assemblies of assessed quality (qualification approval procedures): generic data and methods of test	Withdrawn
BS 3363:1980	Specification for letter symbols for semiconductor devices and integrated microcircuits	Withdrawn
BS 3363:Supplement No. 1:1981	Specification for letter symbols for semiconductor devices and integrated microcircuits	Withdrawn
BS 3363:Supplement No. 2:1981	Specification for letter symbols for semiconductor devices and integrated microcircuits	Withdrawn
BS IEC 62528:2007	Standard testability method for embedded core-based integrated circuits	Current

[ back to top ]

Committees (16)

Sort by: Reference | Name

Committee Reference	Title
EPL/46	Cables, wires and waveguides, radio frequency connectors and accessories for communication and signalling
EPL/40X	Capacitors and resistors for electronic equipment
IST/17	Cards and personal identification
GEL/93	Design automation
GEL/3	Documentation and graphical symbols
EPL/48	Electromechanical components and mechanical structures for electronic equipment
EPL/501	Electronic assembly technology & Printed Electronics
GEL/999	Error Projects
B/519	Masonry and associated testing
L/-/99	Miscellaneous Standards - Electrical
EPL/76	Optical radiation safety and laser equipment
GEL/82	Photovoltaic Energy Systems
GEL/9/2	Railway Electrotechnical Applications - Rolling stock
EPL/47	Semiconductors
EH/4	Soil quality
EH/3	Water quality

[ back to top ]